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    • 1. 发明专利
    • Ethylene polymer, method for producing the same, and molded form including the polymer
    • 乙烯聚合物,其制造方法和包括聚合物的成型体
    • JP2011144297A
    • 2011-07-28
    • JP2010007522
    • 2010-01-15
    • Mitsui Chemicals Inc三井化学株式会社
    • ONOKI TAKAYUKISHIMODA MANABUNISHINO FUMIAKISUZUKI KOTARO
    • C08F4/64B29C55/02B29K23/00B29L7/00C08F10/02C08J5/00
    • PROBLEM TO BE SOLVED: To provide an ethylene polymer suitable for giving a molded form that is obtained by a solid-phase method such as a solid-phase draw forming and has high mechanical strength, and to provide such a molded form using the ethylene polymer.
      SOLUTION: The ethylene polymer is provided which is obtained by multistage polymerization of ethylenes using an olefin polymerization catalyst including a specific organometallic complex catalytic component, preferably by polymerizing the ethylenes different in molecular weight from each other in the respective stages. The ethylene polymer obtained above is formed at a high draw ratio in a solid-phase draw-molded form. The ethylene polymer thus obtained is believed to have low-molecular weight moieties and high-molecular weight moieties that are homogeneously and highly dispersed, therefore is believed to enable solid-phase draw forming with extremely high draw ratio. Moreover, a molded form using the ethylene polymer exhibits high draw ratio, thereby obtaining a solid-phase draw-molded form with unconventionally high mechanical strength and high elastic modulus.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种适用于提供通过固相法如固相拉伸成型获得的成型体的乙烯聚合物,并且具有高的机械强度,并且提供这样的模制形式,使用 乙烯聚合物。 解决方案:提供乙烯聚合物,其通过使用包括特定有机金属络合物催化组分的烯烃聚合催化剂的乙烯的多段聚合获得,优选通过在各个相中彼此分子量聚合乙烯。 上述获得的乙烯聚合物以高拉伸比形成固相拉伸模塑形式。 据信由此获得的乙烯聚合物具有均匀且高度分散的低分子量部分和高分子量部分,因此被认为能够以非常高的拉伸比进行固相拉伸成形。 此外,使用乙烯聚合物的成型体显示出高拉伸比,从而获得具有非常规的机械强度和高弹性模量的固相拉伸模制形式。 版权所有(C)2011,JPO&INPIT
    • 2. 发明专利
    • Laminate structure
    • 层压结构
    • JP2008001099A
    • 2008-01-10
    • JP2007139267
    • 2007-05-25
    • Mitsui Chemicals Inc三井化学株式会社
    • ONOGI TAKAYUKIKANEKO HIDEYUKIMATSUKI TOMOAKISUZUKI KOTAROOTA SEIJIYASUI SHIGEYUKIISOGAWA SORO
    • B32B27/32B32B27/00
    • PROBLEM TO BE SOLVED: To provide a laminate structure body having a laminate structure at least as a part of it, the laminate structure obtained by strongly bonding a layer containing an olefin-based polymer as a major constituent to at least one layer of a material selected from a polar vinyl-based plastic, an engineering plastic, an organism-based polymer, a thermoplastic elastomer and the like via a hot-melt type adhesion layer containing a specific hybrid polymer. SOLUTION: The laminate structure body has a structure at least as a part of it, wherein the structure comprises a layer (A) containing the olefin-based polymer as a major constituent, a layer (B) containing the hybrid polymer [P]composed of a polyolefin segment [S 1 ] and a polar polymer segment [S 2 ], and at least one layer (C) of a material selected from the polarvinyl-based plastic, an aromatic vinyl-based polymer, a polyester, a polyamide, a polycarbonate, the engineering plastic, the organism-based polymer and the like, and the layer A, the layer B and the layer C being laminated in this order. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了提供至少一部分具有层叠结构的层压结构体,将通过将含有烯烃类聚合物作为主要成分的层强力结合至至少一层而获得的层叠结构 选自极性乙烯基类塑料,工程塑料,生物体聚合物,热塑性弹性体等的材料,通过含有特定的杂化聚合物的热熔型粘合层。 解决方案:层压结构体至少具有其结构,其中该结构包括含有烯烃类聚合物作为主要成分的层(A),含有杂化聚合物的层(B)[ P]由聚烯烃链段[S 1]和极性聚合物链段[S 2]组成,以及至少一层选自极性乙烯基 基于树脂的塑料,芳香族乙烯基类聚合物,聚酯,聚酰胺,聚碳酸酯,工程塑料,生物体聚合物等,层A,层B和层C依次层叠 。 版权所有(C)2008,JPO&INPIT
    • 4. 发明专利
    • Epoxy resin composition having excellent curability, its cured product and its use
    • 具有优异耐腐蚀性的环氧树脂组合物,其固化产品及其使用
    • JP2003286330A
    • 2003-10-10
    • JP2002091900
    • 2002-03-28
    • Mitsui Chemicals Inc三井化学株式会社
    • URAGAMI TATSUNOBUSUZUKI KOTAROMAEDA SUNAO
    • C08G59/40C08G59/20H01L23/29H01L23/31
    • PROBLEM TO BE SOLVED: To provide an epoxy resin composition which excels in curability in spite of curing by an ester group, can be used as a substitute in the industrial fields where epoxy resin compositions produced by the conventional techniques are being used, and excels in productivity, particularly when used as the sealing medium for semiconductors.
      SOLUTION: In the epoxy resin composition comprising (A) an epoxy compound having ≥2 functionalities or an epoxy resin having ≥2 functionalities, (B) a curing agent, and (C) a curing accelerator, the above curing agent (B) is an ester-containing compound or an ester-containing resin to be represented by formula (I), and the above curing accelerator (C) contains 30-100 wt.%, based on the entire curing accelerator, phosphazene compound to be represented by formula (II) or (III) as the essential component.
      COPYRIGHT: (C)2004,JPO
    • 待解决的问题:为了提供尽管通过酯基固化而具有优异的固化性的环氧树脂组合物,可以用作在使用通过常规技术制备的环氧树脂组合物的工业领域中的替代物, 特别是在用作半导体的密封介质时。 解决方案:在包含(A)具有≥2个官能团的环氧化合物或具有≥2个官能团的环氧树脂的环氧树脂组合物中,(B)固化剂和(C)固化促进剂,上述固化剂( B)是由式(I)表示的含酯化合物或含酯树脂,上述固化促进剂(C)含有30-100重量%,以固化促进剂为基准,磷腈化合物为 由式(II)或(III)表示作为必要成分。 版权所有(C)2004,JPO
    • 5. 发明专利
    • Polymer blend containing olefin-based block polymer
    • 含烯烃基聚合物的聚合物混合物
    • JP2008024794A
    • 2008-02-07
    • JP2006197479
    • 2006-07-19
    • Mitsui Chemicals Inc三井化学株式会社
    • ONOKI TAKAYUKIKANEKO HIDEYUKIMATSUKI TOMOAKISUZUKI KOTAROKAWAHARA NOBUO
    • C08L23/00C08F295/00C08L25/00C08L33/18C08L53/00
    • PROBLEM TO BE SOLVED: To provide a resin composition having excellent mechanical characteristics such as impact resistance and tensile strength. SOLUTION: The resin composition (C) comprises 1-98.9 wt.% polyolefin (A), 0.1-50 wt.% olefin-based block polymer (G), and 1-98.9 wt.% vinyl polymer (B) obtained from vinyl monomers comprising one or more kinds selected from an aromatic vinyl compound (m1) and a cyanized vinyl compound (m2) [with the proviso that the total of the components (A), (B) and (C) is 100 wt.%]. The olefin-based block polymer (G) comprises a block (a) of the olefin component, and a block (b) of a polymer residue of a vinyl monomer having a solubility parameter within a range of 18-25 J/m as constituent units, and obtained by mutually binding the block (a) and the block (b) with a covalent bond. COPYRIGHT: (C)2008,JPO&INPIT
    • 待解决的问题:提供具有优异的机械特性如耐冲击性和拉伸强度的树脂组合物。 解决方案:树脂组合物(C)包含1-98.9重量%的聚烯烃(A),0.1-50重量%的基于烯烃的嵌段聚合物(G)和1-98.9重量%的乙烯基聚合物(B) 由包含选自芳族乙烯基化合物(m1)和氰化乙烯基化合物(m2)中的一种或多种的乙烯基单体获得[条件是组分(A),(B)和(C)的总量为100重量% %]。 烯烃类嵌段聚合物(G)含有烯烃成分的嵌段(a)和溶解度参数在18〜25J / m的范围内的乙烯基单体的聚合物残基的嵌段(b)作为成分 单元,并且通过共价键将嵌段(a)和嵌段(b)相互结合获得。 版权所有(C)2008,JPO&INPIT
    • 8. 发明专利
    • Polymer blend comprising olefinic block polymer
    • 聚合物混合包装烯烃嵌段聚合物
    • JP2007262325A
    • 2007-10-11
    • JP2006092164
    • 2006-03-29
    • Mitsui Chemicals Inc三井化学株式会社
    • ONOKI TAKAYUKIKANEKO HIDEYUKIMATSUKI TOMOAKISUZUKI KOTARO
    • C08L23/00C08L53/00C08L69/00
    • PROBLEM TO BE SOLVED: To provide a resin composition excellent in mechanical properties such as impact resistance and tensile strength. SOLUTION: A resin composition (C) comprises 1-98.9 wt.% polyolefin (A1), 0.1-50 wt.% olefinic block polymer (A2), 1-98.9 wt.% polycarbonate resin (B) [wherein, total amount of (A1)+(A2)+(B) is 100 wt.%], wherein the olefinic block polymer (A2) comprises a block (a) of polyolefin component and block (b) of polymer residue of vinyl monomer and having 18-25 J/m solubility parameter, as a constituent unit, and the block (a) and the block (b) are bonded each other by a covalent bond. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供具有抗冲击性和拉伸强度等机械性能优异的树脂组合物。 解决方案:树脂组合物(C)包含1-98.9重量%的聚烯烃(A1),0.1-50重量%的烯烃嵌段聚合物(A2),1-98.9重量%的聚碳酸酯树脂(B)[其中, (A1)+(A2)+(B)的总量为100重量%],其中烯属嵌段聚合物(A2)包含聚烯烃组分的嵌段(a)和乙烯基单体的聚合物残基的嵌段(b) 具有18-25J / m的溶解度参数作为构成单元,并且嵌段(a)和嵌段(b)通过共价键彼此键合。 版权所有(C)2008,JPO&INPIT