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    • 9. 发明专利
    • CERAMIC WIRING BOARD
    • JPH03286590A
    • 1991-12-17
    • JP8854490
    • 1990-04-03
    • NIHON CEMENT
    • NAKAI KYOICHISAGAWA MASAAKIEZAKI TORUYAMAGISHI SENJO
    • H05K1/02H01L23/36H05K1/00H05K1/03H05K3/46
    • PURPOSE:To discharge efficiently heat generated from a semiconductor device by installing densely a large number of through-holes filled with a conductive metal material to a mounting position of the semiconductor device or connecting these through-holes with a grounding conductor pattern or a radiation conductor pattern. CONSTITUTION:Surface wiring conductor patterns 4 are formed on both sides of a ceramic multilayer interconnection board 11 where a semiconductor device 6 is mounted at the same time. A large number of through-holes whose size is identical to that of signal transfer via holes 5, are densely installed at the position of the board where the semiconductor 6 is mounted, in order to dissipate heat generated from the semiconductor device 6. These through-holes are filled with conductive paste and one end of radiation through-holes 14 are arranged to come into contact with the semiconductor device 6 by way of a surface wiring good conductor suitable for heat conduction and conductive paste while the other end is connected with a grounding conductor pattern 12 installed in the board 11 at the same time. In addition, the radiation through holes 14 are connected with a single or plurality of conductor patterns exclusively designed for heat radiation installed on other layer on the way to the board 11.