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1. 发明专利

JPH06112275A MANUFACTURE OF CIRCUIT WIRING BOARD PROVIDED WITH TERMINAL FOR MOUNTING CIRCUIT COMPONENT 失效
公开(公告)号：JPH06112275A
公开(公告)日：1994-04-22
申请号：JP28097292
申请日：1992-09-25
申请人： NIPPON MEKTRON KK
发明人： MIYAGAWA ATSUSHI , INABA MASAKAZU , IWAYAMA TAKESHI
IPC分类号： H01L21/60 , H01L23/12 , H05K3/24 , H05K3/28 , H05K3/34 , H05K3/40
摘要： PURPOSE:To provide the manufacturing method of a circuit wiring board provided with a circuit-component mounting terminal whose required positional accuracy is comparatively tolerable. CONSTITUTION:A required circuit wiring pattern 2 is formed at least on one face of an insulating base material 1. A surface protective layer which is provided with a metal mask 4 on one face of an insulating protective layer, which is provided with an adhesive layer 5 on the other face and which is provided with a hole 6 in a required position is applied to, and formed on, the circuit wiring pattern 2. An excimer layer beam A is radiated from the side of the metal mask 4. The adhesive layer 5 which has flowed into the hole 6 is abraded and removed, the metal mask 4 which has become inessential is etched and removed, and a connecting pad or a bump for a circuit component such as an IC or the like having a shape one side of which is bonded electrically to the circuit wiring pattern 2 with reference to the hole 6 and the other end of which protrudes to the outside from the insulating protective layer is formed by filling a conductive metal such as a solder or the like.

2. 发明专利

JPH05190755A FLEXIBLE CIRCUIT WIRING BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH05190755A
公开(公告)日：1993-07-30
申请号：JP2446992
申请日：1992-01-14
申请人： NIPPON MEKTRON KK
发明人： IWAYAMA TAKESHI , MIYAGAWA ATSUSHI , INABA MASAKAZU
IPC分类号： H01L23/50 , H01L21/60 , H01L23/495 , H01L23/538 , H05K1/00 , H05K3/00 , H05K3/28 , H05K3/40 , H05K3/46
摘要： PURPOSE:To provide a flexible circuit wiring board having a structure which is hard to deform even when a circuit wiring conductor protruding to be a finger lead shape is made fine and to provide its manufacturing method. CONSTITUTION:A flexible insulating resin layer whose width is nearly the same as that of a circuit wiring conductor 2A is formed in one part of at least one side of the circuit wiring conductor 2A protruding to be a finger lead shape; an element reinforcement part 6 is formed. A required circuit wiring conductor pattern 2 is formed on one face of an insulating base material 1 in such a flexible circuit board; a surface protective layer 5 in which a cutout part has been formed in a position in which the finger lead-shaped circuit wiring conductor has been formed is applied to the surface of the circuit wiring conductor pattern 2; after that, the side of the insulating base material 1 is irradiated with an excimer laser beam; the part of the insulating base material 1 in a part where the finger lead-shaped circuit wiring conductor 2A is formed is abraded and removed; and the flexible circuit wiring board is manufactured.

3. 发明专利

JPH05102641A PRODUCTION OF FLEXIBLE CIRCUIT BOARD FOR CIRCUIT COMPONENT TEST 失效
公开(公告)号：JPH05102641A
公开(公告)日：1993-04-23
申请号：JP28564591
申请日：1991-10-04
申请人： NIPPON MEKTRON KK
发明人： INABA MASAKAZU , MIYAGAWA ATSUSHI , IWAYAMA TAKESHI
IPC分类号： H05K1/11 , H05K3/00 , H05K3/06 , H05K3/28 , H05K3/40
摘要： PURPOSE:To ensure electric reliability when a conducting hole is formed by ablation on insulating base material and provide the production of circuit compo nent testing flexible circuit board provided with a ring-shaped contact electrode which ensures aligning function and contact stability of a circuit component bump electrode by suppressing the generation and adhesion of carbon product. CONSTITUTION:A metal mask 3 provided with a circuit wiring pattern 2 and a hole 4 is formed on each plane of insulating base material 1, a conducting hole 8 is formed on the insulating base material 1 from the hole 4 of the metal mask 3 so as to reach the necessary part on the circuit wiring pattern 2, then, conductive layers 9 are formed on the bottom and the inner wall plane of the conducting hole 8 and on the metal mask 3. A ring-shaped contact electrode 13 which has the metal mask 3 at a part whose one edge is electrically joined to the circuit wiring pattern 2 through the conductive layer 9 by etching is formed.

4. 发明专利

JPH04323894A CIRCUIT BOARD EQUIPPED WITH TERMINAL FOR LOADING CIRCUIT PARTS AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH04323894A
公开(公告)日：1992-11-13
申请号：JP11931291
申请日：1991-04-23
申请人： NIPPON MEKTRON KK
发明人： INABA MASAKAZU , MIYAGAWA ATSUSHI , IWAYAMA TAKESHI
IPC分类号： H05K3/24 , H01L21/60 , H05K1/18 , H05K3/40
摘要： PURPOSE:To provide a manufacture of a circuit board which has a required circuit wiring pattern and is equipped, on the insulating base material, with such a terminal for loading circuit parts as to be equipped with a pad or a bump for secure connection of the circuit parts, one end of which is electrically coupled with this circuit wiring pattern and the other end of which pierces the above insulating base material and projects to outside. CONSTITUTION:A required circuit wiring pattern 2 is made on one side of an insulating base material 1, and a through hole 10 is so made as to expose one part of the surface of this circuit wiring pattern 2, and a corrosion-resistant conductive metallic layer 6 is made on the surface of the circuit wiring pattern 2 in this through hole 10. Lastly, a pad or a bump 11 for connection of the circuit parts, one end of which is electrically coupled with this circuit wiring pattern 2 through the conductive metallic layer 6 and the other end of which projects out of the insulating base material 1, is made in the through hole 10.

5. 发明专利

JPH04323893A CIRCUIT BOARD EQUIPPED WITH TERMINAL FOR LOADING CIRCUIT PARTS AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH04323893A
公开(公告)日：1992-11-13
申请号：JP11931191
申请日：1991-04-23
申请人： NIPPON MEKTRON KK
发明人： INABA MASAKAZU , MIYAGAWA ATSUSHI , IWAYAMA TAKESHI
IPC分类号： H05K3/24 , H05K3/40
摘要： PURPOSE:To provide a circuit board which has a required circuit wiring pattern and is equipped, on the insulating base material, with such a terminal for loading circuit parts as to be equipped with a pad or a bump for secure connection of the circuit parts, one end of which is electrically coupled with this circuit wiring pattern and the other end of which pierces the above insulating base material and projects to outside, and provide its manufacture. CONSTITUTION:This is a circuit board which has a required circuit wiring pattern 2 and is equipped, on the insulating base material 11, with a pad or a bump for connection of the circuit parts, one end of which is electrically coupled with this circuit wiring pattern 2 and the other end of which pierces the above insulating base material 11 and projects to outside, and this is constituted such that the above circuit wiring pattern 2 has a conductive metallic layer 6 excellent in corrosion resistance at the applicable place where the above pad or bump for connection is made.

6. 发明专利

JPH05110252A FLEXIBLE DOUBLE-SIDED CIRCUIT WIRING BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH05110252A
公开(公告)日：1993-04-30
申请号：JP29992191
申请日：1991-10-19
申请人： NIPPON MEKTRON KK
发明人： INABA MASAKAZU , MIYAGAWA ATSUSHI , IWAYAMA TAKESHI
IPC分类号： H05K1/11 , H05K1/00 , H05K3/28 , H05K3/40
摘要： PURPOSE:To provide a flexible double-sided circuit wiring board capable of forming fine circuit wiring patterns on both surfaces with high density and manufacture thereof by preferably improving the formation density of the circuit wiring patterns shaping mutual continuity sections while solving the trouble of the formation difficulty of the fine circuit wiring patterns due to the increase of the thickness of the circuit wiring patterns by a conventional through-hole plating layer for continuity. CONSTITUTION:A required circuit wiring pattern 2 is formed onto one, surface of a flexible insulating base material 1, a hole 8 for continuity reaching the specified position of the circuit wiring pattern 2 is shaped from the other surface of the flexible insulating base material 1 reverse to a surface, to which the circuit wiring pattern 2 is formed, and another circuit wiring pattern 11 electrically connected to the circuit wiring pattern 2 is formed onto the bottom and inner wall surface of the hole 8 for continuity and the other surface of the flexible insulating base material 1.

7. 发明专利

JP2539287B2 失效
公开(公告)号：JP2539287B2
公开(公告)日：1996-10-02
申请号：JP31558390
申请日：1990-11-20
申请人： NIPPON MEKTRON KK
发明人： INABA MASAKAZU , MYAGAWA ATSUSHI , IWAYAMA TAKESHI
IPC分类号： H01L21/60 , H01L21/321 , H05K3/00 , H05K3/40

8. 发明专利

JPH05206589A FLEXIBLE MULTILAYER CIRCUIT WIRING BOARD 失效
公开(公告)号：JPH05206589A
公开(公告)日：1993-08-13
申请号：JP3448992
申请日：1992-01-24
申请人： NIPPON MEKTRON KK
发明人： INABA MASAKAZU , MIYAGAWA ATSUSHI , IWAYAMA TAKESHI
IPC分类号： H01L21/60 , H01L23/14 , H01L23/495 , H01L23/50 , H01L23/538 , H05K1/00 , H05K1/02 , H05K1/09 , H05K1/11 , H05K3/28 , H05K3/40 , H05K3/46
摘要： PURPOSE:To provide a wiring board where a finger lead-like terminal that is hardly deformed can be provided even if a circuit conductor protruding like a finger lead is formed fine and a bend can be kept excellent in flexibility. CONSTITUTION:A circuit conductor 2, which is used for forming a finger lead- like terminal 3 of conductive material having a high Young's modulus, is provided to one end of a flexible insulating base material 1, a circuit wiring conductor 4, which is formed of conductive metal excellent in flexibility and provided with a bend A, is provided to the other end of the flexible insulating base material 1, and a conductive through-hole 5 is provided to electrically connect the circuit conductor 2 with the circuit wiring conductor 4 together.

9. 发明专利

JPH05102632A FLEXIBLE CIRCUIT BOARD FOR TESTING CIRCUIT PARTS AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH05102632A
公开(公告)日：1993-04-23
申请号：JP28564491
申请日：1991-10-04
申请人： NIPPON MEKTRON KK
发明人： INABA MASAKAZU , MIYAGAWA ATSUSHI , IWAYAMA TAKESHI
IPC分类号： G01R31/28 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/06 , H05K3/28 , H05K3/40
摘要： PURPOSE:To provide a flexible circuit board for circuit parts testing and a method of manufacturing the same comprising ring type contact electrodes which ensures electrical reliability by controlling generation and fitting of carbon product on the occasion of forming a conduction hole on an insulating base material through abbration and by ensuring the positioning function for a bump electrode of circuit parts and stability of contactness. CONSTITUTION:A desired circuit wiring pattern 2 is formed on an insulating base material 1, a surface protection layer 7 is provided on the circuit wiring pattern 2, a conduction hole 89 is provided to the insulating base material 1 so that is reaches the desired area of the circuit wiring pattern 2, a conductive layer is provided to the bottom part, internal wall surface and circumferencial part of such conduction hole 8 and a ring type contact electrode 12 is also provided in such a manner that the one end thereof is electrically coupled with the circuit wiring pattern 2 through the conduction layer. Such ring type contact electrode 12 can also be formed to pass through the circuit wiring pattern 2.

10. 发明专利

JPH04199760A SINGLE-SIDED FLEXIBLE CIRCUIT BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH04199760A
公开(公告)日：1992-07-20
申请号：JP33288290
申请日：1990-11-29
申请人： NIPPON MEKTRON KK
发明人： IWAYAMA TAKESHI
IPC分类号： H05K1/02 , H05K3/00 , H05K3/06
摘要： PURPOSE:To achieve an optimum and high flexibility by forming a insulation base material for forming a circuit wiring pattern to an arbitrary thickness by a photo aberration treatment using an excimer laser. CONSTITUTION:A requied circuit wiring pattern 3 is formed at one conductive foil of a flexible insulation base material 1 and the other conductive foil is used as a metal mask layer 2. A groove hole 2A is formed so that the insulation base material 1 is exposed and photo aberration machining is performed so that a groove hole 1A with a specified depth can be formed at the insulation base material 1 by irradiation with an excimer laser beam A1. When the metal mask layer 2 which is not needed any more is eliminated, an excimer laser beam A2 is uniformly applied over the whole surface from the outer surface of the insulation base material 1 and aberration machining is performed to a depth of the groove hole 1A, thus forming a groove hole 4A for isolation which matches an outer shape of a product at the part of the groove hole 1A and at the same time a machined and this insulation base material 4 whose thickness is reduced. Therefore, a title item can be constituted for enhancing flexibility drastically.

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