会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明专利
    • Method for manufacturing film or piezoelectric film
    • 制造薄膜或压电薄膜的方法
    • JP2005313160A
    • 2005-11-10
    • JP2005098899
    • 2005-03-30
    • Brother Ind LtdNational Institute Of Advanced Industrial & Technologyブラザー工業株式会社独立行政法人産業技術総合研究所
    • YASUI MOTOHIROAKETO JUNBABA SO
    • B05D5/12B05D7/24H01L41/18H01L41/187H01L41/314H01L41/39H01L41/24
    • PROBLEM TO BE SOLVED: To provide a simple method for manufacturing a film or a piezoelectric film which can improve adhesion of the film to a substrate. SOLUTION: This method for manufacturing a film comprises spraying particle-containing aerosol on a substrate to adhere the particles onto the substrate. In this method, the ratio between the Vickers hardness Hv(b) of the adhesion surface to which the particles are to be adhered in the substrate, and the Vickers hardness Hv(p) of the particles is brought to a range of 0.39≤Hv(p)/Hv(b)≤3.08. Alternatively, the ratio between the Vickers hardness Hv(b) of the adhesion surface to which the particles are to be adhered in the substrate, and the compressive breaking strength Gv(p) of the particles is brought to a range of 0.10≤äGv(p)/Hv(b)}×100≤3.08. This constitution can improve the adhesion between the particles and the substrate, and the film can be reliably formed. The present invention can be favorably applied to the formation of a piezoelectric film. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种制造薄膜或压电薄膜的简单方法,其可以改善薄膜与基底的粘合性。 解决方案:这种制造薄膜的方法包括将含颗粒的气溶胶喷涂在基材上以将颗粒粘附到基材上。 在该方法中,将待附着在基板上的粘合面的维氏硬度Hv(b)与颗粒的维氏硬度Hv(p)的比例设为0.39≤Hv (p)/ HV(b)≤3.08。 或者,将要在基板中粘附颗粒的粘附表面的维氏硬度Hv(b)与颗粒的压缩断裂强度Gv(p)之间的比率设为0.10≤ΔGv( p)/ HV(b)}×100≤3.08。 这种结构可以改善颗粒和基材之间的粘附性,并且可以可靠地形成膜。 本发明可以有利地应用于压电膜的形成。 版权所有(C)2006,JPO&NCIPI
    • 4. 发明专利
    • Device and method for forming minute metal bump
    • 用于形成MINUTE METAL BUMP的装置和方法
    • JP2010147323A
    • 2010-07-01
    • JP2008324335
    • 2008-12-19
    • National Institute Of Advanced Industrial Science & Technology独立行政法人産業技術総合研究所
    • IMURA FUMITONAKAGAWA HIROSHIAOYANAGI MASAHIROYAMAJI YASUHIROKIKUCHI KATSUYAYOKOSHIMA TOKIHIKOAKETO JUNBABA SO
    • H01L21/60
    • PROBLEM TO BE SOLVED: To easily and efficiently form a conical bump on a substrate by suppressing excessive rise of substrate temperature regardless of bump size.
      SOLUTION: This device for forming a minute metal bump includes a substrate holding means 1 to hold a substrate 10 where a hole pattern for exposing predetermined parts of metal wiring formed on one surface side is formed on a mask layer covering the metal wiring, and a metal fine particle spray means to spray metal fine particles obtained by evaporating metal along with a carrier gas from a nozzle 62 to the one surface side of the substrate 10 held by the substrate holding means 1, and is structured to deposit the metal fine particles sprayed by the metal fine particle spray means on the predetermined parts of the metal wiring to form conical metal bumps by a gas deposition method. The substrate holding means 1 includes a cooling member 2 for holding the substrate 10 from the other surface side thereof, and a thermally-conductive sheet 4 interposed between the substrate 10 and the cooling member 2 and having flexibility.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:通过抑制衬底温度的过度上升而不管凸起尺寸如何,能够容易且有效地在衬底上形成锥形凸起。 解决方案:用于形成微小金属凸块的该装置包括:基板保持装置1,用于保持基板10,其中在覆盖金属布线的掩模层上形成用于暴露在一个表面侧上形成的金属布线的预定部分的孔图案 和金属微粒喷射装置,用于喷射通过将蒸气与载气一起从喷嘴62蒸发到由基板保持装置1保持的基板10的一个表面侧而获得的金属细颗粒,并且被构造成沉积金属 通过金属微粒喷射装置喷射的细颗粒在金属布线的预定部分上,通过气相沉积法形成锥形金属凸块。 基板保持装置1包括用于从其另一表面侧保持基板10的冷却构件2和插入在基板10和冷却构件2之间并具有柔性的导热片4。 版权所有(C)2010,JPO&INPIT