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    • 1. 发明专利
    • Inspection device and inspection method of semiconductor device
    • 半导体器件的检查装置和检查方法
    • JP2003050264A
    • 2003-02-21
    • JP2001240439
    • 2001-08-08
    • Mitsubishi Electric Corp三菱電機株式会社
    • TANAKA MASARU
    • G01R31/30G01R31/3183H01L21/66
    • PROBLEM TO BE SOLVED: To provide an inspection device of a semiconductor device capable of inspecting simply endurance against a power source noise of the semiconductor device, and reducing the influence of the power source noise when executing an ordinary function test.
      SOLUTION: This inspection device is equipped with a tester 2 for executing an evaluation test of the semiconductor device 1, and an evaluation board 3 for applying a test pattern signal generated from the tester 2 after mounting the semiconductor device 1 to the semiconductor device 1. The tester 2 is constituted so as to generate the test pattern signal simulating the power source noise in addition to the test pattern signal for the function test of the semiconductor device. On the other hand, a noise superimposed circuit 7 for applying the test pattern signal simulating the power source noise from the tester 2 to a power source terminal 1c of the semiconductor device 1 is provided on the evaluation board 3.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:提供一种半导体器件的检查装置,其能够简单地检查半导体器件的电源噪声的耐久性,并且在执行普通功能测试时减少电源噪声的影响。 解决方案:该检查装置配备有用于执行半导体器件1的评估测试的测试器2和用于在将半导体器件1安装到半导体器件1之后施加从测试器2产生的测试图案信号的评估板3。 测试器2被构造成除了用于半导体器件的功能测试的测试图案信号之外,还生成模拟电源噪声的测试图案信号。 另一方面,在评估板3上设置噪声叠加电路7,用于将模拟来自测试器2的电源噪声的测试图案信号施加到半导体器件1的电源端子1c。
    • 4. 发明专利
    • ARRAY ANTENNA FEEDING DEVICE
    • JP2000013138A
    • 2000-01-14
    • JP17134498
    • 1998-06-18
    • MITSUBISHI ELECTRIC CORP
    • NAKAAZE HIROAKIARIGA HIROSHISAKURA TAKESHINEGISHI NORIMITSUTANAKA MASARUMIZUTAME HITOSHI
    • H05K9/00H01P5/08H01Q3/26H01Q23/00
    • PROBLEM TO BE SOLVED: To eliminate the need of a complicated chassis having a wall for separating the respective systems of modules by loading an air-tight package provided with a micro wave integration circuit having the active element of an amplifier or the like, and the connection terminal of a power source and a signal on a multilayer substrate which is integrally formed by a high frequency interruption line or the like and constituting a plurality of modules. SOLUTION: A multilayer substrate 8 which is integrally formed of a plurality of metallic layers and dielectric layers is constituted of a side metallic layer 9 covering the whole side of the multilayer substrate 8 by making the potential of the outermost layer and that of the lowermost layer to be equal, the connection terminals 10 of a power source and a signal, which are installed in the fitting face of the air-tight package 2 to the multilayer substrate 8 and in a range that is installed in metallic ground conductor layers formed on the uppermost layer and the lowermost layer and is covered by the air-tight package 2, and the feeding line of a microwave signal, which is installed in the metallic layer. A plurality of air-tight packages mounting micro wave integration circuits having active elements are mounted on the multilayer substrate 8 and a device mounting a plurality of modules is constituted.
    • 5. 发明专利
    • DATA CONVERSION SYSTEM
    • JPH01155432A
    • 1989-06-19
    • JP31331087
    • 1987-12-11
    • MITSUBISHI ELECTRIC CORP
    • TANAKA MASARU
    • G06F12/00G06F5/00
    • PURPOSE:To make the generation of a program at every file, that of the program at every computer system at a file generating origin, and judgement by an operator unnecessary by performing data conversion according to information in a format file. CONSTITUTION:The program 2-2 inputs data files 2-11 and 2-12 and the format files 2-11a and 2-12a, and performs the data conversion at every item of data from a machine style code and format information stored in the format file, and outputs data files 2-31 and 2-32 based on the code system of its own computer system. The information of the file 2-11 is stored in the file 2-11a, and the machine style code of the transfer origin of the data file is recorded. The machine style code is a value proper to each computer, and the data conversion of the format file itself is performed and the file format of the data file can be recognized by referring to the machine style code.
    • 7. 发明专利
    • MOLDED LIGHTING ARRESTER
    • JPH097806A
    • 1997-01-10
    • JP15771995
    • 1995-06-23
    • MITSUBISHI ELECTRIC CORP
    • OZAKI YUKIOTANAKA MASARUSHICHIMIYA SHOICHINAGASATO TAKURO
    • H01C1/034H01C7/12
    • PURPOSE: To avoid the scattering of a voltage non-linear resistor due to explosion by a method wherein cavities are provided between the main surface of the voltage non-linear resistor and an electrode as well as forming a thin wall part on the part corresponding to the cavities of a mold resin. CONSTITUTION: On a pair of electrodes 11, 12 fixed and connected to both main surfaces 1a, 1b and having the same outer diameter of a voltage non-linear resistor 1, recessions 11a, 12a are formed on the surfaces corresponding to both main surfaces 1a, 1b as well as terminal parts 11b, 12b are protrusively formed on the opposite sides so that peripheral angle parts may be chamferred. On the other hand, cavities 13, 14 are formed between both main surfaces 1a, 1b of the voltage non-linear resistor 1 and respective recessions 11a, 12a of both electrodes 11, 12 so that the resistor 1 and both electrodes 11, 12 may be molded out of mold resin 15 to be integrated leaving both terminal parts 11b, 12b. Besides, arc trenches 15a, 15a are made to form thin wall parts 15b, 15b on the surfaces of the parts corresponding to both cavities 13, 14. Through these procedures, the safety can be enhanced.
    • 8. 发明专利
    • IC HANDLER AND IC MEASUREMENT METHOD
    • JP2000024977A
    • 2000-01-25
    • JP19029398
    • 1998-07-06
    • MITSUBISHI ELECTRIC CORP
    • TANAKA MASARUOSHITA SHOICHI
    • G01R31/26B25J15/06H01L21/66
    • PROBLEM TO BE SOLVED: To properly inhibit the concentration of the stress on an IC element handled by an IC handler by mounting an elastic member having a pressure dispersing function to the IC element comprising an air layer inside thereof on a pick-up. SOLUTION: An air hole 6 for adsorption penetrating through a central part of a pick-up 2 for adsorbing an IC element 1 is communicated with a space (c) existing on an annular central part of a pressure diffuser 10 formed by an annular elastic member, and forms the air passage for adsorption with this, space (c). In the adsorption of the IC element 1, an annular lower surface of the pressure diffuser 10 made of an elastic member and mounted on a point of the pick-up 2 is contacted with a package upper surface of the IC element 1, and the air of the air passage for adsorption formed by the air hole 6 for adsorption and the space (c) is evacuated to the external, whereby the IC element 1 is adsorbed to the pick-up 2 through the pressure diffuser 10. The concentration of the pressure to a part of a lead 3 can be prevented by the deformation of the pressure diffuser 10 even through the parallelism of the IC element 1 and a socket 4 is not complete.