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1. 发明专利

JP2005262061A Recycle method of used slurry for polishing semiconductor 有权
标题翻译：用于抛光半导体的回收利用方法
公开(公告)号：JP2005262061A
公开(公告)日：2005-09-29
申请号：JP2004077239
申请日：2004-03-17
申请人： Nomura Micro Sci Co Ltd , 野村マイクロ・サイエンス株式会社
发明人： KOJIMA SENRI , ABE TSUGI , HORI TORU , MAEDA YUSUKE , ISHII KEIICHIRO
IPC分类号： B24B57/02 , B01D61/14 , C02F11/00 , C02F11/12
摘要： PROBLEM TO BE SOLVED: To enable the simplification of recycle operation of used slurry for polishing a semiconductor, and control of deterioration of chelate fibers used for removing metal ions.
SOLUTION: Before the used slurry for polishing a semiconductor is brought in contact with the chelate fiber, decomposition operation of an oxidizing agent, such as hydrogen peroxide, contained in the used slurry is carried out. The decomposition operation of the oxidizing agent is carried out by, for example, an ultraviolet irradiation of the slurry or a contact of the slurry with an oxidizing agent decomposition catalyst.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了简化用于抛光半导体的二手浆料的再循环操作，以及控制用于除去金属离子的螯合纤维的劣化。解决方案：在将用于抛光半导体的二氧化硅浆料与螯合纤维接触之前，进行所用浆料中所含的氧化剂如过氧化氢的分解操作。氧化剂的分解操作通过例如浆料的紫外线照射或浆料与氧化剂分解催化剂的接触来进行。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2012178418A Method and apparatus for collecting polishing agent 审中-公开
标题翻译：收集抛光剂的方法和装置
公开(公告)号：JP2012178418A
公开(公告)日：2012-09-13
申请号：JP2011039948
申请日：2011-02-25
申请人： Nomura Micro Sci Co Ltd , 野村マイクロ・サイエンス株式会社
发明人： ISHII KEIICHIRO , HIOKI MASAJI
IPC分类号： H01L21/304 , B01D61/14 , B01D61/58 , B01D63/02 , B01D63/06 , B01D71/16 , B01D71/26 , B01D71/34 , B01D71/36 , B01D71/64 , B01D71/68 , B24B37/00 , B24B57/00 , C02F1/44
CPC分类号： B24B57/00 , B01D61/18 , B01D63/02 , B01D2317/022 , B24B57/02 , C02F1/444 , C02F2103/346
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for collecting a polishing agent in which a slurry obtained by condensing the polishing agent to a high concentration can be collected while suppressing increase of a pressure loss or considerable reduction of a collection rate caused by clogging a film.SOLUTION: A collection apparatus 1 for polishing agent is configured to collect a polishing agent from a used polishing slurry which is used for a CMP step includes a separating film 41 in which a porous path through which the used polishing slurry is introduced is tubular and a length of an effective filtering portion is 0.8 m or less, and the polishing agent concentration in the used polishing slurry is condensed to a concentration of 10 mass% or more.
摘要翻译：要解决的问题：提供一种用于收集抛光剂的装置和方法，其中可以在抑制压力损失的增加或收集的显着减少的同时收集通过冷凝抛光剂而获得的浆料以高浓度电影堵塞造成的速度。解决方案：用于抛光剂的收集装置1被配置为从用于CMP步骤的用过的抛光浆料中收集抛光剂，包括分离膜41，其中引入使用的抛光浆料的多孔路径是管状，有效过滤部的长度为0.8μm以下，将研磨用浆料中的研磨剂浓缩浓缩至10质量％以上。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2011011289A Method for recovering useful solid component in waste slurry 有权
标题翻译：废弃浆料中回收有用固体成分的方法
公开(公告)号：JP2011011289A
公开(公告)日：2011-01-20
申请号：JP2009157214
申请日：2009-07-01
申请人： Nomura Micro Sci Co Ltd , 野村マイクロ・サイエンス株式会社
发明人： KOJIMA SENRI , ABE TSUGI , ISHII KEIICHIRO
IPC分类号： B24B57/02 , C02F1/42 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a method for recovering a useful solid component in waste slurry that removes a metal component from waste slurry used in a semiconductor polishing process, containing a metal component including a titanium component, and diluted by washing water.SOLUTION: Waste slurry is concentrated and adjusted such that the pH is lower than 7 and the concentration of an oxidizing substance is higher than 100 mg/L. The adjusted waste slurry is repeatedly fed to a strong-acid cation exchanger in order to remove a metal component including Ti.
摘要翻译：要解决的问题：提供一种回收废料浆中有用固体组分的方法，该方法从含有钛组分的金属组分的半导体抛光工艺中使用的废浆中除去金属组分，并用洗涤水稀释。浓缩并调节废浆使pH低于7，氧化物质的浓度高于100mg / L。将经过调整的废浆料重复进料至强酸阳离子交换剂以除去包括Ti的金属组分。

4. 发明专利

JP2010253393A Method of recovering useful solid component in waste slurry 有权
标题翻译：在废料浆中回收有用的固体成分的方法
公开(公告)号：JP2010253393A
公开(公告)日：2010-11-11
申请号：JP2009106759
申请日：2009-04-24
申请人： Nomura Micro Sci Co Ltd , 野村マイクロ・サイエンス株式会社
发明人： ABE TSUGI , KOJIMA SENRI , ISHII KEIICHIRO
IPC分类号： C02F11/00 , C02F11/12
摘要： PROBLEM TO BE SOLVED: To remove unneeded foreign matters from waste slurry which is used in a prescribed treatment process and discharged, contains the unneeded foreign matters and is diluted, and to recover useful solid components in the waste slurry. SOLUTION: The method of recovering the useful solid component in the waste slurry includes: a process of condensing the waste slurry; a process of dissolving the foreign matters by adding a liquid chemical for dissolving the foreign matters to the condensed waste slurry, performing the operation of membrane-filtering dissolved foreign matter components and a part of the liquid chemical and removing the foreign matters; and an ion component removing process of making the waste slurry from which the foreign matters are removed pass through an ion exchanger and/or a chelation apparatus and removing ion components in the waste slurry. The chemical is repeatedly or continuously added and a fresh liquid chemical is brought into contact with the foreign matters at all times. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了从规定的处理过程中使用并排出的废浆中除去不需要的异物，含有不需要的异物并稀释，并回收废浆中有用的固体成分。解决方案：回收废浆中的有用固体组分的方法包括：将废浆冷凝的方法; 通过添加用于将异物溶解的浓缩废液的液体化学品溶解异物，进行膜溶解的异物成分和一部分液态化学品的膜过滤和去除异物的操作; 并且通过离子交换器和/或螯合装置制造除去异物的废浆料的离子成分除去方法，除去废浆料中的离子成分。该化学品被反复或连续添加，并且使新鲜的液体化学品始终与异物接触。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2008145102A Method and device for inspecting foreign matter in semiconductor polishing slurry 有权
标题翻译：用于检查半导体抛光浆料中的外来物质的方法和装置
公开(公告)号：JP2008145102A
公开(公告)日：2008-06-26
申请号：JP2006328804
申请日：2006-12-05
申请人： Nomura Micro Sci Co Ltd , 野村マイクロ・サイエンス株式会社
发明人： ISHII KEIICHIRO , ABE TSUGI , ITO KAORU
IPC分类号： G01N21/94 , G01N1/10 , G01N23/225
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for inspecting foreign matter in a slurry, capable of inspecting the foreign matter such as an impurity particle contained in the semiconductor polishing slurry, and capable of acquiring precisely information about the foreign matter.
SOLUTION: This method of inspecting the foreign matter in the slurry has a sampling process of collecting the semiconductor polishing slurry, a dilution process of diluting the semiconductor polishing slurry collected in the sampling process, using a dispersant extracted from the semiconductor polishing slurry, a filtration process of passing and filtrating the diluted semiconductor polishing slurry, through a filtration membrane having 0.1 nm-100 μm of pore size capable of passing an abrasive grain contained in the semiconductor polishing slurry diluted in the dilution process, and capable of capturing the foreign matter larger than the abrasive grain, and a foreign matter inspection process of inspecting the foreign matter filtration-separated on a surface of the filtration membrane passed therethrough with the diluted semiconductor polishing slurry.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于检查浆料中的异物的方法和装置，其能够检查包含在半导体抛光浆料中的异物如杂质颗粒，并能够准确地获取关于外来物质的信息物。解决方案：这种检查浆料中的异物的方法具有收集半导体抛光浆料的采样过程，使用从半导体抛光浆料中提取的分散剂稀释在取样过程中收集的半导体抛光浆料的稀释过程通过使经过稀释后的半导体研磨浆料中所含的磨粒的0.1nm〜100μm孔径的过滤膜通过和过滤稀释后的半导体研磨浆料的过滤方法，异物大于磨粒，以及异物检查过程，其检查通过稀释的半导体抛光浆料在其上通过的过滤膜的表面上过滤分离的异物。版权所有（C）2008，JPO＆INPIT

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