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1. 发明专利

JP2012254927A Substrate processing apparatus 有权
标题翻译：基板加工设备
公开(公告)号：JP2012254927A
公开(公告)日：2012-12-27
申请号：JP2012167759
申请日：2012-07-27
申请人： Mitsuboshi Diamond Industrial Co Ltd , 三星ダイヤモンド工業株式会社
发明人： OKAJIMA YASUTOMO , MURAKAMI KENJI , HASHIMOTO TAICHI
IPC分类号： C03B33/04 , B26F3/00 , B26F3/08 , B28D5/00 , C03B33/033 , C03B33/09 , G11B5/84
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus suitable for a mass-production and automation production of annular processed goods such as an annular glass substrate while attaining high reliable processing.SOLUTION: There is provided the substrate processing apparatus MS1 having a breaking part 4 that divides a brittle material substrate G on which a scribe line C1 showing a closed curve on a first surface along the scribe line C1 to perform hollowing processing in which the inner side of the closed curve is bored. The breaking part 4 includes: a plate 42 for supporting a region outer than the scribe line C1 on a second surface opposite to the first surface and heating the region; and a hollowing mechanism 43 for cooling a center region inner than the scribe line C1 from the first surface side and/or the second surface side to separate the outer side region from the center region.
摘要翻译：要解决的问题：提供一种适用于环状加工物品如环形玻璃基板的大量生产和自动化生产的基板处理装置，同时实现高可靠性处理。解决方案：提供了具有断裂部分4的基板处理装置MS1，该断裂部分4沿着划线C1分割在第一表面上具有闭合曲线的划线C1的脆性材料基板G，以进行空心处理，其中闭合曲线的内侧是无聊的。断裂部分4包括：板42，用于在与第一表面相对的第二表面上支撑比划线C1外的区域并加热该区域; 以及用于从第一表面侧和/或第二表面侧冷却来自划线C1的中心区域的中空机构43，以将外侧区域与中心区域分离。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2012066480A Method of splitting brittle material substrate with resin 有权
标题翻译：用树脂分割稀土材料基材的方法
公开(公告)号：JP2012066480A
公开(公告)日：2012-04-05
申请号：JP2010213158
申请日：2010-09-24
申请人： Mitsuboshi Diamond Industrial Co Ltd , 三星ダイヤモンド工業株式会社
发明人： TAKEDA MASAKAZU , MURAKAMI KENJI , HASHIMOTO TAICHI
IPC分类号： B28D5/00
摘要： PROBLEM TO BE SOLVED: To provide a method of highly reliably splitting a brittle material substrate with a resin provided with a V-shaped groove part.SOLUTION: The method of splitting the brittle material substrate with the resin which is made by sticking the resin onto one principal surface of the brittle material substrate and by disposing the V-shaped groove part on the other principal surface of the brittle material substrate, vertically to the principal surface with the tip part of the V-shaped groove part as the starting point, includes: a groove part forming process of forming a second groove part on the predetermined position of splitting of the resin side of the brittle material substrate with the resin; and a breaking process of splitting the brittle material substrate with the resin along the V-shaped groove part (for example, the breaking process of splitting the brittle material substrate with the resin by energizing two positions symmetrical to the V-shaped groove part, on the principal surface of the brittle material substrate and a position on the extension line of the tip part of the V-shaped groove part, on the principal surface of the resin side, by the use of a prescribed energizing member).
摘要翻译：要解决的问题：提供一种用设置有V形槽部的树脂高度可靠地分解脆性材料基板的方法。解决方案：通过将树脂粘贴在脆性材料基板的一个主表面上并将V形槽部分设置在脆性材料的另一主表面上而制成的树脂分裂方法基板，以V形槽部的前端部为起点垂直于主面，包括：在脆性材料的树脂侧的分割的规定位置上形成第二槽部的槽部形成工序基材与树脂; 以及沿着V形槽部分将脆性材料基板与树脂分开的断裂处理（例如，通过将与V形槽部对称的两个位置通过激励将该脆性材料基板与树脂分离的断裂处理，脆性材料基板的主表面和V形槽部的前端部的树脂侧的主面的延伸线上的位置，通过使用规定的通电部件）。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2012066479A Method of splitting brittle material substrate with resin 有权
标题翻译：用树脂分割稀土材料基材的方法
公开(公告)号：JP2012066479A
公开(公告)日：2012-04-05
申请号：JP2010213157
申请日：2010-09-24
申请人： Mitsuboshi Diamond Industrial Co Ltd , 三星ダイヤモンド工業株式会社
发明人： TAKEDA MASAKAZU , MURAKAMI KENJI , HASHIMOTO TAICHI
IPC分类号： B28D5/00 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a method of splitting brittle material substrate with a resin, which has high reliability and with which size accuracy is improved.SOLUTION: The method of splitting a brittle material substrate with a resin which is made by sticking the resin to one principal surface of the brittle material substrate includes: a groove part forming process of forming a groove part on the predetermined position of splitting of the resin side of the brittle material substrate with the resin; a scribe line forming process of forming a scribe line on the predetermined position of the brittle material substrate side; and a breaking process of splitting the brittle material substrate with the resin along the scribe line (for example, the breaking process of splitting the brittle material substrate with the resin by energizing two positions symmetrical to the predetermined position, on the principal surface of the brittle material substrate and a position on the extension line of the scribe line, on the principal surface of the resin side, by the use of a prescribed energizing member).
摘要翻译：要解决的问题：提供一种用树脂分解脆性材料基板的方法，其具有高可靠性并且提高了尺寸精度。解决方案：将通过将树脂粘附在脆性材料基板的一个主表面上而制成的树脂分解脆性材料基板的方法包括：在预定分割位置形成槽部的槽部形成工序的脆性材料基板的树脂侧; 在脆性材料基板侧的规定位置上形成划线的划线形成工序; 以及沿着划线将脆性材料基板与树脂分割的断裂处理（例如，通过使与脆性材料基板的脆性材料基板的脆性材料基板的脆性材料基板的脆性材料基板材料基板和在划线的延伸线上的位置，在树脂侧的主表面上，通过使用规定的通电构件）。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2009190905A System and method for processing brittle material annular processed goods 有权
标题翻译：用于处理轻质材料环状加工品的系统和方法
公开(公告)号：JP2009190905A
公开(公告)日：2009-08-27
申请号：JP2008030002
申请日：2008-02-12
申请人： Mitsuboshi Diamond Industrial Co Ltd , 三星ダイヤモンド工業株式会社
发明人： OKAJIMA YASUTOMO , MURAKAMI KENJI , HASHIMOTO TAICHI
IPC分类号： C03B33/04 , B28D1/24 , B28D5/00 , C03B33/09 , C03B33/10 , G11B5/84
摘要： PROBLEM TO BE SOLVED: To provide a processing system and a processing method suitable for the mass-production and automation production of the annular processed goods such as an annular glass substrate while attaining high reliable processing. SOLUTION: The processing system includes: a scribing part for forming each scribe line of an inner contour, an outer contour and a leading line extending to the vicinity of the outer contour from the edge of the substrate formed by rolling a scribing wheel with a tilted groove; and a breaking part for breaking along each scribe line. The breaking part is provided with: an annular plate for supporting and heating an annular area surrounded by the inner and outer contours from the opposite surface to the surface on which the scribe lines are formed; a center part removing mechanism for separating the annular area from the center area by cooling the center area on the inside of the inner contour from the first surface side; and an edge side separation mechanism for separating the annular area from the edge side area using the leading line connected to the outer contour by allowing external force to be applied and heated in the edge area on the outside of the outer contour of the substrate heated on the annular plate. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种适用于环状加工物品如环形玻璃基板的大规模生产和自动化生产的处理系统和加工方法，同时实现高可靠性处理。解决方案：处理系统包括：划线部分，用于形成内轮廓的每个划线，外轮廓和从通过滚动划线轮形成的基底的边缘延伸到外轮廓附近的前导线有一个倾斜的槽; 并打破了每一个划痕线。断开部分设置有：环形板，用于支撑和加热由内外轮廓围绕的环形区域，所述环形区域与形成有划线的表面相对的表面; 中心部分去除机构，用于通过从第一表面侧冷却内轮廓的内部的中心区域来将环形区域与中心区域分离; 以及边缘侧分离机构，其通过允许在加热的基板的外部轮廓的外侧上的边缘区域中施加外加力并加热外部力而使用连接到外部轮廓的引导线将环形区域与边缘侧区域分离环形板。版权所有（C）2009，JPO＆INPIT

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