专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2008245310A Surface acoustic wave demultiplexer 审中-公开
标题翻译：表面声波除颤器
公开(公告)号：JP2008245310A
公开(公告)日：2008-10-09
申请号：JP2008118282
申请日：2008-04-30
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： TANIGUCHI NORIO , KISHIMOTO TAKANORI , HIRA MITSUYOSHI
IPC分类号： H03H9/72 , H03H7/01 , H03H7/075 , H03H9/05 , H03H9/10 , H03H9/25 , H03H9/64
CPC分类号： H03H9/6483 , H03H7/0115 , H03H7/1725 , H03H7/1758 , H03H7/1766 , H03H7/1775 , H03H7/1783 , H03H9/0538 , H03H9/0576 , H03H9/1071 , H03H9/6436 , H03H9/72 , H03H9/725
摘要： PROBLEM TO BE SOLVED: To provide a surface acoustic wave demultiplexer capable of improving an attenuation amount at the higher-frequency side than at the transmission-side passing band and the reception-side passing band and reducing the device size.
SOLUTION: The surface acoustic wave demultiplexer includes a transmission-side surface acoustic wave filter and a reception-side surface acoustic wave filter connected to an antenna terminal. The transmission-side surface acoustic wave filter and the reception-side surface acoustic wave filter are mounted on a package member. The device further includes a high-frequency element connected to the transmission-side surface acoustic wave filter and the reception-side surface acoustic wave filter and having two trap attenuation poles at a higher frequency side at least than the transmission-side passing band and the receiving-side passing band.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供能够提高在高频侧的衰减量比在发送侧通过频带和接收侧通过频带上减小的声表面波解复用器，并减小装置尺寸。解决方案：声表面波解复用器包括连接到天线端子的发射侧声表面波滤波器和接收侧声表面波滤波器。发送侧声表面波滤波器和接收侧声表面波滤波器安装在封装构件上。该装置还包括连接到发送侧声表面波滤波器和接收侧声表面波滤波器的高频元件，并且在至少比发送侧通过频带更高频侧具有两个陷波衰减极点，并且接收方通过频带。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2009054829A Electronic component and manufacturing method thereof 有权
标题翻译：电子元器件及其制造方法
公开(公告)号：JP2009054829A
公开(公告)日：2009-03-12
申请号：JP2007220794
申请日：2007-08-28
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HIRA MITSUYOSHI , YAMATO HIDEJI , KITA RYOICHI , SAKAI TAKUMI
IPC分类号： H05K3/34 , H01L21/60 , H01L23/12 , H05K3/46
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide an electronic component which is formed by mounting an electronic component chip on a ceramic multilayer board using bumps and assures the excellent credibility of electrical connection by a plurality of bumps.
SOLUTION: Disclosed is the electronic component 1 which has the electronic component chip 3 with the plurality of bumps 14 to 16 mounted on a top surface 2a of the ceramic multilayer substrate 2 and also has a first electrode land 11, a second electrode land 12, and a first electrode land 13, where the bumps 14 to 16 are connected, in order on the ceramic multilayer substrate 2, the top surface 2a of the ceramic multilayer substrate 2 being made convex so that the height of the second electrode land 12 is larger than the height of the first electrode lands 11 and 13.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过使用凸块将电子部件芯片安装在陶瓷多层板上形成的电子部件，并且确保通过多个凸块的电连接的良好可信度。解决方案：公开了具有安装在陶瓷多层基板2的上表面2a上的多个凸块14至16的电子部件芯片3的电子部件1，并且还具有第一电极焊盘11，第二电极在陶瓷多层基板2上依次连接突起14〜16的第一电极接合面13，陶瓷多层基板2的上表面2a为凸状，使得第二电极的高度 12大于第一电极焊盘11和13的高度。版权所有：（C）2009，JPO＆INPIT

3. 发明专利

JP2004088143A Surface acoustic wave branching filter and manufacturing method thereof 有权
公开(公告)号：JP2004088143A
公开(公告)日：2004-03-18
申请号：JP2002242242
申请日：2002-08-22
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HIRA MITSUYOSHI , MURAMATSU KIYOSHIGE , IKADA KATSUHIRO
IPC分类号： H03H9/72 , H03H3/08 , H03H9/64
摘要： PROBLEM TO BE SOLVED: To provide a surface acoustic wave branching filter which is improved in power resistance and miniaturized, and also to provide a manufacturing method thereof.
SOLUTION: The branching filter is provided with a plurality of surface acoustic wave resonators 11a-11c, 12a, 12b which are connected like a ladder and constitute a transmitter side surface acoustic wave filter 4, and a plurality of surface acoustic wave resonators 21a, 21b, 22a-22c which are connected like a ladder and constitute a receiver side surface acoustic wave filter 6. The branching filter is also has a first chip 15 in which at least one resonator 11c constituting the filter 4 and all of the resonators 21a, 21b, 22a-22c constituting the filter 6 are formed on a piezoelectric substrate; and a second chip 16 in which the other resonators among the resonators constituting the filter 4 are formed on the other piezoelectric substrates 11a, 11b, 12a, 12b.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2012005018A Surface acoustic wave device 有权
标题翻译：表面声波设备
公开(公告)号：JP2012005018A
公开(公告)日：2012-01-05
申请号：JP2010140416
申请日：2010-06-21
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HIRA MITSUYOSHI
IPC分类号： H03H9/145 , H03H9/64
摘要： PROBLEM TO BE SOLVED: To provide a compact surface acoustic wave device.SOLUTION: A surface acoustic wave device 1 includes a piezoelectric substrate 10, a surface acoustic wave element 30 formed on the piezoelectric substrate 10 and a bump pad 11 formed on the piezoelectric substrate 10. The surface acoustic wave element 30 includes interdigital electrodes 32, 33, and 34 formed on the piezoelectric substrate 10 and a pair of reflectors 31 and 35 formed on both sides in a traveling direction of a surface acoustic wave of the interdigital electrodes 32, 33, and 34 and formed on the piezoelectric substrate 10. At least one reflector 31 of the pair of the reflectors 31 and 35 is weighted so that a cross width of a side which is not opposed to the interdigital electrodes becomes smaller than a cross width of a side which is opposed to the interdigital electrodes. The bump pad 11 is formed adjacent to an area where the reflector is formed if the reflector is not weighted.
摘要翻译：要解决的问题：提供一种紧凑的声表面波装置。解决方案：表面声波装置1包括压电基片10，形成在压电基片10上的表面声波元件30和形成在压电基片10上的凸块垫11.声表面波元件30包括叉指电极形成在压电基板10上的32,33,34和形成在交叉指状电极32,33,34的表面声波的行进方向的两侧上并形成在压电基板10上的一对反射体31,35 一对反射器31和35中的至少一个反射器31被加权，使得与叉指电极不相对的一侧的横向宽度变得小于与叉指电极相对的一侧的交叉宽度。如果反射器没有加权，则碰撞焊盘11形成为邻近形成反射体的区域。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2005116622A Electronic component 审中-公开
标题翻译：电子元件
公开(公告)号：JP2005116622A
公开(公告)日：2005-04-28
申请号：JP2003345778
申请日：2003-10-03
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HIRA MITSUYOSHI , YAMATO HIDEJI , NISHI HIROYUKI
IPC分类号： H01L23/13 , H01L23/14 , H03H9/25
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide an electronic component which is formed by mounting an electronic component chip on a ceramic multilayer board using bumps and assures the excellent credibility of electrical connection by a plurality of bumps.
SOLUTION: In an electronic component, an electronic chip 3 is mounted using a plurality of bumps 14 to 16 on the upper surface 2a of a ceramic multilayer substrate 2. In this ceramic multilayer substrate 2, the internal conductive films 9, 12 are arranged on at least one layer at the lower side of a bump 15 arranged at least in the center among a plurality of bumps 14 to 16 arranged in the direction parallel to the upper surface of the ceramic multilayer substrate 2.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种通过使用凸块将电子部件芯片安装在陶瓷多层板上形成的电子部件，并且确保通过多个凸块的电连接的良好可信度。解决方案：在电子部件中，电子芯片3使用多个凸块14至16安装在陶瓷多层基板2的上表面2a上。在该陶瓷多层基板2中，内部导电膜9,12 布置在至少布置在沿着平行于陶瓷多层基板2的上表面的方向布置的多个凸块14至16中的至少在中心的凸块15的下侧的至少一层。版权所有：（C）2005，JPO＆NCIPI

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式