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1. 发明专利

JP2009303299A Rotary electric machine for vehicle 有权
标题翻译：车用旋转电机
公开(公告)号：JP2009303299A
公开(公告)日：2009-12-24
申请号：JP2008151730
申请日：2008-06-10
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIRAKATA YUJI , KIKUCHI MASAO , MAEDA NAOHIDE
IPC分类号： H02K11/00 , H02K19/22
CPC分类号： H01R39/385 , H02K5/141 , H02K5/24 , H02K9/28
摘要： PROBLEM TO BE SOLVED: To obtain a rotary electric machine for a vehicle improved in the vibration proof performance of a connecting point between a field circuit and a brush holder. SOLUTION: In the rotary electric machine for the vehicle including a bracket 1, a stator 2a supported to the bracket 1, and a rotor 3, the rotor 3 includes a field winding 4 for generating a magnetomotive force, and the field circuit 30 for supplying a current to the field winding and the brush holder 8 having a brush 7 are separately attached to the bracket 1. A connecting means for connecting the field circuit 30 and the brush holder 8 includes an intermediate wiring member 34 having a stress relaxation mechanism. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：获得改善场电路和电刷架之间的连接点的防振性能的车辆用旋转电机。解决方案：在包括支架1，支撑在支架1上的定子2a和转子3的车辆用旋转电机中，转子3包括用于产生磁动势的励磁绕组4，并且励磁电路用于向场绕组提供电流的电极30和具有刷子7的电刷架8分开地附接到支架1.用于连接励磁电路30和电刷架8的连接装置包括具有应力松弛的中间配线件34 机制。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2012244670A Rotary electric machine 有权
标题翻译：旋转电机
公开(公告)号：JP2012244670A
公开(公告)日：2012-12-10
申请号：JP2011109969
申请日：2011-05-17
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIRAKATA YUJI , NAKAJIMA YASUSHI , FUJITA NOBUHIKO
IPC分类号： H02P23/00
摘要： PROBLEM TO BE SOLVED: To protect overheat of a rotary electric machine by avoiding increase of a heating value in startup or driving and sharp rise of temperature of a switching element because heat generation of the switching element in starting and driving of an assist or the like is caused by heat generation due to passage of current or heat generation due to loss in switching-off generated by current interruption.SOLUTION: A field current and a phase shift quantity are changed by using arithmetic means 426 in each of a B-terminal voltage and a rotational speed detected by respective detection means 422, 423 from a map stored in map storage means 425 so that voltage rise in switching-off is eased by using avalanche breakdown of a semiconductor switching element for a power circuit and a current allowed to flow into the switching element in switching-off becomes approximately minimum.
摘要翻译：要解决的问题：为了保护旋转电机的过热，避免由于启动和驱动辅助中的开关元件的发热而导致开关元件的启动或驱动中的发热值升高以及开关元件的温度急剧升高由于由于电流中断而产生的关断损失导致的电流或热产生的通过而产生的热量引起。解决方案：通过使用运算装置426，根据存储在地图存储装置425中的映射，通过各个检测装置422,423检测的B端电压和转速中的每一个中的运算装置426改变励磁电流和相移量，从而通过使用用于电源电路的半导体开关元件的雪崩击穿来解除关断中的电压上升，并且在关断时允许流入开关元件的电流变为近似最小。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2009043863A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2009043863A
公开(公告)日：2009-02-26
申请号：JP2007206163
申请日：2007-08-08
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KIMURA SUSUMU , SHIRAKATA YUJI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H05K7/2049 , H01L23/16 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To obtain a semiconductor device that is reduced in size, weight, and cost and improved in performance stability and productivity.
SOLUTION: The semiconductor device 1 includes a semiconductor module 2 in which a semiconductor element is sealed with a resin, a reinforcing beam 4 fixed to the upper surface of the semiconductor module 2 via a plate-like spring 3, and a frame part 6 to which both ends of the reinforcing beam 4 are fixed, the frame part 6 being disposed in such a fashion as to enclose from four directions the outer periphery of the semiconductor module 2, the plate-like spring 3, and the reinforcing beam 4.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：获得尺寸，重量和成本降低的半导体器件，并且提高了性能稳定性和生产率。解决方案：半导体器件1包括其中半导体元件被树脂密封的半导体模块2，经由板状弹簧3固定到半导体模块2的上表面的加强梁4和框架加强梁4的两端固定到的部分6，框架部分6设置成从四个方向围绕半导体模块2的外周，板状弹簧3和加强梁 4.版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2008123897A Circuit breaker device 有权
标题翻译：断路器设备
公开(公告)号：JP2008123897A
公开(公告)日：2008-05-29
申请号：JP2006307805
申请日：2006-11-14
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIRAKATA YUJI , KIMURA SUSUMU
IPC分类号： H01H37/76
摘要： PROBLEM TO BE SOLVED: To provide a circuit breaker device in which a highly reliable circuit breaking performance is realized by preventing a connecting conductor from contacting and conducting again by securely fixing the connecting conductor once separated, and further, which has a simple structure and high productivity and can be made downsized.
SOLUTION: In the circuit breaker device, a first conductive member 2 and a second conductive member 3 are installed on a case 1 having electric insulation, a magnetic conductive member 4 is arranged so as to electrically connect the first conductive member 2 and the second conductive member 3, a support member 5 is adhered to this magnetic conductive member 4, the other end of this support member 5 is supported removably to a fixing member 6 installed on the case 1 through a solder material 7 being a fusible member, a wiring 8 for current flowing and heating is connected to this fixing member 6, and a permanent magnet 9 is installed on the case 1 opposed to the magnetic conductive member 4.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种断路器装置，其中通过防止连接导体通过将连接导体一旦分离牢固地固定而再次接触和进一步实现高可靠性的断路性能，并且还具有简单的结构高，生产效率高，可缩小尺寸。解决方案：在断路器装置中，第一导电构件2和第二导电构件3安装在具有电绝缘的壳体1上，导电构件4被布置成将第一导电构件2和第二导电构件3，支撑构件5粘附到该导电构件4上，该支撑构件5的另一端通过作为可熔构件的焊料7可移除地支撑到安装在壳体1上的固定构件6，用于电流流动和加热的布线8连接到该固定构件6，并且永磁体9安装在与导电构件4相对的壳体1上。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2014086432A Coil device 有权
标题翻译：线圈装置
公开(公告)号：JP2014086432A
公开(公告)日：2014-05-12
申请号：JP2012231412
申请日：2012-10-19
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： MIZUNO TAKAHIRO , YANO TAKUTO , ISHIKURA HISASHI , TAKADA ATSUTOSHI , SUGAYA YUJI , HIRAMATSU DAISUKE , KUMAGAI TAKASHI , TASHIRO SHOJIRO , SHIRAKATA YUJI
IPC分类号： H01F27/22 , H01F27/08 , H01F27/28 , H01F30/00 , H01F37/00
CPC分类号： Y02T10/6204
摘要： PROBLEM TO BE SOLVED: To reduce a coil device in size by improving heat dissipation efficiency of a core body which is formed from a first core thermally coupled to a metallic housing and a second core thermally and magnetically coupled to the first core at a side far from the metallic housing, and built in the metallic housing.SOLUTION: A coil device comprises: a metallic housing 1; a core body which is formed from a first core 3 thermally coupled to the metallic housing and a second core 2 thermally and magnetically coupled to the first core at a side far from the metallic housing, and built in the metallic housing; a winding wire 10 which is wound around the core body and defines the first core and the second core as a magnetic path; a heat dissipation plate 4 brought into surface-contact with a surface of the second core at the side far from the metallic housing; and a presser spring 7 which elastically presses the heat dissipation plate against the surface of the second core at the side far from the metallic housing.
摘要翻译：要解决的问题：通过提高芯体的散热效率来减小线圈装置的尺寸，所述芯体由热耦合到金属壳体的第一芯体和在远侧处被热和磁耦合到第一芯部的第二芯体金属外壳，内置金属外壳。线圈装置包括：金属外壳1; 芯体，其由与金属壳体热耦合的第一芯体3形成，第二芯体2在远离金属壳体的一侧热磁耦合到第一芯体，并且内置在金属壳体中; 缠绕在芯体上并将第一芯体和第二芯线限定为磁路的绕组线10; 散热板4在远离金属壳体的一侧与第二芯体的表面进行表面接触; 以及压力弹簧7，其在远离金属壳体的一侧弹性地将散热板压靠在第二芯的表面上。

6. 发明专利

JP2013165122A Semiconductor device and manufacturing method of the same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2013165122A
公开(公告)日：2013-08-22
申请号：JP2012026425
申请日：2012-02-09
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TAKECHI ATSUSHI , KASHIBA YOSHIHIRO , SHIRAKATA YUJI , NAKAJIMA YASUSHI
IPC分类号： H01L23/40
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which has a stable radiation performance from a semiconductor module even at a high temperature and has good dimensional accuracy; and provide a manufacturing method of the same.SOLUTION: A semiconductor device comprises: a semiconductor module 2 including a semiconductor element 4, and a module-side base plate 6 on which the semiconductor element 4 is arranged on a first surface and a first irregularity part 9 is formed on a second surface opposite to the first surface; and a radiator 3 on which a second irregularity part 12 that fits the first irregularity part 9 is formed on a third surface facing the second surface and which radiates heat generated by the semiconductor element 4. The module-side base plate 6 and the radiator 3 are made of different metal materials, and when either of the first irregularity part 9 or the second irregularity part 12 is plastic-deformed, the semiconductor module 2 and the radiator 3 are fastened to each other.
摘要翻译：要解决的问题：即使在高温下也提供具有来自半导体模块的稳定辐射性能并具有良好尺寸精度的半导体器件; 并提供其制造方法。解决方案：一种半导体器件包括：包括半导体元件4的半导体模块2和其上半导体元件4布置在第一表面上的第一不规则性的模块侧基板6 部分9形成在与第一表面相对的第二表面上; 以及散热器3，在与第二表面相对的第三表面上形成有与第一不规则部分9相配合的第二不规则部分12，辐射由半导体元件4产生的热量。模块侧基板6和散热器3 由不同的金属材料制成，并且当第一不规则部分9或第二不规则部分12中的任一个塑性变形时，半导体模块2和散热器3彼此紧固。

7. 发明专利

JP2011147319A Rotary electric machine with built-in controller 有权
标题翻译：旋转电机带内置式控制器
公开(公告)号：JP2011147319A
公开(公告)日：2011-07-28
申请号：JP2010008325
申请日：2010-01-18
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIRAKATA YUJI , NAKAJIMA YASUSHI , FUJITA NOBUHIKO , KATO MASAKI , SAKAMOTO KAZUYASU , OGA TAKUYA
IPC分类号： H02K11/00 , H02K19/22
CPC分类号： H02P9/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/181 , H01L2924/1815 , H02K11/048 , H02K19/365 , H02P2101/45 , H01L2924/00012 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To obtain a rotary electric machine with built-in controller, capable of mouning power circuit modules and field circuit modules, which are manufactured by a common molding process, without forming a large gap against the heat receiving surface of a heat sink produced by die casting. SOLUTION: The rotary electric machine has a rotary electric machine body 2, the power circuit modules 50A, the field circuit modules, and the heat sink 30 produced by the die casting. The machine includes a controller integrally mounted on the rotary electric machine body 2. The heat sink 30 is protruded and installed on the surface of a base plate 31A, and includes a plurality of protruded heat receiving parts 32A each having the heat receiving surface 32a. The power circuit modules 50A and the field circuit modules each include a sealing body part 59 made of an insulating resin to expose the bottom surface of an element heat radiation part 53 to a surface-shaped reference surface corresponding to a shape of the heat receiving surface 32a, and seal switching elements 52. An insulating support layer 81a is interposed between the heat receiving surface 32a and the bottom surface of the element heat radiating part 53. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了获得具有内置控制器的旋转电机，能够通过普通模制工艺制造的电源电路模块和励磁电路模块，而不形成与接收表面的大间隙的压铸产生的散热片。解决方案：旋转电机具有旋转电机主体2，电源电路模块50A，励磁电路模块和通过压铸制造的散热器30。该机器包括一体地安装在旋转电机体2上的控制器。散热器30突出并安装在基板31A的表面上，并且包括多个具有受热面32a的突出的热接收部32A。电源电路模块50A和励磁电路模块各自包括由绝缘树脂制成的密封体部分59，以将元件散热部分53的底面暴露于对应于受热表面形状的表面形状的基准表面 32a和密封开关元件52.绝缘支撑层81a插入在热接收表面32a和元件散热部分53的底表面之间。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2014204487A 電源装置有权
标题翻译：电源设备
公开(公告)号：JP2014204487A
公开(公告)日：2014-10-27
申请号：JP2013076586
申请日：2013-04-02
申请人：三菱電機株式会社 , Mitsubishi Electric Corp
发明人： SHIRAKATA YUJI , KUMAGAI TAKASHI , NAKAJIMA KOJI , TASHIRO SHOJIRO , YANO TAKUTO , ISHIKURA HISASHI , SUGAYA YUJI , HIRAMATSU DAISUKE
IPC分类号： H02M3/28
摘要：【課題】共振コイルやトランス等のインダクタンス部品を筐体に取り付ける際に、ベースプレートの柱状突起やねじ固定するためのスペースが必要となり、小型化やパワー密度向上の妨げとなっていた。【解決手段】金属製の筐体(基台)400に、第1のコア411とこの第1のコアに磁気的に結合された第2のコア412と第1のコアまたは第2のコアに巻回された巻線413とで構成されたインダクタンス部品110を配置し、インダクタンス部品の第2のコア412の上に基台の遠い側から弾性的に押し付ける押さえバネ410を設け、金属製のカバー420を筐体(基台)400を覆うように筐体400に取り付けた際に、カバー420が押さえバネ410を加圧してインダクタンス部品110を筐体(基台)に押し付け固定するようにした。【選択図】図3
摘要翻译：要解决的问题：为了解决一个问题，即当诸如谐振线圈或变压器之类的电感元件安装在外壳上时，需要一个用于底板的圆柱形突起和用于固定螺钉的空间，这妨碍了尺寸的减小和功率密度提高。解决方案：在金属外壳（基座）400中，布置电感元件110，其由第一芯411，与第一芯磁耦合的第二芯412和绕第一芯缠绕的线413组成或第二核心。在电感元件的第二芯412的表面上设置有从基座更远的一侧弹性按压的按压弹簧410。当金属盖420附接到壳体400以覆盖壳体（基座）400时，盖420牢固地按压按压弹簧410，从而将电感部件110按压到壳体（基座）。

9. 发明专利

JP2011243909A Semiconductor module and rotary electric machine on which semiconductor module is mounted 有权
标题翻译：半导体模块安装的半导体模块和旋转电机
公开(公告)号：JP2011243909A
公开(公告)日：2011-12-01
申请号：JP2010117081
申请日：2010-05-21
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIRAKATA YUJI , NAKAJIMA YASUSHI , FUJITA NOBUHIKO
IPC分类号： H01L25/07 , H01L25/18 , H02K11/00 , H02K19/10 , H02M7/48
CPC分类号： H01L2224/0603 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49111 , H01L2224/49175 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module capable of reducing the number of wires and the number of signal terminals for connection to a pad for temperature sensing, and being miniaturized.SOLUTION: The semiconductor module includes first and second semiconductor switching elements 21a and 21b, connected in series, and first and second metal frames 23a and 23b on which the first and second semiconductor switching element 21a and 21b are mounted respectively. A temperature measuring element 25 is formed on at least one semiconductor switching element 21a of the first and second semiconductor switching elements. Molding by resin-sealing is so made as to encapsulate the first and second semiconductor switching elements 21a and 21b as well as the first and second metal frames 23a and 23b. A temperature measuring terminal 22b is connected only to the temperature measuring element 25 of one semiconductor switching element 21a of the first and second semiconductor switching elements 21a and 21b.
摘要翻译：要解决的问题：提供一种半导体模块，其能够减少用于连接到用于温度感测的焊盘并且被小型化的导线数量和信号端子的数量。解决方案：半导体模块包括串联连接的第一和第二半导体开关元件21a和21b以及分别安装有第一和第二半导体开关元件21a和21b的第一和第二金属框架23a和23b。温度测量元件25形成在第一和第二半导体开关元件的至少一个半导体开关元件21a上。通过树脂密封的成型被制成为封装第一和第二半导体开关元件21a和21b以及第一和第二金属框架23a和23b。温度测量端子22b仅连接到第一和第二半导体开关元件21a和21b的一个半导体开关元件21a的温度测量元件25。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2014099460A Current auxiliary member and printed circuit board 有权
标题翻译：当前的辅助会员和印刷电路板
公开(公告)号：JP2014099460A
公开(公告)日：2014-05-29
申请号：JP2012249384
申请日：2012-11-13
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NAKAJIMA KOJI , IGARASHI HIROSHI , SHIRAKATA YUJI , MAZAKI YOSHINOBU
IPC分类号： H05K1/11 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a current auxiliary member capable of reducing electric resistance, flowing a large current by improving heat dissipation, and improving processability and solderability, and a printed circuit board having the same.SOLUTION: A current auxiliary member 1 has four or more of terminals 2, a conductive connection part 3, and heat dissipation parts 4. Four or more of terminals 2 are used for connecting to a conductive part 11. The conductive connection part 3 is arranged so as to face to a surface of a printed circuit board 10, and electrically connects four or more of terminals 2 with each other. The heat dissipation parts 4 extend from the conductive connection part 3 to an opposite side of the printed circuit board. The heat dissipation part 4 is arranged along a side connecting two terminals 2 of four or more of terminal 2, and the heat dissipation part 4 at a side surface 4A of the dissipation part 4 of at least one of two terminals 2, has a notch 5 at a root part connected to the conductive connection part 3.
摘要翻译：要解决的问题：提供一种能够降低电阻的电流辅助部件，通过改善散热来流动大电流，并且提高加工性和可焊性，以及具有该电流的辅助部件以及具有该电流的辅助部件。或更多的端子2，导电连接部3和散热部件4.四个或更多个端子2用于连接到导电部分11.导电连接部分3布置成面向印刷电路板10，并且将四个以上的端子2彼此电连接。散热部分4从导电连接部分3延伸到印刷电路板的相对侧。散热部4沿着连接端子2的四个以上的端子2的一侧配置，在两个端子2的至少一个的散热部4的侧面4A处的散热部4具有切口在与导电连接部分3连接的根部处。

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