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    • 9. 发明专利
    • CERAMICS CIRCUIT BOARD
    • JPS6486588A
    • 1989-03-31
    • JP12534188
    • 1988-05-23
    • NARUMI CHINA CORP
    • YANO SHINSUKEHIRAI TAKAMIFUKUDA JUNZONONOMURA TOSHIONISHIGAKI SUSUMU
    • H05K1/03H05K3/18H05K3/46
    • PURPOSE:To make it difficult to generate migration and to form fine patterns, by roughening the surface of a glass 1 filler substrate firable at 800-1100 deg.C in an acid solution of pH1-4, and by forming it into a surface circuit board by use of plating with Cu conductor or the like. CONSTITUTION:A ceramic substrate 1 containing Ag based conductor 2 is subjected to electroless plating 5, electroplating 6, and soldering 12 thereon. As a ceramic board, only the surface of a glass 1 filler low-temperature firing (800-1100 deg.C) substrate is immersed in a-acid solution of pH1-4 for uniform roughening under gentle conditions, then, fine circuit patterns are formed on the substrate surface by plating with Cu, Ni, or Au conductor difficult to generate migration and by their combination. Particularly, only Cu conductor or the combination of Cu conductor, Ni, and Au is preferable from the view of cost and conduction resistance. If the solution used for surface roughening is pH lower than 1, glass in the substrate melts too excessively to hold intensity. If pH is higher than 4, the surface roughening is insufficient so that the conductor does not turn stronger in adhesion.