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2. 发明专利

JPH04312995A MANUFACTURE OF COPPER-CLAD BOARD 失效
公开(公告)号：JPH04312995A
公开(公告)日：1992-11-04
申请号：JP1505691
申请日：1991-02-06
申请人： NEC TOYAMA LTD
发明人： YAMAGUCHI MITSUO
IPC分类号： H05K3/46
摘要： PURPOSE:To make it possible to retrieve reference marks on printed-wiring board through the transparent resin from prepregs, which is formed in the holes of copper foils and the prepregs, by a method wherein the copper foils and the prepregs, which respectively have the holes at the same positions as those of the marks on the board, are used and the laminated material of the board, the copper foils and the prepregs is heated, pressed and molded. CONSTITUTION:Prepregs 5 and copper foils 7 for conductor circuit formation use, which respectively have holes 4 and 6 formed at the same positions as those of reference marks 2, are laminated on an internal layer printed-wiring board 3 formed with conductor patterns 1 and the marks 2 in such a way that the holes 4 and 6 are positioned on the marks 2. Then, the laminated material of the board 3, the prepregs 5 and the copper foils 7 are sandwiched by a laminating jig and a mirror plate and is heated, pressed and molded. Thereby, the holes 4 and 6 are filled with a resin 5A from the melted and secured prepregs 5, but as the resin 5A is transparent, the marks 2 can be used as origins at the time of a patterning of the copper foils 7.

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