专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2010265489A Method for manufacturing conductive member 有权
标题翻译：制造导电构件的方法
公开(公告)号：JP2010265489A
公开(公告)日：2010-11-25
申请号：JP2009115289
申请日：2009-05-12
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ISHIKAWA SEIICHI , KUBOTA KENJI , TAMAGAWA TAKASHI
IPC分类号： C25D5/12 , C25D5/50 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To continuously and efficiently obtain a copper-alloy strip whose surface is plated in the form of multiple layers and which exhibits good properties when it is used as a conductive member.
SOLUTION: A method for producing the conductive member includes forming a Ni-based ground layer, a Cu-Sn intermetallic compound layer and a Sn-based surface layer in this order by inserting a copper strip into a plurality of plating bathes while continuously running the copper strip so as to sequentially plate the surface of the strip with Ni or a Ni-alloy, Cu or a Cu-alloy, and Sn or a Sn-alloy, and then performing a reflow treatment. In the method, each plating layer is formed by electroplating using an insoluble anode in a plating bath containing an inorganic acid as main component, and the bath temperature is set to 45-55°C and the current density is set to 20-50 A/dm
2 during Ni or Ni-alloy plating, the bath temperature is set to 35-55°C and the current density is set to 20-60 A/dm
2 during Cu or Cu-alloy plating, and the bath temperature is set to 15-35°C and the current density is set to 10-30 A/dm
2 during Sn or Sn-alloy plating, and the Reynolds number is set to 1×10
4 to 5×10
5 in each plating.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了连续有效地获得表面以多层形式镀覆并且当用作导电构件时表现出良好性能的铜合金带。解决方案：一种导电部件的制造方法，其特征在于，通过将铜带插入多个电镀液中而依次形成Ni基接地层，Cu-Sn金属间化合物层和Sn系表面层，同时连续地运行铜带，以Ni或Ni合金，Cu或Cu合金，Sn或Sn合金依次平放带材的表面，然后进行回流处理。在该方法中，通过使用不溶性阳极在含有无机酸作为主要成分的电镀液中进行电镀，形成镀层，浴温设定为45〜55℃，电流密度为20〜50℃ 在Ni或Ni合金电镀期间，将浴温度设定为35-55℃，电流密度设定为20〜60A / dm 2 / SP> 2 / 在Cu或Cu合金电镀期间，在Sn或Sn合金电镀期间将浴温度设定为15-35℃，电流密度设定为10-30A / dm 2 / SP，在每个电镀中，雷诺数被设置为1×10 4 至5×10 5 。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2011080117A Conductive member and method of manufacturing the same 有权
标题翻译：导电构件及其制造方法
公开(公告)号：JP2011080117A
公开(公告)日：2011-04-21
申请号：JP2009233806
申请日：2009-10-07
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ISHIKAWA SEIICHI , KUBOTA KENJI , TAMAGAWA TAKASHI
IPC分类号： C25D7/00 , C25D5/12 , C25D5/24 , H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide a conductive member which holds minimum hardness necessary for application which needs high bending property such as a connector female terminal, is provided with an Ni under layer preventing diffusion of Ni to an upper layer, preventing oxidation of the inside of the Ni based under layer and having high bending property, and has excellent bending property, while keeping excellent contact resistance and wear resistance, and to provide a method of manufacturing the same. SOLUTION: The conductive member 10 is obtained by forming a Cu-Sn intermetallic compound layer 3 having 0.05-1.5 μm average thickness and an Sn based surface layer 4 having 0.05-2.0 μm average thickness in this order on the surface of a Cu based base material 1 across the Ni based under layer 2 having 0.1-3.0 μm average thickness. The Cu-Sn intermetallic compound layer is further formed of a Cu 3 Sn layer 5 arranged on the Ni based under layer and a Cu 6 Sn layer 6 arranged on the Cu 3 Sn layer, and the boron content of the Ni based under layer is 50-800 ppm. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种保持需要高弯曲性所需的最小硬度的导电构件，例如连接器母端子，具有防止Ni向上层扩散的Ni底层，防止氧化的Ni基底层的内侧，具有高的弯曲性，并且具有优异的弯曲性能，同时保持优异的接触电阻和耐磨性，并提供其制造方法。解决方案：导电构件10通过在平坦厚度为0.05-1.5μm的Cu-Sn金属间化合物层3上形成平均厚度为0.05-2.0μm的Sn基表面层4， Cu基基材1横跨Ni基底层2，其平均厚度为0.1-3.0μm。 Cu-Sn金属间化合物层还进一步由布置在Ni基底层上的Cu 3 S 3 Sn层5和布置在Cu < SB> 3 Sn层，Ni基底层的硼含量为50〜800ppm。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2011063875A Conductive member and method of manufacturing the same 有权
标题翻译：导电构件及其制造方法
公开(公告)号：JP2011063875A
公开(公告)日：2011-03-31
申请号：JP2009231258
申请日：2009-10-05
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ISHIKAWA SEIICHI , KUBOTA KENJI , TAMAGAWA TAKASHI
IPC分类号： C25D7/00 , C25D5/12 , C25D5/50 , H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide a conductive member which has stable contact resistance and is hardly peeled off, wherein the inserting/removing force is made small when it is used as a connector, and further the heat resistance is enhanced.
SOLUTION: The conductive member is constituted so that on the surface of a Cu-based base material 1, a Cu-Sn intermetallic compound layer 3 and a Sn-based surface layer 4 are formed in this order through a Ni-based ground layer 2, wherein the Cu-Sn intermetallic compound layer 3 consists of a Cu
3 Sn layer 5 arranged on the Ni-based ground layer 2 and a Cu
6 Sn
5 layer 6 arranged on the Cu
3 Sn layer 5. The thickness X of each recessed part 7 of the Cu-Sn intermetallic compound layer 3, obtained by summing up the thicknesses of the Cu
3 Sn layer 5 and the Cu
6 Sn
5 alloy layer 6, is 0.05-1.5 μm, and the surface coverage of the Cu
3 Sn layer 5 to the Ni-based ground layer 2 is ≥60%. The Ni based ground layer 2 has 5-60% (220) intensity in the relative X-ray intensity of the crystal surface by X-ray diffraction. The conductive member is boron-free.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有稳定的接触电阻并且几乎不剥离的导电构件，其中当用作连接器时，插入/取出力变小，并且还提高了耐热性。＆lt; P＆gt;解决方案：导电构件被构造成使得在Cu基基材1的表面上，通过Ni基材料形成Cu-Sn金属间化合物层3和Sn基表面层4 接地层2，其中Cu-Sn金属间化合物层3由设置在Ni基接地层2上的CuS 3 S 3 Sn层5和Cu 6 Sn / SB> 5 层6。通过将Cu-Sn金属间化合物层3的每个凹部7的厚度X Cu 3 Sn层5和Cu 6 Sn 5 合金层6为0.05-1.5μm，Cu Ni基接地层2的Sn 3层的比例≥60％。 Ni基接地层2通过X射线衍射在晶体表面的相对X射线强度中具有5-60％（220）的强度。导电部件是无硼的。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2011046991A SULFURIC ACID BATH FOR PLATING Sn ON COPPER ALLOY SHEET AT HIGH CURRENT DENSITY, AND METHOD FOR PLATING Sn 有权
标题翻译：用于在高电流密度下对铜合金板进行镀锡的硫酸浴和用于镀锡的方法
公开(公告)号：JP2011046991A
公开(公告)日：2011-03-10
申请号：JP2009195170
申请日：2009-08-26
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ISHIKAWA SEIICHI , KUBOTA KENJI , TAMAGAWA TAKASHI
IPC分类号： C25D3/32
摘要： PROBLEM TO BE SOLVED: To provide a sulfuric acid bath which foams little and does not cause plating burning when plating Sn on a copper alloy sheet at a high current density, and to provide a method for plating Sn with the use of the sulfuric acid bath.
SOLUTION: This sulfuric acid bath includes 30-120 g/l of sulfuric acid and 30-150 g/l of tin sulfate as a main component; 0.5-5 g/l of a hydrophilic polyoxyethylene-polyoxypropylene block polymer, 0.025-2.5 g/l of an EO-PO adduct of ethylenediamine and 0.025-2.5 g/l of an EO adduct of an alkylamine compound as a brightener; 0.3-10 g/l of pyrogallol or hydroquinone as an antioxidant; and 0.05-1 g/l of a hydrophobic polyoxyethylene-polyoxypropylene block polymer as an antifoaming agent.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供在高电流密度下在铜合金板上镀Sn时少量发泡并且不引起电镀烧蚀的硫酸浴，并且提供一种使用硫酸浴。解决方案：该硫酸浴包含30-120g / l硫酸和30-150g / l硫酸锡作为主要成分; 0.5-5g / l亲水性聚氧乙烯 - 聚氧丙烯嵌段聚合物，0.025-2.5g / l乙二胺的EO-PO加成物和0.025-2.5g / l烷基胺化合物的EO加合物作为增白剂; 0.3-10g / l连苯三酚或氢醌作为抗氧化剂; 和0.05-1g / l的疏水性聚氧乙烯 - 聚氧丙烯嵌段聚合物作为消泡剂。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2010196084A Electroconductive member and production method therefor 有权
标题翻译：电子成员及其生产方法
公开(公告)号：JP2010196084A
公开(公告)日：2010-09-09
申请号：JP2009039303
申请日：2009-02-23
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ISHIKAWA SEIICHI , KUBOTA KENJI , TAMAGAWA TAKASHI
IPC分类号： C25D5/12 , C25D5/50 , C25D7/00 , H01R13/03 , H01R43/16
摘要： PROBLEM TO BE SOLVED: To provide an electroconductive member that has stable contact resistance, has a plated film thereon which is hard to be peeled off and can reduce and stabilize an inserting/extracting force when used as a connector, and to provide a production method therefor.
SOLUTION: This electroconductive member has a Ni-based thin layer 3, a Cu-Sn intermetallic compound layer 4 and an Sn-based surface layer 5 formed in this order through an Fe-based underlayer 2, on a surface of a Cu-based substrate 1. The Cu-Sn intermetallic compound layer 4 also further includes a Cu
3 Sn layer 6 arranged on the Ni-based thin layer 3 and a Cu
6 Sn
5 layer 7 arranged on the Cu
3 Sn layer 6. The total thickness X at a recessed portion 8 of the Cu-Sn intermetallic compound layer 4 including the Cu
3 Sn layer 6 and the Cu
6 Sn
5 alloy layer 7 is 0.05-1.5 μm.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有稳定的接触电阻的导电构件，其上具有难以剥离的电镀膜，并且可以在用作连接器时降低并稳定插入/拔出力，并且提供一种生产方法。解决方案：该导电构件具有Ni基薄层3，Cu-Sn金属间化合物层4和通过Fe基底层2依次形成的Sn基表面层5， Cu基基板1.另外，Cu-Sn金属间化合物层4还具有设置在Ni基薄膜3上的CuS 3 Sn 3层6和Cu 6 设置在Cu 3 S 3 Sn层6上的Sn 5 层7.包括Cu 3 Sn层6和Cu＆lt; SB＆gt; Sn＆lt; 5＆lt; 5＆gt; 5＆lt; 5＆gt;合金层7的厚度为0.05-1.5μm。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2010168643A Method and apparatus for producing plated copper strip material 有权
标题翻译：生产铜箔条材料的方法和装置
公开(公告)号：JP2010168643A
公开(公告)日：2010-08-05
申请号：JP2009120780
申请日：2009-05-19
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： FUSA NORIYOSHI , WATANABE SHIGEKAZU , GO YUTAKA , SAITO MITSURU , ISHIKAWA SEIICHI , KUBOTA KENJI , SAKURAI TAKESHI
IPC分类号： C25D5/12 , C25D5/50 , C25D7/06 , C25D17/00 , C25D21/00 , C25D21/10
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a plated copper strip material, by which a plating layer can be efficiently formed by using an inorganic acid bath relatively easy to handle. SOLUTION: The method for producing a plated copper strip material includes forming a metal plating layer in the form of multiple layers on the surface of a copper strip material formed from copper or a copper alloy while continuously traveling the copper strip material and then performing a reflow treatment. Each metal plating layer is formed by an electroplating process, comprising immersing an insoluble anode and the copper strip material into a plating bath composed of a plating solution containing an inorganic acid as a main component and applying an electric current at a current density within the range of 5-60 A/dm 2 while relatively moving the copper strip material and the plating solution in the plating bath so that the Reynolds number becomes within the range of 1×10 4 to 5×10 5 . COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种电镀铜带材的制造方法，通过使用相对容易处理的无机酸浴，能够有效地形成镀层。解决方案：镀铜铜带材的制造方法包括在由铜或铜合金形成的铜带材的表面上形成多层形式的金属镀层，同时连续行进铜带材料，然后进行回流处理。每个金属镀层通过电镀工艺形成，包括将不溶性阳极和铜带材料浸入由含有无机酸作为主要成分的电镀溶液组成的电镀液中，并以在该范围内的电流密度施加电流在将铜带材料和电镀液在电镀槽中相对移动的同时，使得雷诺数变为1×10 4 SP SP 4的范围内，使其为5-60A / dm 2 / SP > 5×10 5 。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2011149037A Method for recycling scrap of copper or copper alloy plated with silver 审中-公开
标题翻译：用铜回收铜或铜合金的方法
公开(公告)号：JP2011149037A
公开(公告)日：2011-08-04
申请号：JP2010009111
申请日：2010-01-19
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI KEN , ISHIKAWA SEIICHI , KUBOTA KENJI
IPC分类号： C25F5/00
摘要： PROBLEM TO BE SOLVED: To provide a recycling method of safely and effectively peeling silver from the scrap of copper or copper alloy wholly or partially plated with silver in a short period of time, and using the scrap of the copper or copper alloy from which a plated silver film has been peeled, as a raw material for producing copper or a copper alloy.
SOLUTION: A recycling method includes: immersing the scrap of the copper or copper alloy plated with silver on its surface into an electrolysis tank in which an electrolytic peeling liquid E containing at least one selected from between an aliphatic organic acid and a salt thereof is stored; and effectively peeling the plated silver film electrolytically by loading an electric potential of 300-1,100 mV with respect to a silver chloride standard electrode 8 onto the scrap C of the copper or copper alloy plated with silver, while using a potentiostat 5.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种从短时间内全部或部分镀银的铜或铜合金的废料安全有效地剥离银的再循环方法，并且使用铜或铜合金的废料作为生产铜或铜合金的原料，已经剥离了镀银银膜。解决方案：回收方法包括：将其表面镀银的铜或铜合金的废料浸入电解槽中，其中含有选自脂族有机酸和盐之中的至少一种的电解剥离液E 存储; 并且在使用恒电位仪5的同时，通过将相对于氯化银标准电极8的电压为300-1100mV的电势加载到镀有银的铜或铜合金的废料C上来有效地剥离镀银银膜。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2011063834A SULFURIC ACID BATH FOR HIGH CURRENT DENSITY Sn PLATING 有权
标题翻译：用于高电流密度镀锡的硫酸浴
公开(公告)号：JP2011063834A
公开(公告)日：2011-03-31
申请号：JP2009214120
申请日：2009-09-16
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ISHIKAWA SEIICHI , KUBOTA KENJI , TAMAGAWA TAKASHI
IPC分类号： C25D3/32 , C25D7/00
摘要： PROBLEM TO BE SOLVED: To provide a sulfuric acid bath for high current density Sn plating which is free from burnt deposit after being worked into a desired complicated shape by a press punching or the like and prevents the occurrence of a large quantity of sludge or bubbles and ensures excellent plating adhesion.
SOLUTION: The sulfuric acid bath contains 30-120 g/L sulfuric acid and 30-150 g/L tin sulfate, as an essential ingredient, and contains: 0.5-5 g/L hydrophilic polyoxyethylene polyoxypropylene block polymer as a brightening agent; 0.025-2.5 g/L ethylene diamine EO-PO addition product; 0.025-2.5 g/L cumyl phenol EO addition product; 0.3-10 g/L pyrogallol or hydroquinone as an antioxidant; and 0.05-1 g/L hydrophobic polyoxyethylene polyoxypropylene block polymer as a defoaming agent.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于高电流密度Sn镀层的硫酸浴，其通过冲压加工等被加工成所需复杂形状之后没有烧结沉积物，并且防止发生大量污泥或气泡，并确保优异的电镀附着力。解决方案：硫酸浴含有30-120g / L硫酸和30-150g / L硫酸锡作为必需成分，并含有：0.5-5g / L亲水聚氧乙烯聚氧丙烯嵌段聚合物作为增白剂剂; 0.025-2.5g / L乙二胺EO-PO加成产物; 0.025-2.5g / L枯烯酚EO加成产物; 0.3〜10g / L连苯三酚或氢醌作为抗氧化剂; 和0.05-1g / L疏水性聚氧乙烯聚氧丙烯嵌段聚合物作为消泡剂。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2011021232A Recycling method for copper or copper alloy scrap subjected to silver plating 审中-公开
标题翻译：铜镀层或铜合金切屑的回收方法
公开(公告)号：JP2011021232A
公开(公告)日：2011-02-03
申请号：JP2009166797
申请日：2009-07-15
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ISHIKAWA SEIICHI , KUBOTA KENJI
IPC分类号： C25F5/00
摘要： PROBLEM TO BE SOLVED: To provide a recycling method with which silver is safely and efficiently peeled from copper or copper alloy scrap subjected to silver plating, and the copper or the copper alloy scrap from which the silver plating has been peeled is used as the raw material for producing copper or a copper alloy.
SOLUTION: The copper or copper alloy scrap C whose surface has been subjected to silver plating is dipped into an electrolytic tank 2 charged with an electrolytic peeling solution E composed of at least one kind selected from aliphatic organic acid and the salt thereof and a nonionic surfactant so as to electrolytically peel the silver plating, and the copper or copper alloy scrap from which the silver plating has been peeled is used as the raw material for producing the copper or the copper alloy.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种使银被安全有效地从经过镀银的铜或铜合金废料上剥离的再循环方法，并且使用已经剥离银镀的铜或铜合金废料作为生产铜或铜合金的原料。将表面经过镀银的铜或铜合金废料C浸渍在电解槽2中，该电解池2装有由脂肪族有机酸及其盐中的至少一种构成的电解剥离液E和非离子表面活性剂，以电解剥离镀银，并且使用已经剥离银镀的铜或铜合金废料作为生产铜或铜合金的原料。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2010280946A Plated copper wire and method for manufacturing the same 有权
标题翻译：镀铜线及其制造方法
公开(公告)号：JP2010280946A
公开(公告)日：2010-12-16
申请号：JP2009134780
申请日：2009-06-04
申请人： Mitsubishi Shindoh Co Ltd , 三菱伸銅株式会社
发明人： SAKURAI TAKESHI , ISHIKAWA SEIICHI , KUBOTA KENJI , TAMAGAWA TAKASHI
IPC分类号： C25D5/12 , C25D3/56 , C25D7/00 , H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide a plated copper wire that is excellent in heat resistance and shows resistance to corrosion, and a method for manufacturing the same. SOLUTION: The plated copper wire has a plurality of plating layers on a surface of a Cu substrate, in which a surface part thereof is composed of a Sn-based plating layer 4 made of Sn or a Sn alloy and having an average thickness of 0.05-1.5 μm, and a Sn-Ag coating layer 5 formed on the Sn-based plating layer 4, and having a hardness of 10-20 Hv and an average thickness of 0.05-0.5 μm. The Sn-Ag coating layer 5 contains Sn particles 11 and Ag 3 Sn particles 12 having average particle sizes of 1-10 μm and 10-100 nm, respectively. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供耐热性优异且耐腐蚀的镀铜铜线及其制造方法。电镀铜线在Cu基板的表面上具有多个镀层，其表面部分由Sn或Sn合金制成的Sn基镀层4构成，平均厚度为0.05-1.5μm，Sn-Ag涂层5形成在Sn基镀层4上，硬度为10-20Hv，平均厚度为0.05-0.5μm。 Sn-Ag被覆层5分别含有平均粒径为1-10μm，10〜100nm的Sn粒子11和Ag 3 SB 3 Sn粒子12。版权所有（C）2011，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式