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    • 1. 发明专利
    • DIAMOND FILM-PRODUCING UNIT AND PRODUCTION THEREOF
    • JPH03131598A
    • 1991-06-05
    • JP16917290
    • 1990-06-27
    • NIPPON SOKEN
    • YAMAMOTO MINORUNAKAMURA SATOSHIITO NOBUEHATTORI TADASHI
    • C30B29/04
    • PURPOSE:To produce the subject diamond film of high quality regardless of thickness by using a system capable of detecting factors causing variation of the surface temperature of the diamond film in vapor phase diamond film synthesis by arching and controlling the surface temperature of the diamond film to a prescribed temperature corresponding to the detected factors. CONSTITUTION:A producing unit having the constitution mentioned below is utilized. A vacuum vessel 100 kept to a prescribed degree of vacuum; an anode 10 and a cathode 7 facing each other arranged in the vacuum vessel 100; a power source 17 for arching for application of a prescribed electric power so as to generate arching at a space between the anode 10 and the cathode 7; a gas supply unit for generating gas plasma by flow of at least a plasma source gas 16 (e.g. Ar+H2) into the generated arc and for blowing the above- mentioned gas plasma containing the carbon source gas 19 onto a substrate 2 arranged at the lower stream thereof; a detector 30 for detection of factors causing variation of the surface temperature of a diamond film growing on the substrate 2; controllers (e.g. 35, 34, 32 and 33) for controlling the surface temperature of the diamond film to a prescribed temperature corresponding to the above-mentioned factors detected by the detector 30; are equipped.
    • 2. 发明专利
    • SEMICONDUCTOR ELEMENT AND MANUFACTURE THEREOF
    • JPH0284716A
    • 1990-03-26
    • JP30647787
    • 1987-12-03
    • NIPPON SOKEN
    • SAKAKIBARA NOBUYOSHIKATADA MITSUTAKAFUJINO SEIJIHATTORI TADASHI
    • H01L21/20H01L21/324H01L21/336H01L27/00H01L27/12H01L29/78H01L29/786
    • PURPOSE:To improve electric characteristics such as carrier mobility, and increase element quality and integration capability, in a semiconductor element utilizing a polycrystalline silicon layer as an active layer, by a method wherein the polycrystalline silicon layer is formed thicker than a specified thickness on an insulating layer, and the specified thickness deposition part of the poly- crystalline silicon layer is used as an active region. CONSTITUTION:In a semiconductor element using a polycrystalline silicon layer 3 deposited on an insulating layer 2 as an active layer, the thickness of the polycrystalline silicon layer 3 is made equal to or more than 0.5mum, and the deposition part 0.5mum or greater in thickness of the polycrystalline silicon layer is used as an active region. For example, on an oxide film SiO2 2, a polycrystalline silicon layer 3 of 1.5mum thick is formed by a low pressure CVD method at 610 deg.C. The polycrystalline silicon layer 3 is composed of two layers 3a, 3b corresponding with the deposition process. The layer 3a becomes a layer having fine and random orientation, and the layer 3b becomes a layer of columunar structure oriented along an axis almost vertical to the film surface. In this layer 36, N regions 3b-1, 3b-3 turning to a drain and a source, and P type channel region 3b-2 are formed.
    • 8. 发明专利
    • FLOW RATE SENSOR
    • JPS63177023A
    • 1988-07-21
    • JP813087
    • 1987-01-19
    • NIPPON SOKEN
    • OTA MINORUONODA MASATOSHIMIURA KAZUHIKOHATTORI TADASHI
    • G01F1/68G01F1/692G01F1/696G01F1/698G01F9/00G01F9/02
    • PURPOSE:To keep sensitivity and a response speed over a long period of time, by supplying a current to a burning-off resistor layer when suspended particles are adhered to a flow rate detecting resistor layer and a substrate to burn off or separate the suspended particles. CONSTITUTION:A flow rate detecting resistor layer 62 composed of a platinum pattern layer and a burning-off resistor layer 62' for burning off a contaminant such as suspended particles are provided on a substrate 61. The resistor layers 62, 62 are covered with separate passivation films 63, 63'. When the suspended particles are adhered to the substrate 61 on the upstream side thereof, by supplying a current to the burning-off resistor layer 62' to heat the upstream side, for example, to 400-800 deg.C, the adhered suspended particles are burnt off or separated. Since the passivation film 63 is separated from the passivation film 63', even when a crack is generated in the passivation film 63' by thermal shock due to the supply of a current to the burning-off resistor layer 62', the passivation film 63 covering the flow rate detecting resistor layer 62 receives no effect thereof.