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1. 发明专利

JPH10198937A SUSPENSION FOR MAGNETIC HEAD 失效
公开(公告)号：JPH10198937A
公开(公告)日：1998-07-31
申请号：JP30997
申请日：1997-01-06
申请人： NIPPON MEKTRON KK
发明人： INABA MASAKAZU
IPC分类号： G11B5/60 , G11B21/21
摘要： PROBLEM TO BE SOLVED: To offer a suspension for magnetic head connectable without using load wires, by making flexures and load beams as separate bodies. SOLUTION: This suspension has flexures 2, 2' holding a magnetic head at the tip part, load beams 1, 1' holding the flexures, and mount plats 11, 11' mounting the load beams 1, 1' on an actuator arm 12, and has also connection elements to electrically connect the magnetic head with a substrate of a read/ write amplifier part. In this case, either of the front face and the back face of the load beams 1, 1' are provided with a circuit wiring board 3 as the above connection elements via a flexible insulation layer 6.

2. 发明专利

JPH10198936A SUSPENSION FOR MAGNETIC HEAD 失效
公开(公告)号：JPH10198936A
公开(公告)日：1998-07-31
申请号：JP29697
申请日：1997-01-06
申请人： NIPPON MEKTRON KK
发明人： INABA MASAKAZU
IPC分类号： G11B5/60 , G11B21/21
摘要： PROBLEM TO BE SOLVED: To offer a suspension for magnetic head provided with a mount spacer so that a tip element of the suspension for magnetic head can be connected up to a substrate of a read/write amplifier part without lead wires. SOLUTION: This suspension has a suspension tip element to hold a magnetic head on the tip, the root end is fixed to an actuator arm 11 with a mount spacer 1 and the above-mentioned tip element has a circuit wiring pattern to be connected with the magnetic head. In this case, a mount spacer 1 provided with a circuit wiring pattern 4 formed on a flexible circuit board and a relaying board 9 connected to the circuit wiring pattern 4.

3. 发明专利

JPH07212017A BUMP-PROVIDED CIRCUIT BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JPH07212017A
公开(公告)日：1995-08-11
申请号：JP1489494
申请日：1994-01-13
申请人： NIPPON MEKTRON KK
发明人： INABA MASAKAZU
IPC分类号： H05K3/28 , H05K1/00 , H05K3/24 , H05K3/34 , H05K3/40
摘要： PURPOSE:To secure continuity by abutting and pressure bonding a bump to an electrode to be electrically connected, to use the circuit board as a connection part in an easily removable manner by removing pressure, or to use the circuit board as an inspection terminal for inspection of the electric characteristics of various kinds of circuit elements. CONSTITUTION:A conductive sphere 8 is arranged on a flexible or regid insulating base material 1 or a conductive hole 3 which is formed reaching a circuit wiring pattern 2 on a surface protective layer 6, and the conductive sphere 8 and the circuit wiring pattern 2 are electrically connected by various kinds of solder materials 9. As a result, one end of the conductive sphere 8, which becomes a bump, is electrically connected to the circuit wiring pattern 2, and other end of the conductive sphere 8 is protruding to outside the insulating base material 1 and the surface protective layer 6.

4. 发明专利

JPH06120300A INTERMEDIATE BOARD FOR MOUNTING CIRCUIT COMPONENT AND PRODUCTION THEREOF 失效
公开(公告)号：JPH06120300A
公开(公告)日：1994-04-28
申请号：JP8990191
申请日：1991-03-28
申请人： NIPPON MEKTRON KK
发明人： TANAKA YASUYUKI , INABA MASAKAZU , FUJITA NORIMASA
IPC分类号： H01L21/60 , H05K1/18
摘要： PURPOSE:To produce an intermediate board for mounting circuit component being interposed when a circuit component such as an IC is mounted on a circuit wiring board constituted such that distortion due to differential thermal expansion between the circuit component and circuit wiring board can be absorbed. CONSTITUTION:An insular electrode 11 having a corrosion resistant metal layer 6 is provided on one surface of a dielectric base member 1. A circuit component mounting terminal 9 having one end connected with the insular electrode 11 and the other end connected with a corrosion resistant metal layer 10 projecting through the dielectric base member 1 to the outside constitutes a connecting terminal 12 along with the insular electrode 11. An annular groove 4a is made in the dielectric base member 1 around the connecting terminal 12.

5. 发明专利

JPH0697231A FLEXIBLE CIRCUIT WIRING BOARD FOR MOUNTING CIRCUIT COMPONENT AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0697231A
公开(公告)日：1994-04-08
申请号：JP27099992
申请日：1992-09-14
申请人： NIPPON MEKTRON KK
发明人： INABA MASAKAZU , MIYAGAWA ATSUSHI , IWAYAMA TAKESHI
IPC分类号： H01L21/60 , H01L23/12 , H05K1/00 , H05K3/00 , H05K3/28 , H05K3/34 , H05K3/40
摘要： PURPOSE:To provide the title flexible circuit wiring substrate structure and manufacturing method thereof capable of making alignment easily and sufficiently while stably deciding the level of a solder bump even in the substrate, i.e., capable of combining the auxiliary alignment function with the level alignment function. CONSTITUTION:The title circuit part mounting flexible circuit wiring substrate is composed of a flexible insulating base member 1, a circuit wiring pattern 3 whose one part is formed into a specific electrode part 2 connected thereto to be arranged on one surface of the base member 1, a surface protective layer 4 coating the pattern 3 and the electrode part 2 as well as a hole reaching the electrode part 2 bored in the specific position wherein the electrode part 2 is formed on the flexible insulating base member 1.

6. 发明专利

JPH0511019A CIRCUIT COMPONENT TESTING METHOD AND FLEXIBLE CIRCUIT BOARD THEREFOR 失效
公开(公告)号：JPH0511019A
公开(公告)日：1993-01-19
申请号：JP19063391
申请日：1991-07-04
申请人： NIPPON MEKTRON KK
发明人： INABA MASAKAZU , MIYAGAWA ATSUSHI
IPC分类号： G01R31/02 , G01R31/26
摘要： PURPOSE:To obtain a circuit component testing method which does not require any reformation of a solder bump and a flexible circuit board used for the testing method by electrically connecting a substrate to be tested with circuit components without melting a bump electrode at the time of testing the circuit components equipped with the bump electrode for mounting a flip chip. CONSTITUTION:Circuit components 1 and a flexible circuit board 3 are arranged so that the bump electrode 2 of the components 1 and a lead-out electrode section 6 for eletrodes formed at the peripheral edge section of the circuit board 3 can be respectively brought into contact with a prescribed electrode 4 provided on the circuit board 3 and a connector terminal 8 to be connected to the circuit board 3. The circuit components 1 are tested while each contact section is maintained in a press-contacted state by applying an pressing force to the circuit board 3.

7. 发明专利

JPH04323842A MANUFACTURE OF INTERMEDIATE SUBSTRATE FOR MOUNTING CIRCUIT COMPONENT 失效
公开(公告)号：JPH04323842A
公开(公告)日：1992-11-13
申请号：JP11931091
申请日：1991-04-23
申请人： NIPPON MEKTRON KK
发明人： INABA MASAKAZU , MIYAGAWA ATSUSHI , IWAYAMA TAKESHI
IPC分类号： H01L21/60 , H05K3/00 , H05K3/06 , H05K3/40
摘要： PURPOSE:To offer a manufacturing method of an intermediate substrate for mounting circuit components, which is an intermediate substrate to be arranged at the time of mounting circuit components such as an IC chip between them while being able to form connecting terminals for circuit components of an IC or the like with high density. CONSTITUTION:The respective insulating base materials 2, 3 consisting of light-sensitive insulating resin are applied on both surfaces of a conductive metal layer 1, exposure - developing treatment is performed on both insulating base materials 2, 3 and the conducting holes 4, 4A reaching a conductive metal layer 1 are formed on the aforesaid corresponding parts of both surfaces thereof. Connecting terminals 5, 5A, of which one end is electrically jointed with the conductive metal layer 1 and the other end is projected outside the respective insulating base materials 2, 3, are separately formed to the respective conducting holes 4, 4A. Next, after excimer laser light is irradiated from the side of one side insulating base material 2 so as to expose the conductive metal layer part of a peripheral region of the connecting terminal 5, etching treatment is performed to remove the exposed conductive metal part in order to form an insular electrode 1A.

8. 发明专利

JPH04167498A SHIELD TYPE FLEXIBLE PRINTED-CIRCUIT BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JPH04167498A
公开(公告)日：1992-06-15
申请号：JP29418990
申请日：1990-10-31
申请人： NIPPON MEKTRON KK
发明人： INABA MASAKAZU
IPC分类号： H05K9/00 , H05K1/00 , H05K1/02 , H05K3/00 , H05K3/28
摘要： PURPOSE:To enable impedance matching to be made easily and prevent crosstalk positively by providing a third shield electrode layer which covers a first shield electrode layer, an insulation base, and an insulation layer and which is electrically conducted to a second shield electrode layer. CONSTITUTION:A narrow circuit conductor 13 is provided on one surface of an insulation base 12 and at the same time a wide first shield electrode layer 11 is formed on another surface of the insulation base 12. Then, a lamination plate for constituting a cover film 15 and a second shield electrode layer 16 are joined on a surface where the circuit conductor 13 is formed so that the copper foil surface faces outward through an adhesive layer 14. Then, parts of the insulation base 12, the adhesive layer 14, and the cover film 15 which are positioned between the adjacent first shield electrode layers 11 are eliminated in groove shape properly. Then, a wiring pattern part 10 which consists of the first shield electrode layer 11, the insulation base 12, the adhesive layer 14, and the cover film 15 is coated and at the same time a third shield electrode layer 17 is formed for achieving electrical conduction with the second shield electrode layer 16, thus preventing crosstalk between the adjacent circuit conductors positively.

9. 发明专利

JPH04139783A FLEXIBLE CIRCUIT BOARD FOR IC MOUNTING AND ITS MANUFACTURE 失效
公开(公告)号：JPH04139783A
公开(公告)日：1992-05-13
申请号：JP26113290
申请日：1990-09-29
申请人： NIPPON MEKTRON KK
发明人： INABA MASAKAZU
IPC分类号： H05K9/00 , H05K1/02 , H05K3/00 , H05K3/28 , H05K3/40
摘要： PURPOSE:To prevent crosstalk from occurring by mounting circuit parts like IC's on a flexible circuit board, and forming a shield structure in a coaxial cable type. CONSTITUTION:A wiring pattern composed of a wide insulative substratum 12 and a narrow circuit conductor 13 thereon is formed on the upper surface of a shield electrode layer 11 of one side. The conductor 13 is covered with an insulating layer 14. A wiring pattern 10 on the layer 11 is constituted of the substratum 12 containing the layer 14 and the conductor 13 and covered in the state of close contact, with a shield electrode layer 15 of the other side. A wide aperture 16 is formed in the layer 11, so as to face the conductor 13. The lower surface of the layer 11 of the one side is covered with an insulating layer 17 so as to include the aperture 16. A connection hole 18 which penetrates the insulating layers 12, 17 and reaches the circuit conductor 13 is bored in the aperture 16. A connection terminal 19 is formed in the connection hole 18.

10. 发明专利

JPS63164126A TRANSPARENT TOUCH PANEL SWITCH 失效
公开(公告)号：JPS63164126A
公开(公告)日：1988-07-07
申请号：JP31164786
申请日：1986-12-26
申请人： NIPPON MEKTRON KK
发明人： SEKINE HIROYUKI , INABA MASAKAZU
IPC分类号： G06F3/041 , G06F3/033 , H01H13/76

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