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    • 6. 发明专利
    • Capacitor-layer forming material, manufacturing method for composite foil used for manufacture of material, and printed-wiring board with built-in capacitor circuit obtained by using capacitor-layer forming material
    • 电容器成型材料,用于制造材料的复合材料的制造方法和使用电容器形成材料获得的具有内置电容器电路的印刷电路板
    • JP2006128326A
    • 2006-05-18
    • JP2004313137
    • 2004-10-27
    • Mitsui Mining & Smelting Co Ltd三井金属鉱業株式会社
    • SAKATA TOMOHIROTANIGUCHI KAZUKODOBASHI MAKOTO
    • H01G4/008B32B15/08C25D3/12C25D3/20C25D3/56C25D5/12C25D5/14C25D7/00C25D7/06H01G4/18H01G4/33H01G4/38H05K1/16H05K3/46
    • PROBLEM TO BE SOLVED: To provide a capacitor-layer forming material, applicable to a printed-wiring board manufactured through a high-temperature working process at 300°C to 400°C such as a fluororesin board, a liquid-crystal polymer or the like, without strength deterioration after heating at a high temperature. SOLUTION: The capacitor-layer forming material for the printed-wiring board has a dielectric layer between a first conductive layer used for forming an upper electrode and a second conductive layer used for forming a lower electrode. In the capacitor-layer forming material, a composite foil is adopted, equipped with a hard nickel plated layer, a cobalt plated layer, a nickel-cobalt alloy plated layer, and two layers of a cobalt plated layer/a hard nickel plated layer, as a metallic layer of a different kind on the surface of a copper layer in the second conductive layer. In the capacitor-layer forming material, the composite foil with two layers of an iron plated layer/the hard nickel plated layer, three layers of the cobalt plated layer/the hard nickel plated layer/the cobalt plated layer and three layers of the iron plated layer/the hard nickel plated layer/the cobalt plated layer or the like, is further adopted as the metallic layer of the different kind. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了提供一种电容器层形成材料,可应用于通过在300℃至400℃的高温加工工艺制造的印刷线路板,例如氟树脂板,液晶 聚合物等,在高温加热后没有强度劣化。 解决方案:用于印刷电路板的电容器层形成材料在用于形成上电极的第一导电层和用于形成下电极的第二导电层之间具有介电层。 在电容器层形成材料中,采用复合箔,其具有硬质镀镍层,钴镀层,镍钴合金镀层,以及两层镀钴层/硬质镍镀层, 作为第二导电层中的铜层的表面上的不同种类的金属层。 在电容器层形成材料中,具有两层镀铁层/硬质镍镀层的复合箔,三层钴镀层/硬镀镍层/钴镀层和三层铁 镀层/硬质镀镍层/镀钴层等作为不同种类的金属层。 版权所有(C)2006,JPO&NCIPI
    • 9. 发明专利
    • Copper alloy foil and its production method
    • 铜合金及其生产方法
    • JP2005336585A
    • 2005-12-08
    • JP2004160233
    • 2004-05-28
    • Mitsui Mining & Smelting Co Ltd三井金属鉱業株式会社
    • TANIGUCHI KAZUKOTOMONAGA SAKIKODOBASHI MAKOTO
    • C25F3/22C25F7/00
    • PROBLEM TO BE SOLVED: To provide copper alloy foil having a suitably high surface roughness at a low cost.
      SOLUTION: In the method for producing copper alloy foil where the surface of copper alloy foil is subjected to electrolytic polishing with a phosphoric acid aqueous solution, the electrolytic polishing is performed under the conditions where the current efficiency at the time when the surface of the copper alloy foil is continuously subjected to electrolytic polishing at a fixed current density reaches 62 to 90%. The concentration of phosphoric acid in the phosphoric acid aqueous solution is preferably 380 to 600 g/l. Also, the current density in the electrolytic polishing is preferably 30 to 60 A/dm
      2 . Further, the charge amount necessary for the electrolytic polishing is preferably 1,000 to 5,000 C/dm
      2 . Also, phosphoric acid used for the phosphoric acid aqueous solution is preferably H
      3 PO
      4 , and the temperature of the phosphoric acid aqueous solution is preferably 20 to 40°C.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:以低成本提供具有适当高的表面粗糙度的铜合金箔。 < P>解决方案:在铜合金箔的表面用磷酸水溶液进行电解抛光的铜合金箔的制造方法中,电解研磨是在表面时的电流效率 的铜合金箔在固定电流密度下持续进行电解抛光达到62〜90%。 磷酸水溶液中的磷酸的浓度优选为380〜600g / l。 此外,电解抛光中的电流密度优选为30〜60A / dm 2。 此外,电解抛光所需的电荷量优选为1000〜5,000C / dm 2。 此外,磷酸水溶液中使用的磷酸优选为H PO 4 ,磷酸水溶液的温度优选为20〜40℃。 版权所有(C)2006,JPO&NCIPI