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    • 1. 发明专利
    • Method for processing an adhesive tape
    • 用于处理胶粘带的方法
    • JP2014028886A
    • 2014-02-13
    • JP2012169620
    • 2012-07-31
    • Nitto Denko Corp日東電工株式会社
    • NONAKA TAKAHIROSUDO SADAJIMORISHITA HIROMITSUKATAMI FUSHI
    • C09J7/00
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing an adhesive tape which does not foul a punch-through blade when the adhesive tape is punched through thereby and does not entail, following the punch-through of the adhesive tape, the blocking of the punched-through site thereof.SOLUTION: The method of the present invention for processing an adhesive tape is a method for processing an adhesive tape including a step of punching through an adhesive tape with a punch-through blade to which a release agent is adhered and has the following characteristics: the release agent includes: hydrocarbons having 4-10 carbon atoms; and an oiliness enhancer; the surface tension of the release agent is 10-50 mN/m, and the time required to volatilization of the release agent is 48 hours or less.
    • 要解决的问题:提供一种制造粘合带的方法,当粘合带穿过该粘合带并且不需要时,在粘合带的穿通之后,不会弄脏穿通刀片,从而阻塞 本发明的加工粘合带的方法是一种胶带的加工方法,其特征在于,该方法包括:通过粘合带冲压穿过剥离剂的穿通刀片的步骤; 具有以下特征:脱模剂包括:具有4-10个碳原子的烃; 和油性增强剂; 脱模剂的表面张力为10〜50mN / m,脱模剂挥发所需时间为48小时以下。