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1. 发明专利

JP2014030172A Flat cable and electronic apparatus 有权
标题翻译：平板电缆和电子设备
公开(公告)号：JP2014030172A
公开(公告)日：2014-02-13
申请号：JP2013068342
申请日：2013-03-28
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： KATO NOBORU , ISHINO SATOSHI , SASAKI JUN
IPC分类号： H01P3/08 , H01B7/08 , H01B11/00 , H01P5/02
摘要： PROBLEM TO BE SOLVED: To provide a flat cable which has no bent part formed and enables substantially linear wiring without changing characteristics, and an electronic apparatus with the same.SOLUTION: A flat cable includes a long first ground conductor 10, and a long second ground conductor 20 which has a long signal line conductor 30 arranged opposite the first ground conductor across a first base material sheet and a plurality of opening parts 20A opposed to the signal line conductor 30 across a second base material sheet 52 along a length. The first ground conductor 10, the signal line conductor 30, and the second ground conductor 20 have a narrow-width part 1B thinner in width orthogonal to the length than other regions at least partially along the length. An opening part 20A formed at the narrow-width part 1B is made smaller than opening parts 20A formed in the other regions.
摘要翻译：要解决的问题：提供一种没有弯曲部分形成的扁平电缆，并且能够在不改变特性的情况下实现基本线性布线，以及具有该扁平电缆的电子设备。解决方案：扁平电缆包括长的第一接地导体10和长的第二接地导体接地导体20，其具有跨越第一基材片与第一接地导体相对布置的长信号线导体30和沿着长度穿过第二基材片52与信号线导体30相对的多个开口部20A。第一接地导体10，信号线导体30和第二接地导体20具有至少部分沿着长度与其它区域的长度正交的宽度更窄的窄宽度部分1B。形成在窄幅部1B的开口部20A小于在其他区域形成的开口部20A。

2. 发明专利

JP2014011528A Transmission line 有权
标题翻译：传输线
公开(公告)号：JP2014011528A
公开(公告)日：2014-01-20
申请号：JP2012145068
申请日：2012-06-28
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： KATO NOBORU , ISHINO SATOSHI , SASAKI JUN
IPC分类号： H01P3/08 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a transmission line having flexibility and stability of characteristic impedance.SOLUTION: A transmission line 1 includes ground conductor patterns 11-15, a signal line conductor 21, and base material layers 31-34. The signal line conductor 21 is formed between the ground conductor pattern 11 and the ground conductor pattern 15. The ground conductor pattern 13 is formed to surround the signal line conductor 21, when viewed from a direction perpendicular to a principal surface of the ground conductor pattern 11, and to overlap the signal line conductor 21, when viewed from a direction in parallel with the principal surface. The ground conductor patterns 12, 14 are formed to surround the signal line conductor 21, when viewed from a direction perpendicular to the principal surface, and to be spaced from the ground conductor pattern 13, when viewed from a direction in parallel with the principal surface. The base material layers 31-34 are formed so as to fill between the ground conductor pattern 11 and the ground conductor pattern 15.
摘要翻译：要解决的问题：提供具有灵活性和特性阻抗稳定性的传输线。解决方案：传输线1包括接地导体图案11-15，信号线导体21和基材层31-34。信号线导体21形成在接地导体图案11和接地导体图案15之间。当从与接地导体图案的主表面垂直的方向观察时，接地导体图案13形成为围绕信号线导体21 从与主面平行的方向观察时，与信号线导体21重叠。当从垂直于主表面的方向观察时，接地导体图案12,14形成为围绕信号线导体21，并且与从主表面平行的方向观察时与接地导体图案13间隔开。基材层31-34形成为填充在接地导体图案11和接地导体图案15之间。

3. 发明专利

JP2014010955A Flat cables 有权
标题翻译：平板电脑
公开(公告)号：JP2014010955A
公开(公告)日：2014-01-20
申请号：JP2012145362
申请日：2012-06-28
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： KATO NOBORU , ISHINO SATOSHI , SASAKI JUN
IPC分类号： H01B7/08 , H01B11/00
摘要： PROBLEM TO BE SOLVED: To provide a flat cable in which the decrease of bendability and the change of characteristic impedance caused by bending are suppressed.SOLUTION: Such a flat cable is a transmission line 12 which is composed by laminating a resist layer 28, a ground layer 26, a reinforcement layer 24, an insulation layer 22, a reinforcement layer 20, a signal line conductor 18, and a resist layer 16 in this order. Each thickness of the reinforcement layers 20 and 24 is smaller than the thickness of the insulation layer 22 and the sum of thickness of the reinforcement layers 20 and 24 is also smaller than the thickness of the insulation layer 22. When the flexural modulus of elasticity of the insulation layer 22 in thickness direction is indicated by "E1" and the flexural modulus of elasticity of the reinforcement layers 20 and 24 in thickness direction is indicated by "E2", the value of the flexural modulus of elasticity E2 is larger than the value of the flexural modulus of elasticity E1.
摘要翻译：要解决的问题：提供一种扁平电缆，其中弯曲性的降低和由弯曲引起的特性阻抗的变化被抑制。解决方案：这种扁平电缆是传输线12，其通过层压抗蚀剂层28，接地层26，加强层24，绝缘层22，加强层20，信号线导体18和抗蚀剂层16。加强层20和24的每个厚度小于绝缘层22的厚度，并且加强层20和24的厚度之和也小于绝缘层22的厚度。当弯曲弹性模量厚度方向的绝缘层22由“E1”表示，加强层20,24的厚度方向的挠曲弹性模量用“E2”表示，挠曲弹性模量E2的值大于值的挠曲弹性模量E1。

4. 发明专利

JP2013085006A Circuit board 有权
标题翻译：电路板
公开(公告)号：JP2013085006A
公开(公告)日：2013-05-09
申请号：JP2013026366
申请日：2013-02-14
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： KATO NOBORU , SASAKI JUN , ISHINO SATOSHI
IPC分类号： H05K3/46 , H05K1/02
CPC分类号： H01L23/5389 , H01L2224/16225 , H01L2924/3011 , H05K1/112 , H05K1/186 , H05K3/4617
摘要： PROBLEM TO BE SOLVED: To provide a circuit board capable of incorporating an electric component having a small interval between connection terminals, and a method for manufacturing the same.SOLUTION: A circuit board includes: a laminate constituted by laminating a first insulator layer provided with a blank area for incorporating an electronic component, and a second insulator layer provided with a blank area; a plurality of conductor layers provided in the second insulator layer and whose ends are connected to a plurality of connection terminals, respectively; and a plurality of via hole conductors provided in the laminate and connected to the other ends of the plurality of conductor layers, respectively. The first insulator layer and the second insulator layer are constituted by a thermoplastic resin. The laminate is formed by bonding the first insulator layer and the second insulator layer by softening and flowing the thermoplastic resin. The blank area of the first insulator layer is larger than the electronic component. The plurality of via hole conductors are arranged around the blank area in the first insulator layer.
摘要翻译：要解决的问题：提供一种能够结合在连接端子之间具有小间隔的电气部件的电路板及其制造方法。电路板包括：通过层叠设置有用于结合电子部件的空白区域的第一绝缘体层和设置有空白区域的第二绝缘体层构成的层叠体; 设置在所述第二绝缘体层中并分别与多个连接端子连接的多个导体层; 以及多个通孔导体，分别设置在所述层叠体中并与所述多个导体层的另一端连接。第一绝缘体层和第二绝缘体层由热塑性树脂构成。通过使热塑性树脂软化和流动来结合第一绝缘体层和第二绝缘体层来形成层压体。第一绝缘体层的空白区域大于电子部件。多个通孔导体布置在第一绝缘体层中的空白区域周围。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2009027233A Wireless ic device, and electronic equipment 有权
标题翻译：无线IC设备和电子设备
公开(公告)号：JP2009027233A
公开(公告)日：2009-02-05
申请号：JP2007185438
申请日：2007-07-17
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： KATO NOBORU , ISHINO SATOSHI , KATAYA TAKESHI , KIMURA IKUHEI , IKEMOTO NOBUO
IPC分类号： H01Q23/00 , G06K19/07 , G06K19/077 , H01L25/00 , H01Q1/38 , H01Q1/50 , H04B5/02
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/19105 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To obtain a compact and inexpensive wireless IC device capable of mounting a wireless IC chip easily, and to obtain electronic equipment mounting the wireless IC device. SOLUTION: The wireless IC device has the wireless IC chip 5 processing transmission and reception signals, and a feeder circuit board 10 including a resonance circuit having an inductance element. On the surface of the feeder circuit board, there are external electrodes 19a, 19b coupled to the resonance circuit electromagnetically. The external electrodes 19a, 19b are connected to radiation plates 21a, 21b provided on a printed-wiring board 20 electrically in a continuity state. The wireless IC chip 5 is operated by a signal received by the radiation plates 21a, 21b, and a response signal from the wireless IC chip 5 is radiated outside from the radiation plates 21a, 21b. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了获得能够容易地安装无线IC芯片的紧凑且廉价的无线IC器件，并且获得安装无线IC器件的电子设备。解决方案：无线IC器件具有处理发送和接收信号的无线IC芯片5，以及包括具有电感元件的谐振电路的馈电电路板10。在供电电路板的表面上，有电磁耦合到谐振电路的外部电极19a，19b。外部电极19a，19b在连续性状态下与设置在印刷布线基板20上的辐射板21a，21b连接。无线IC芯片5通过由辐射板21a，21b接收的信号进行操作，并且来自无线IC芯片5的响应信号从辐射板21a，21b向外辐射。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2009025870A Radio ic device, inspection system thereof, and method for manufacturing radio ic device by using the inspection system 有权
标题翻译：无线电IC装置，检查系统及其使用检查系统制造无线电IC装置的方法
公开(公告)号：JP2009025870A
公开(公告)日：2009-02-05
申请号：JP2007185437
申请日：2007-07-17
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： KATO NOBORU , ISHINO SATOSHI , KATAYA TAKESHI , KIMURA IKUHEI , IKEMOTO NOBUO
IPC分类号： G06K19/077 , G06K19/07 , H01Q1/38
摘要： PROBLEM TO BE SOLVED: To provide a radio IC device which can be downsized and facilitates the inspection of characteristics, to provide an inspection system capable of efficiently inspecting characteristics of the radio IC device, and to provide a method for manufacturing the radio IC device by using the inspection system. SOLUTION: This radio IC device is provided with a radio IC chip 5 for processing a transmission/reception signal and a power supply circuit substrate 10 including a resonance circuit having an inductance element. External electrodes 19a and 19b electro-magnetically coupled with the resonance circuit are formed on the surface of the power supply circuit substrate, and the radio IC chip 5 is operated according to a signal received by the external electrodes 19a and 19b, and a response signal from the radio IC chip 5 is emitted from the external electrodes 19a and 19b to the outside. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：为了提供能够小型化并且便于特性检查的无线IC器件，提供能够有效地检测无线IC器件的特性的检查系统，并提供一种无线电IC的制造方法 IC器件采用检测系统。解决方案：该无线IC器件设置有用于处理发送/接收信号的无线IC芯片5和包括具有电感元件的谐振电路的电源电路基板10。在电源电路基板的表面上形成与谐振电路电磁耦合的外部电极19a，19b，根据由外部电极19a，19b接收到的信号，对无线IC芯片5进行动作，响应信号无线电IC芯片5从外部电极19a和19b发射到外部。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008084308A Radio ic device and component therefor 有权
标题翻译：无线IC器件及其组件
公开(公告)号：JP2008084308A
公开(公告)日：2008-04-10
申请号：JP2007218867
申请日：2007-08-24
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： DOUKAI TAKEYA , KATO NOBORU , ISHINO SATOSHI
IPC分类号： G06K19/077 , G06K19/07 , H04B5/02
CPC分类号： Y02D70/10
摘要： PROBLEM TO BE SOLVED: To provide a radio IC device and a component for it having stable frequency characteristics. SOLUTION: The radio IC device comprises a radio IC chip 5, a power supply circuit board 10 having the radio IC chip 5 mounted thereon and a power supply circuit 16 including a resonant circuit having a predetermined resonant frequency, and an emission plate 20 bound to the lower face of the power supply circuit board 10 for emitting a transmission signal supplied from the power supply circuit 16 and for receiving a reception signal to supply it to the power supply circuit 16. The resonant circuit is constructed of an LC resonant circuit comprising an inductance element L and capacitance elements C1 and C2. The power supply circuit board 10 is a multilayer rigid board or a single-layer rigid board, and is connected to the radio IC chip 5 and the emission plate 20 by DC connection, magnetic coupling, or capacitive coupling. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种无线IC器件及其具有稳定频率特性的元件。解决方案：无线电IC装置包括无线电IC芯片5，安装无线电IC芯片5的电源电路板10和包括具有预定谐振频率的谐振电路的电源电路16和发射板 20连接到电源电路板10的下表面，用于发射从电源电路16提供的发送信号，并且用于接收接收信号以将其提供给电源电路16.谐振电路由LC谐振电路包括电感元件L和电容元件C1和C2。电源电路基板10是多层刚性基板或单层刚性基板，通过直流连接，磁耦合或电容耦合与无线IC芯片5和发光板20连接。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JPH11274394A Electronic component package and manufacture thereof 失效
标题翻译：电子组件包装及其制造
公开(公告)号：JPH11274394A
公开(公告)日：1999-10-08
申请号：JP7154798
申请日：1998-03-20
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： BANDAI HARUFUMI , ISHINO SATOSHI
IPC分类号： H01L25/18 , H01L25/04
摘要： PROBLEM TO BE SOLVED: To provide an electronic component package wherein a plurality of electronic components are compactly integrated.
SOLUTION: In an electronic component package 1, integrated circuit chips 6 are mounted on one main surface 5 of a first wiring board 2, and a cavity 9 is formed in the other main surface 7 of a first wiring board 2. In the meantime, circuit elements 20 necessary for operating the integrated circuit chips 6 are mounted on the one main surface 19 of a second wiring board 3. An opening 8 of the cavity 9 is closed with the circuit elements 20 positioned in the cavity 9, which integrates the second wiring board 3 with the first wiring board 2. Necessary electrical connections are established by wiring patterns and via hole connecting portions formed inside the first wiring board 2.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：提供一种电子部件封装，其中多个电子部件紧凑地集成。解决方案：在电子部件封装1中，集成电路芯片6安装在第一布线板2的一个主表面5上，并且在第一布线板2的另一个主表面7中形成空腔9.同时，用于操作集成电路芯片6所必需的电路元件20安装在第二布线板3的一个主表面19上。空腔9的开口8被封闭，电路元件20定位在空腔9中，其中第二配线基板3与第一配线基板2连接。通过在第一配线基板2的内部形成的布线图案和通孔连接部分，建立必要的电连接。

9. 发明专利

JP2014089765A Printed-circuit board 有权
标题翻译：印刷电路板
公开(公告)号：JP2014089765A
公开(公告)日：2014-05-15
申请号：JP2014011151
申请日：2014-01-24
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： IKEMOTO NOBUO , ISHINO SATOSHI , DOKAI TAKEYA , KATO NOBORU , KATAYA TAKESHI , KIMURA IKUHEI , SAITO MIKIKO
IPC分类号： G06K19/077 , G06K19/07
CPC分类号： H01Q1/243 , H01L2224/13139 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/1531 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01Q1/38 , H01Q1/40 , H01Q9/28 , H03H7/38 , H03H2007/386 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/165 , H05K2201/10098 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To improve bond strength of a radio IC device for a printed-circuit board.SOLUTION: A printed-circuit board 20 comprises: a radio IC device 1 with a feeding circuit board 10 having a radio IC 5 processing a transmit and receive signal and a feeding circuit connected to the radio IC 5; and emission plates 21a and 21b which are electromagnetic field-bound to the feeding circuit. The radio IC device 1 is provided with electrodes 18a and 18b for mounting which are not connected to the feeding circuit electrically, and is fixed to the printed-circuit board 20 by the electrodes 18a and 18b for mounting. The feeding circuit board 10 has electrodes 19a and 19b for emission which are electromagnetic field-bound with the emission plates 21a and 21b built-in.
摘要翻译：要解决的问题：提高用于印刷电路板的无线电IC器件的结合强度。解决方案：印刷电路板20包括：无线电IC器件1，具有馈电电路板10，其具有处理发射接收信号和连接到无线IC 5的馈电电路; 以及与供电电路电磁场结合的发射板21a和21b。无线IC器件1设置有用于安装的电极18a和18b，其不与馈电电路电连接，并且通过用于安装的电极18a和18b固定到印刷电路板20。馈电电路板10具有与内置发射板21a和21b电磁场结合的用于发射的电极19a和19b。

10. 发明专利

JP2013013148A Wireless ic device 审中-公开
标题翻译：无线IC器件
公开(公告)号：JP2013013148A
公开(公告)日：2013-01-17
申请号：JP2012221761
申请日：2012-10-04
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： KATO NOBORU , ISHINO SATOSHI , KATAYA TAKESHI , KIMURA IKUHEI , IKEMOTO NOBUO , DOKAI TAKEYA
IPC分类号： H01Q1/44 , G06K19/07 , G06K19/077 , H01Q1/38 , H01Q1/50 , H01Q23/00
CPC分类号： G06K19/07779 , G06K19/06187 , G06K19/0723 , G06K19/07749 , G06K19/07756 , G06K19/07773 , G06K19/07783 , G06K19/07784 , G06K19/07786 , H01L23/49838 , H01L23/552 , H01L23/66 , H01L2223/6677 , H01L2224/48091 , H01L2224/48227 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/36 , H01Q1/38 , H01Q1/42 , H01Q1/44 , H01Q7/00 , H01Q9/16 , H01Q9/30 , H01Q13/10 , H05K1/0216 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/16 , H05K1/181 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10098 , H05K2201/10371 , H05K2201/10522 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a wireless IC device capable of being downsized without incurring a reduction in radiation characteristics.SOLUTION: A wireless IC device comprises an electromagnetic coupling module (1) composed of a wireless IC chip (5) processing transmission/reception signals and a feeder-circuit substrate (10) being provided with a feeder circuit including an inductance element. In the feeder-circuit substrate (10), an external electrode that is electromagnetic-field coupled to the feeder circuit is provided, and the external electrode is electrically connected to a shield case (28) or a wiring cable. The shield case (28) or the wiring cable function as a radiation plate, the wireless IC chip (5) is operated by a signal received by the shield case (28) or the wiring cable, and a response signal from the wireless IC chip (5) is radiated from the shield case (28) or the wiring cable to the outside. The metal component functioning as the radiation plate may be a ground electrode provided on a printed wiring board (20).
摘要翻译：要解决的问题：提供一种能够在不引起辐射特性降低的情况下小型化的无线IC器件。解决方案：无线IC器件包括由处理发送/接收信号的无线IC芯片（5）和馈电电路基板（10）组成的电磁耦合模块（1），馈电电路基板（10）设置有馈电电路，馈电电路包括电感元件。在馈电电路基板（10）中，设置与供电电路电磁场耦合的外部电极，外部电极与屏蔽壳（28）或布线电缆电连接。屏蔽盒（28）或布线电缆作为辐射板，无线IC芯片（5）由屏蔽壳（28）或布线电缆接收的信号和来自无线IC芯片的响应信号（5）从屏蔽壳（28）或布线电缆向外部辐射。用作辐射板的金属部件可以是设置在印刷线路板（20）上的接地电极。版权所有（C）2013，JPO＆INPIT

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