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1. 发明专利

JP2014007058A Conductive particle and conductive material including the same 有权
标题翻译：导电颗粒和导电材料，包括它们
公开(公告)号：JP2014007058A
公开(公告)日：2014-01-16
申请号：JP2012141936
申请日：2012-06-25
申请人： Nippon Chem Ind Co Ltd , 日本化学工業株式会社
发明人： OYAMADA MASAAKI , KURITA SATORU
IPC分类号： H01B5/00 , H01B1/00 , H01B1/22
摘要： PROBLEM TO BE SOLVED: To provide a conductive particle having further improved conductivity performance.SOLUTION: The conductive particle has a core particle 1 and a conductive layer formed of a metal film coating the core particle. The core particle is a particle formed by coating the particle surface of a core particle 2 comprising a polyorganosiloxane (a) with silica. It is preferable that the core particle has a ratio of the thickness of the silica-coated layer 3 to the diameter of the core particle comprising the polyorganosiloxane (a) of 0.07 to 1.5.
摘要翻译：要解决的问题：提供具有进一步改善的导电性能的导电颗粒。溶液：导电颗粒具有芯颗粒1和由涂覆芯颗粒的金属膜形成的导电层。核心颗粒是通过用二氧化硅涂覆包含聚有机硅氧烷（a）的芯颗粒2的颗粒表面形成的颗粒。优选核心粒子的二氧化硅被覆层3的厚度与包含聚有机硅氧烷（a）的核心粒子的直径为0.07〜1.5的比例。

2. 发明专利

JP2013218907A Conductive particles and conductive material containing the same 有权
标题翻译：导电颗粒和含有其的导电材料
公开(公告)号：JP2013218907A
公开(公告)日：2013-10-24
申请号：JP2012089128
申请日：2012-04-10
申请人： Nippon Chem Ind Co Ltd , 日本化学工業株式会社
发明人： MATSUURA HIROTO , OYAMADA MASAAKI
IPC分类号： H01B5/00 , B22F1/02 , C22C19/03 , H01B1/00 , H01B1/22 , H01R11/01
摘要： PROBLEM TO BE SOLVED: To provide conductive particles having high conductivity and good dispersibility.SOLUTION: Each of the conductive particles is formed by forming a conductive film on the surface of a core material particle. The conductive film has a base film being in contact with the surface of the core material particle and an upper layer film being in contact with a surface of the base film. The base film has a crystal structure, contains nickel, and has a phosphorus content of less than 10 mass%. The upper layer film has a crystal structure and contains nickel, phosphorus, and one or more metals M (excluding nickel).
摘要翻译：要解决的问题：提供具有高导电性和良好分散性的导电颗粒。溶液：每个导电颗粒通过在芯材颗粒的表面上形成导电膜而形成。导电膜具有与芯材颗粒的表面接触的基膜和与基膜的表面接触的上层膜。基膜具有晶体结构，含有镍，磷含量低于10质量％。上层膜具有晶体结构，并含有镍，磷和一种或多种金属M（不包括镍）。

3. 发明专利

JP2004323962A Electroless-plated electroconductive powder and manufacturing method therefor 有权
公开(公告)号：JP2004323962A
公开(公告)日：2004-11-18
申请号：JP2003124442
申请日：2003-04-28
申请人： Nippon Chem Ind Co Ltd , 日本化学工業株式会社
发明人： ABE SHINJI , OYAMADA MASAAKI
IPC分类号： B22F1/00 , B22F1/02 , C23C18/42 , H01B1/00 , H01B1/22
摘要： PROBLEM TO BE SOLVED: To provide an electroless-plated electroconductive powder having high electroconductivity, corrosion resistance, high reliability and superior dispersibility, and to provide a manufacturing method therefor.
SOLUTION: The electroless-plated electroconductive powder has an electroless-plated layer of gold directly formed on the surface of a core material particle made of copper, and uniformly covering the whole area of the particle of the core material. The method for manufacturing the plated powder comprises charging the core material particles into an aqueous solution including a complexing agent, dispersing the particles, and adding gold ions to the obtained dispersion liquid to displacement-deposits them to directly form the plating layer on the surface of the core material particles.
COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2013001995A Method for manufacturing conductive particles 有权
标题翻译：制造导电颗粒的方法
公开(公告)号：JP2013001995A
公开(公告)日：2013-01-07
申请号：JP2011138014
申请日：2011-06-22
申请人： Nippon Chem Ind Co Ltd , 日本化学工業株式会社
发明人： MATSUURA HIROTO , OYAMADA MASAAKI
IPC分类号： C23C18/31 , B22F1/00 , B22F1/02 , C23C18/18 , C23C18/52 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a method for easily manufacturing conductive particles in which noble metals are uniformly precipitated without degrading the precipitation rate of the noble metals.SOLUTION: The method for manufacturing conductive particle includes a step of forming a nickel plating layer on a surface of core particle, a step of oxidizing the surface of the nickel plating layer, and a step of directly forming a noble metal plating layer on a surface of the oxidized nickel plating layer. The surface of the nickel plating layer is favorably oxidized by the contact with heated air. In the Ni2p3 spectrum of nickel measured by XPS, the oxidation is favorably executed so that the ratio of Ni-O bonding having the bond energy of 855.7±1.0 eV is ≥60%.
摘要翻译：解决问题的方案：提供容易制造贵金属均匀沉淀而不降低贵金属沉淀速率的导电颗粒的方法。＆lt; P＆gt;解决方案：导电粒子的制造方法包括在芯粒子表面形成镍镀层的步骤，对镍镀层的表面进行氧化的工序，以及直接形成贵金属镀层在氧化镍镀层的表面上。镀镍层的表面通过与加热空气的接触而被有利地氧化。在通过XPS测量的镍的Ni2p3光谱中，有利地进行氧化，使得键能为855.7±1.0eV的Ni-O键的比例为≥60％。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2004323964A Method for manufacturing electroless-plated electroconductive powder 有权
标题翻译：制造电镀电极粉末的方法
公开(公告)号：JP2004323964A
公开(公告)日：2004-11-18
申请号：JP2003124444
申请日：2003-04-28
申请人： Nippon Chem Ind Co Ltd , 日本化学工業株式会社
发明人： ABE SHINJI , OYAMADA MASAAKI
IPC分类号： B22F1/02 , C23C18/36 , C23C18/42 , H01B1/00 , H01B1/02 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing an electroless-plated electroconductive powder, which provides the plated powder superior in dispersibility without damaging the plated powder.
SOLUTION: The method for manufacturing the electroless-plated electroconductive powder comprises adding a compound capable of forming a complex ion with an ion of a metal contained in the plated powder, to a dispersion liquid of the plated powder obtained by electroless-plating the surface of a core material powder, to disperse the coagulating plated powder. The compound can form a complex ion with an ion of a metal contained in the core material powder before being electroless plated. The electroless plating is a displacement type electroless plating.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制造无电镀导电粉末的方法，其提供了优异的分散性而不损坏镀覆粉末的电镀粉末。解决方案：制造无电镀导电粉末的方法包括将能够形成复合离子的化合物与电镀粉末中所含的金属离子一起添加到通过无电镀获得的电镀粉末的分散液中芯材料粉末的表面，以分散凝固电镀粉末。在化学镀前，该化合物可以与芯材料粉末中包含的金属的离子形成复合离子。化学镀是位移型无电镀。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2004131800A Conductive electroless plating powder and method for manufacturing the same 有权
标题翻译：导电电镀粉末及其制造方法
公开(公告)号：JP2004131800A
公开(公告)日：2004-04-30
申请号：JP2002297901
申请日：2002-10-10
申请人： Nippon Chem Ind Co Ltd , 日本化学工業株式会社
发明人： OYAMADA MASAAKI , ABE SHINJI , KAWAZOE TETSUHIRO
IPC分类号： C23C18/34 , C23C18/30 , C23C18/44 , C23C18/54
摘要： PROBLEM TO BE SOLVED: To provide conductive electroless plating powder having improved adhesion properties of a plating film and core member powder, and to provide a method for manufacturing the powder.
SOLUTION: The conductive electroless plating powder in which a nickel film is formed by an electroless plating method on the surface of the core member powder is characterized in that grain boundaries are not admitted at the section in the thickness direction of the nickel film when the section is observed by a scanning electron microscope at magnifying power up to 100,000 times.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供具有改善的镀膜和芯构件粉末的粘附性的导电化学镀粉末，并提供制造粉末的方法。解决方案：在芯材粉末的表面上通过无电镀法形成镍膜的导电化学镀粉末的特征在于，在镍膜的厚度方向的截面处不允许晶界当通过扫描电子显微镜以放大功率观察截面达100,000次时。版权所有（C）2004，JPO

7. 发明专利

JP2012113850A Conductive powder, conductive material containing it and production method therefor 有权
标题翻译：导电粉，包含其的导电材料及其生产方法
公开(公告)号：JP2012113850A
公开(公告)日：2012-06-14
申请号：JP2010259763
申请日：2010-11-22
申请人： Nippon Chem Ind Co Ltd , 日本化学工業株式会社
发明人： MATSUMOTO CHIHIRO , OYAMADA MASAAKI
IPC分类号： H01B5/00 , H01B1/00 , H01B1/22 , H01B13/00 , H01R11/01
CPC分类号： H01B1/02 , H01B1/026 , H01R13/03 , H01R13/2414
摘要： PROBLEM TO BE SOLVED: To provide a conductive powder various performances of which are enhanced when compared with those of prior art conductive powder.SOLUTION: The conductive powder consists of conductive particles in which a metal or alloy coating is formed on the surface of core material particles. The conductive particle has multiple protrusions protruding from the surface of the coating. The protrusion consists of a combination body of particles where a plurality of metal or alloy particles are combined in a row. The metal or alloy is, preferably, nickel or nickel alloy. The ratio of the total area of the parts where the coating is exposed to the projection area of the conductive particles is, preferably, 60% or lower.
摘要翻译：要解决的问题：与现有技术的导电粉末相比，提供各种性能提高的导电粉末。解决方案：导电粉末由导电颗粒组成，其中在芯材颗粒的表面上形成金属或合金涂层。导电颗粒具有从涂层的表面突出的多个突起。突起由多个金属或合金颗粒组合在一起的颗粒组合体组成。金属或合金优选为镍或镍合金。涂层暴露于导电性粒子的投影面积的部分的总面积的比优选为60％以下。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2006241499A Method for producing powder electroless-plated with electroconductive substance 审中-公开
标题翻译：用电生物质电解生产粉末的方法
公开(公告)号：JP2006241499A
公开(公告)日：2006-09-14
申请号：JP2005056816
申请日：2005-03-02
申请人： Kanto Gakuin Univ Surface Engineering Research Institute , Nippon Chem Ind Co Ltd , 日本化学工業株式会社 , 株式会社関東学院大学表面工学研究所
发明人： HONMA HIDEO , TASHIRO KATSUHIKO , ABE SHINJI , OYAMADA MASAAKI , INABA HIROYUKI
IPC分类号： C23C18/31 , C23C18/20 , H01B5/00 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a powder electroless-plated with an electroconductive substance having many microspikes, without using chromic acid or permanganic acid causing environmental pollution.
SOLUTION: The method for producing the powder electroless-plated with the electroconductive substance comprises the steps of: illuminating a suspension containing a core powder and a semiconductor particle suspended in a liquid with light; thereby hydrophilizing the surface of the powder and simultaneously depositing the semiconductor particle onto the surface of the powder; and then forming a metallic film on the surface of the powder, which has been hydrophilized and has the semiconductor particle deposited thereon, with an electroless plating technique. The employed core powder and semiconductor particle have such a particle diameter ratio (former/latter) as to satisfy 10 to 10
5 .
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种无电镀的具有许多微球的导电物质的粉末的方法，而不使用导致环境污染的铬酸或高锰酸。解决方案：用于生产无电镀导电物质的粉末的方法包括以下步骤：用光照射含有悬浮在液体中的芯粉和半导体颗粒的悬浮液; 从而使粉末的表面亲水化并同时将半导体颗粒沉积到粉末的表面上; 然后通过化学镀技术在已经被亲水化并且其上沉积有半导体颗粒的粉末的表面上形成金属膜。所使用的核心粉末和半导体颗粒具有满足10至10 5 的粒径比（前者/后者）。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2014130824A Conductive powder, conductive material containing the same, and manufacturing method of conductive particle 有权
标题翻译：导电粉末，含有其的导电材料和导电颗粒的制造方法
公开(公告)号：JP2014130824A
公开(公告)日：2014-07-10
申请号：JP2014019019
申请日：2014-02-04
申请人： Nippon Chem Ind Co Ltd , 日本化学工業株式会社
发明人： MATSUURA HIROTO , OYAMADA MASAAKI
IPC分类号： H01B5/00 , B22F1/02 , H01B1/00 , H01B1/22 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a conductive powder having conductivity equal to or higher than that of a conductive powder consisting of a conductive particle with conventional technology having gold plating film as the outermost layer, and electrical reliability.SOLUTION: A conductive powder consists of a conductive particle which palladium film is formed on a nickel coating particle surface which a nickel coating is formed on a surface of a core material particle. It has 5 or more projection parts having height of 50 nm or more projecting from a surface of the palladium film and being continuum body with the palladium film. The content of phosphorus in the palladium film is 3 wt.% or less. A percentage of a primary particle in the conductive particle is 85 wt.% or more based on the weight of the conductive powder.
摘要翻译：要解决的问题：提供导电性等于或高于由具有镀金膜作为最外层的常规技术的导电颗粒组成的导电粉末和电可靠性的导电粉末。解决方案：导电粉末由导电颗粒，其在镍涂层颗粒表面上形成钯膜，在芯材颗粒的表面上形成镍涂层。它具有5个或更多个凸起部分，其高度为50nm以上，从钯膜的表面突出并且与钯膜连续体。钯膜中的磷含量为3重量％以下。基于导电粉末的重量，导电粒子中的一次粒子的百分比为85重量％以上。

10. 发明专利

JP2014013660A Conductive particle and conductive material including the same 有权
标题翻译：导电颗粒和导电材料，包括它们
公开(公告)号：JP2014013660A
公开(公告)日：2014-01-23
申请号：JP2012149772
申请日：2012-07-03
申请人： Nippon Chem Ind Co Ltd , 日本化学工業株式会社
发明人： MATSUURA HIROTO , OYAMADA MASAAKI
IPC分类号： H01B5/00 , B22F1/02 , H01B1/00 , H01B1/22 , H01B13/00 , H01R11/01
摘要： PROBLEM TO BE SOLVED: To provide a conductive particle having high electrical conductivity.SOLUTION: A conductive particle is obtained by forming a conductive film on the surface of a core material particle. The conductive film has a base film contacting with the surface of the core material particle and an upper layer film. The base film comprises nickel and phosphorus. The upper layer film has a crystal structure and comprises nickel, phosphorus, and one or more metals M. The upper layer film includes a flat part, and a plurality of projecting parts each of which projects from the flat part and forms a continuum continued from the flat part, and the flat part and the projecting parts are formed of the same material.
摘要翻译：要解决的问题：提供具有高导电性的导电颗粒。溶液：通过在芯材颗粒的表面上形成导电膜获得导电颗粒。导电膜具有与芯材颗粒的表面接触的基膜和上层膜。基膜包括镍和磷。上层膜具有晶体结构，包含镍，磷和一种或多种金属M.上层膜包括平坦部分和多个突出部分，每个突出部分从平坦部分突出并形成连续体，平坦部分，平坦部分和突出部分由相同的材料形成。

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