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    • 6. 发明专利
    • PIEZOELECTRIC BOOSTER MODULE
    • JPH09312428A
    • 1997-12-02
    • JP12865396
    • 1996-05-23
    • NIHON CEMENT
    • KATAOKA MASAKOEZAKI TORUYAMAKAWA TAKAHIROINOUE YOSHIKAZU
    • H01L41/107H01L41/22
    • PROBLEM TO BE SOLVED: To thin a piezoelectric booster module, and to make small its plan dimensions by a method wherein a case is fixed to the circumferential part of a substrate in such a manner that the case, in which a piezoelectric transducer element is housed, and at least a part of the thickness of a piezoelectric booster circuit substrate are overlapped in the range of thickness of the entire module. SOLUTION: A piezoelectric transducer element 4 is housed in a frame-like piezoelectric transducer element case 8, and the piezoelectric transducer element 4 is fixed to the case 8 leaving a suitable clearance between the side face and the case using a bonding agent 11 to be applied to the side face part. Also, the frame-like case 8 has pawls 3 to be used for fixing to a substrate. As above- mentioned, the case 8 is fixed to the edge part on the circumference of the substrate in such a manner that at least a part of the thickness of the case 8, in which the piezoelectric transducer element 4 is housed, and a piezoelectric booster circuit substrate is overlapped in the scope of thickness of the entire module. An input/output lead wire is connected to the piezoelectric transducer element 4.
    • 7. 发明专利
    • LAMINATED ELEMENT FOR PIEZOELECTRIC TRANSFORMER
    • JPH09223828A
    • 1997-08-26
    • JP5255396
    • 1996-02-16
    • NIHON CEMENT
    • KATAOKA MASAKOEZAKI TORUYAMAKAWA TAKAHIROINOUE YOSHIKAZU
    • H01L41/107H01L41/22
    • PROBLEM TO BE SOLVED: To prevent breakdowns between inner electrodes unexposed to the surface of a laminated element for piezoelectric transformers, by making the inner electrodes and interlayer connection conductors whereby the inner electrodes formed in the laminated element are connected every two electrode layers unexposed to the surface of the laminated element. SOLUTION: After cutting a piezoelectric ceramics tape in an adequate size, sticking it on a printing frame, via holes for filling interlayer connection conductors thereinto are bored therein. Filling conductor pastes into the via holes by using a metallic mask, and drying them, thereafter, conductot pastes for inner electrodes are printed thereon by using screening masks to prevent the conductor pastes from extruding from the side surfaces of a laminated element and to divide the inner electrodes into a-layer and b-layer ones. The printed a-layer and b-layer inner electrodes are superimposed on each other alternately. Thereto, two tapes are further bonded in a thermo- compression way in the uppermost and lowermost layers of the laminated element to burn them thereafter. In the two tapes, conductors are filled only into one-side via holes required for the connections of the uppermost and lowermost layers. Thereby, the unexposed inner electrode and unexposed interlayer connection conductors to the surfaces of the laminated element can be formed.