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1. 发明专利

JP2011032515A Rack plating method and rack plating apparatus 审中-公开
标题翻译：机架镀层方法和机架镀层装置
公开(公告)号：JP2011032515A
公开(公告)日：2011-02-17
申请号：JP2009178520
申请日：2009-07-31
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： KURODA SHIGEYUKI
IPC分类号： C25D17/06 , C25D17/08
摘要： PROBLEM TO BE SOLVED: To provide a rack plating method and a rack plating apparatus in which a rack can be repeatedly used for a long period of time and good plating can be achieved by reducing the thickness distribution in an article to be plated.
SOLUTION: A rack 11 holding an article 1 to be plated and a rack 12 holding a metallic material 2 are immersed in a plating solution 3. In this state, the rack 11 is used as a cathode and the rack 12 is used as an anode, and the article to be plated is plated by energizing the racks. When a predetermined amount or more of the plating metal is precipitated on the rack holding the article to be plated, the rack 11 holding the article to be plated is diverted to a rack for holding the metallic material 2. The metallic material 2 is held on the diverted rack 11, and the article to be plated is held on another rack. The another rack holding the article to be plated and the diverted rack 11 holding the metallic material are immersed in the plating solution. The another rack is used as a cathode and the diverted rack 11 is used as an anode, and the article to be plated is plated by energizing the racks.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种可以长时间重复使用架子的架子电镀方法和架子电镀装置，并且可以通过减少待镀制品中的厚度分布来实现良好的电镀。
解决方案：将保持待镀物体1的搁架11和保持金属材料2的搁架12浸没在电镀液3中。在该状态下，将齿条11用作阴极，并使用齿条12 作为阳极，并且通过对机架通电来对待镀制品进行电镀。当将预定量的电镀金属沉积在保持待镀物品的搁架上时，将待镀物品的搁架11转移到用于保持金属材料2的搁架上。金属材料2保持在转向架11，被镀物品被保持在另一个支架上。将另一个保持待镀物品的架子和保持金属材料的转向架11浸入电镀液中。另一个机架用作阴极，转向架11用作阳极，并且通过对机架通电来对待镀制品进行电镀。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2006213946A Nickel plating solution, method for producing electronic parts, and electronic parts 有权
标题翻译：镍电镀解决方案，生产电子部件的方法和电子部件
公开(公告)号：JP2006213946A
公开(公告)日：2006-08-17
申请号：JP2005025895
申请日：2005-02-02
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： MOTOKI AKIHIRO , YOSHIDA IKUSHI , TAKANO YOSHIHIKO , KURODA SHIGEYUKI
IPC分类号： C25D3/12 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To provide a nickel plating bath which minimizes the growth of a plated film on a part except an electroconductive part of an article to be plated, and reliably imparts adequate solder wettability to a plated article.
SOLUTION: The nickel plating bath includes a sulfate-based salt of nickel such as nickel sulfate, a halogen compound such as nickel chloride and a pH buffer such as boric acid, wherein the pH is adjusted to 2.2 to 5.5 and a molar concentration ratio x/y of nickel ions (x) and halide ions (y) is controlled so as to satisfy 0.5
摘要翻译：要解决的问题：提供一种镀镍浴，其使得除了待镀制品的导电部分之外的部分上的电镀膜的生长最小化，并且可靠地赋予电镀制品足够的焊料润湿性。解决方案：镍电镀浴包括镍的硫酸盐基盐，例如硫酸镍，卤化合物如氯化镍和pH缓冲液如硼酸，其中将pH调节至2.2至5.5，并将摩尔控制镍离子（x）和卤素离子（y）的浓度比x / y，使其满足0.5

3. 发明专利

JP2012165028A Laminated electronic component and method for manufacturing the same 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：JP2012165028A
公开(公告)日：2012-08-30
申请号：JP2012126631
申请日：2012-06-02
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： KUNISHI TATSUO , TAKANO YOSHIHIKO , KURODA SHIGEYUKI , MOTOKI AKIHIRO , KASHIO HIDEYUKI , NOJI TAKASHI , OGAWA MAKOTO
IPC分类号： H01G4/30 , H01G4/12
CPC分类号： C25D3/12 , C25D5/02 , C25D7/00 , C25D21/10 , H01G4/2325 , H01G4/30 , Y10T29/435 , Y10T29/49126 , Y10T29/49147 , Y10T29/49163 , Y10T29/49204
摘要： PROBLEM TO BE SOLVED: To provide a laminated electronic component capable of forming with good quality an external electrode for electrically connecting end parts of a plurality of internal electrodes each other by directly performing electrolytic plating in a place having exposed end parts of a plurality of internal electrodes on a predetermined surface of a laminate provided in the laminated electronic component.SOLUTION: A laminate 5 is prepared in which adjacent internal electrodes 3a and 3b are electrically insulated from each other in an edge surface 6 with the exposed internal electrodes 3a and 3b; an interval s measured in a thickness direction of an insulator layer 2 between the adjacent internal electrodes 3a and 3b is 10 μm or less; and retracted lengths d of the internal electrodes 3a and 3b to the edge surface 6 are 1 μm or less. The electrolytic plating process grows electrolytic plating depositions so as to mutually connect the electrolytic plating depositions deposited at the end parts of the plurality of internal electrodes 3a and 3b.
摘要翻译：解决问题的方案为了提供能够形成质量良好的层叠电子部件，外部电极用于通过在具有暴露的端部的位置直接进行电解电镀来将多个内部电极的端部彼此电连接在叠层电子部件中设置的层叠体的规定表面上的多个内部电极。解决方案：制备层压体5，其中相邻的内部电极3a和3b在具有暴露的内部电极3a和3b的边缘表面6中彼此电绝缘; 在相邻的内部电极3a和3b之间的绝缘体层2的厚度方向上测量的间隔为10μm以下; 并且内部电极3a和3b的缩回长度d到边缘表面6为1μm以下。电解电镀工艺生长电解沉积，以便相互连接沉积在多个内部电极3a和3b的端部的电解沉积。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2008283170A Multilayer electronic component and method for manufacturing the same 有权
标题翻译：多层电子元件及其制造方法
公开(公告)号：JP2008283170A
公开(公告)日：2008-11-20
申请号：JP2008036807
申请日：2008-02-19
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： MOTOKI AKIHIRO , KAWASAKI KENICHI , OGAWA MAKOTO , KURODA SHIGEYUKI , TAKEUCHI SHUNSUKE , KASHIO HIDEYUKI
IPC分类号： H01G4/12 , H01G4/30
CPC分类号： H01G4/30 , H01G4/232
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer electronic component with enhanced bonding reliability in mounting by soldering, while being superior in effective volume fraction, by forming an external electrode only by plating on the end surface on which each end part of a plurality of internal electrodes is exposed in a laminate provided in the multilayer electronic component.
SOLUTION: Plating deposits are deposited at each end part of a plurality of internal electrodes 8 and 9 exposed from the end surfaces 5 and 6 of a laminate 2, and plating growth is performed, in such a manner that the plating deposits are connected to each other, thereby after external electrodes 10 and 11 are formed, edge thick-film electrodes 14 and 15 that conduct to the external electrodes 10 and 11 are formed at each edge part adjacent to the end surfaces 5 and 6, in each of the principal surfaces 3 and 4 and the side faces of the laminate 2, by baking conductive paste. Furthermore, plating films 17 and 18, having Sn and Au as principal components, are preferably formed on the external electrodes 10 and 11 and on the edge thick-film electrodes 14 and 15.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种制造多层电子元件的方法，其通过焊接安装时具有增强的焊接可靠性，同时具有优异的有效体积分数，通过仅在每个多个内部电极的端部暴露在设置在多层电子部件中的层叠体中。解决方案：在从层压体2的端面5和6露出的多个内部电极8和9的每个端部沉积电镀沉积物，并且以镀覆沉积物彼此连接，从而在形成外部电极10和11之后，在与端面5和6相邻的每个边缘部分处形成导电至外部电极10和11的边缘厚膜电极14和15，主表面3和4以及层压体2的侧面，通过烘烤导电浆料。此外，优选在外部电极10和11以及边缘厚膜电极14和15上形成具有Sn和Au作为主要成分的电镀膜17和18.（C）2009，JPO＆INPIT

5. 发明专利

JP2004332040A Plating method, and method for producing electronic component 审中-公开
公开(公告)号：JP2004332040A
公开(公告)日：2004-11-25
申请号：JP2003128664
申请日：2003-05-07
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： MOTOKI AKIHIRO , KURODA SHIGEYUKI
IPC分类号： C25D21/10 , H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To suppress sticking between parts to be plated and variation in a plating film in a plating method using a vibration plating device.
SOLUTION: Plating is performed in such a manner that a flowing state where the contents of a container 30 flow mainly to the horizontal direction with a vibration transmission part 40 as the center and another flowing state where the contents flow mainly to the vertical direction are alternately repeated by periodically changing the frequency of the vibration generated in a vibration generating part 10.
COPYRIGHT: (C)2005,JPO&NCIPI

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