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1. 发明专利

JP2014120519A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2014120519A
公开(公告)日：2014-06-30
申请号：JP2012272489
申请日：2012-12-13
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： OKUDA TOSHIO
IPC分类号： H01L23/12
CPC分类号： H01L23/5226 , H01L23/3121 , H01L23/3677 , H01L23/49822 , H01L23/49827 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/1531 , H01L2924/00012 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of incorporating a bypass capacitor into a circuit board while forming a ground pattern and a back electrode on a lower surface side of the circuit board.SOLUTION: A semiconductor device comprises: a first metal pattern 30a and a second metal pattern 30b formed on a lower surface of a multilayer substrate 10; a dielectric 32 formed so as to cover the first metal pattern 30a and the second metal pattern 30b on the lower surface of the multilayer substrate 10; a ground pattern 40 and a back electrode 42 formed on a lower surface of the dielectric 32; and a first dielectric inner via 34 connecting the ground pattern 40 and the first metal pattern 30a. A bypass capacitor is formed of the back electrode 42, the dielectric 32, and the first metal pattern 30a.
摘要翻译：要解决的问题：提供一种能够在电路板的下表面侧形成接地图案和背面电极的同时将旁路电容器并入电路板的半导体器件。解决方案：半导体器件包括：第一金属图案 30a和形成在多层基板10的下表面上的第二金属图案30b; 形成为覆盖多层基板10的下表面上的第一金属图案30a和第二金属图案30b的电介质32; 形成在电介质32的下表面上的接地图案40和背面电极42; 以及连接接地图案40和第一金属图案30a的第一电介质内通孔34。旁路电容器由背面电极42，电介质32和第一金属图案30a形成。

2. 发明专利

JP2011146807A High frequency amplifier 有权
标题翻译：高频放大器
公开(公告)号：JP2011146807A
公开(公告)日：2011-07-28
申请号：JP2010004272
申请日：2010-01-12
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： OKUDA TOSHIO
IPC分类号： H03F3/60
CPC分类号： H03F3/60 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2223/6633 , H01L2223/6644 , H01L2224/48227 , H01L2224/49111 , H01L2924/00014 , H01L2924/1903 , H01L2924/19039 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H03F2200/423 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a high frequency amplifier of a simple configuration operable in a plurality of frequency bands without the need for a control circuit for changing the matching conditions.
SOLUTION: The high frequency amplifier has: a package substrate; an amplifying active device disposed on a top surface of the package substrate; and a transmission line connected to the amplifying active device and transmitting a high frequency signal. It also has: a SMD component shunt-connected at one end to the transmission line; a SMD component terminal connected to the other end of the SMD component and partially exposed at a back surface of the package substrate; and an external terminal partially exposed on the back surface of the package substrate and connected to the opposite side end of the transmission line connected to the amplifying active device.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种在多个频带中可操作的简单配置的高频放大器，而不需要用于改变匹配条件的控制电路。
解决方案：高频放大器具有：封装衬底; 设置在所述封装衬底的顶表面上的放大有源器件; 以及连接到放大有源器件并传输高频信号的传输线。它还具有：SMD组件在一端分流连接到传输线; SMD组件端子，连接到SMD组件的另一端并部分地暴露在封装衬底的背面; 以及外部端子，其部分地露出在封装基板的背面并连接到与放大有源器件连接的传输线的相对侧端。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2004247918A High frequency circuit 审中-公开
公开(公告)号：JP2004247918A
公开(公告)日：2004-09-02
申请号：JP2003035016
申请日：2003-02-13
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： OKUDA TOSHIO
IPC分类号： H01P1/20 , H01P1/00 , H01P1/203 , H01P1/212 , H01P7/00 , H01P7/08 , H03F3/60 , H03G3/30
摘要： PROBLEM TO BE SOLVED: To provide a high frequency circuit which is suitable for a mobile radio terminal and enables precise output control.
SOLUTION: The circuit is provided with a high-frequency power amplifier 21 for amplifying a high frequency signal, a coupler 23 for monitoring the output signal of the high-frequency power amplifier, an output control IC 26 for controlling an output level of the high-frequency power amplifier 21 on the basis of a monitor signal from the coupler 23, and a transmission line 25 and an output monitor terminal 33 for taking a detection signal from the coupler 23 outside. A capacitor 41 for interrupting an unnecessary harmonic wave is provided between the transmission line 25 and the ground.
COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2003008470A High frequency module 审中-公开
标题翻译：高频模块
公开(公告)号：JP2003008470A
公开(公告)日：2003-01-10
申请号：JP2001188332
申请日：2001-06-21
申请人： Kyocera Corp , Mitsubishi Electric Corp , 三菱電機株式会社 , 京セラ株式会社
发明人： NAKAMATA KATSURO , ISOYAMA SHINJI , SHIMURA TERUYUKI , OKUDA TOSHIO
IPC分类号： H01P1/15 , H03F3/60 , H04B1/44
CPC分类号： H01L2224/16225 , H01L2224/48091 , H01L2924/3011 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a high frequency module that can integrate and downsize circuit components from a branching circuit, which branches a plurality of transmission reception system signals with different pass bands to respective transmission reception system signals, to a power amplifier and has an excellent characteristic. SOLUTION: A layered board comprising a plurality of layered dielectric layers 11-18 of the high frequency module is provided with a branching circuit DIP 10 that branches a plurality of transmission/reception system signals to respective transmission/reception system signals, switch circuits SW 10, 20 that switch each transmission/reception signal into a transmission system TX signal and a reception system RX signal, with power amplifiers AMP 10, 20 comprising high frequency amplification semiconductor elements and matching circuits MAT 10, 20 that amplify transmission signals with pass frequencies of each transmission system TX and with couplers COP 10, 20 that monitor outputs.
摘要翻译：要解决的问题：提供一种高频模块，其可以将来自分支电路的电路组件的集成和小型化，该分支电路将具有不同通带的多个发送接收系统信号分散到相应的发送接收系统信号，并且具有优秀的特点。解决方案：包括高频模块的多层分层电介质层11-18的分层板设置有分支电路DIP10，其将多个发送/接收系统信号分支到相应的发送/接收系统信号，开关电路SW 10 ，20，其将每个发送/接收信号切换成传输系统TX信号和接收系统RX信号，功率放大器AMP 10,20包括高频放大半导体元件和匹配电路MAT 10,20，其放大具有通过频率的传输信号每个传输系统TX以及监视输出的耦合器COP 10,20。

5. 发明专利

JP2012244324A High frequency device 有权
标题翻译：高频器件
公开(公告)号：JP2012244324A
公开(公告)日：2012-12-10
申请号：JP2011111081
申请日：2011-05-18
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： OKUDA TOSHIO
IPC分类号： H01P5/18
摘要： PROBLEM TO BE SOLVED: To provide a high frequency device that can monitor a high frequency signal transmitted through a transmission line and that is advantageous in downsizing.SOLUTION: A high frequency device includes: a transmission line for transmitting a high frequency signal; a chip inductor close to the transmission line so as to be electromagnetically coupled with the transmission line; and a monitor port connected to one end of the chip inductor.
摘要翻译：要解决的问题：提供一种可以监测通过传输线传输的高频信号的高频装置，并且有利于减小尺寸。解决方案：高频装置包括：用于发送高频信号的传输线; 靠近传输线的芯片电感器，以便与传输线电磁耦合; 以及连接到芯片电感器的一端的监视器端口。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2003008469A High frequency module 有权
标题翻译：高频模块
公开(公告)号：JP2003008469A
公开(公告)日：2003-01-10
申请号：JP2001188331
申请日：2001-06-21
申请人： Kyocera Corp , Mitsubishi Electric Corp , 三菱電機株式会社 , 京セラ株式会社
发明人： NAKAMATA KATSURO , ISOYAMA SHINJI , SHIMURA TERUYUKI , OKUDA TOSHIO
IPC分类号： H05K1/02 , H01L25/00 , H01P1/15 , H03F3/60 , H04B1/44
CPC分类号： H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a high frequency module that can integrate and downsize circuit components from a branching circuit which branches a plurality of transmission/reception system signals with different pass bands to respective transmission/reception system signals to a power amplifier and has an excellent characteristic. SOLUTION: A layered board comprising a plurality of layered dielectric layers 11-18 of the high frequency module is provided with a branching circuit DIP 10 that branches a plurality of transmission/reception system signals to respective transmission/reception system signals, switch circuits SW 10, 20 that switch each transmission/reception signal into a transmission system TX signal and a reception system RX signal and with power amplifiers AMP 10, 20 comprising high frequency amplification semiconductor elements and matching circuits MAT 10, 20 that amplify transmission signals with pass frequencies of each transmission system TX.
摘要翻译：要解决的问题：提供一种高频模块，其能够将来自分支电路的电路组件的集成和小型化，该分支电路将具有不同通带的多个发送/接收系统信号分散到相应的发送/接收系统信号到功率放大器，并且具有优秀的特点。解决方案：包括高频模块的多层分层电介质层11-18的分层板设置有分支电路DIP10，其将多个发送/接收系统信号分支到相应的发送/接收系统信号，开关电路SW 10 ，20，其将每个发送/接收信号切换成传输系统TX信号和接收系统RX信号，以及包括高频放大半导体元件的功率放大器AMP 10,20和匹配电路MAT 10,20，放大具有通过频率的传输信号每个传输系统TX。

7. 发明专利

JP2000332542A BIAS CIRCUIT OF MULTISTAGE POWER AMPLIFIER AND ITS BIAS SUPPLYING METHOD 失效
公开(公告)号：JP2000332542A
公开(公告)日：2000-11-30
申请号：JP14014999
申请日：1999-05-20
申请人： MITSUBISHI ELECTRIC CORP
发明人： CHOMEI KENICHIRO , MORI KAZUTOMI , INOUE AKIRA , OKUDA TOSHIO
IPC分类号： H03F3/21 , H03F1/26 , H03F1/30 , H03F3/19 , H03F3/72 , H04B1/04 , H04B1/10
摘要： PROBLEM TO BE SOLVED: To obtain a bias circuit of the multistage power amplifier, composed of HBTs amplifying the power of a high-frequency signal, which can suppress an increase of Rx noise in the output power reduction of the multistage power amplifier and its bias supplying method. SOLUTION: For an HBT 11a constituting the initial-stage amplifier of the power amplifier 2, a signal Vapc inputted from an external control circuit 17 is outputted to its base, and bias currents from constant-voltage circuits 22b and 22c operating under the control of the signal Vapc are supplied to the bases of HBTs 11b and 11c forming other amplifiers of the power amplifier 2.

8. 发明专利

JPH06132416A HIGH-FREQUENCY INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH06132416A
公开(公告)日：1994-05-13
申请号：JP30309092
申请日：1992-10-14
申请人： MITSUBISHI ELECTRIC CORP
发明人： OKUDA TOSHIO
IPC分类号： H01L23/12 , H01P5/02 , H05K1/14
摘要： PURPOSE:To reduce an MIC substrate small-sized, to decrease the size of a circuit as a whole and to reduce the production cost of a circuit device by a method wherein another MIC substrate whose dielectric constant is high is stacked on the MIC substrate and a circuit pattern which requires a large layout area is formed on the MIC substrate whose permittivity is high. CONSTITUTION:A substrate 14 whose dielectric constant is higher than that of a substrate 13 and in which an open stub 31 has been formed on the surface is stacked on the substrate 13 in which an MIC pattern 21 has been formed. When the stub 31 which requires a comparatively large layout area is formed on the substrate 14 whose wavelength shortening coefficient is large, the stub whose impedance is the same as a long line length can be realized by a short line length. When the substrate 14 is mounted on the surface of the main substrate 13, the size of the main substrate 13 can be reduced and a device can be made small-sized as a whole.

9. 发明专利

JPH05251631A 失效
公开(公告)号：JPH05251631A
公开(公告)日：1993-09-28
申请号：JP4682092
申请日：1992-03-04
申请人： MITSUBISHI ELECTRIC CORP
发明人： OKUDA TOSHIO
IPC分类号： H01L23/12 , H01L25/04 , H01L25/18 , H01P1/00
摘要： PURPOSE:To miniaturize a circuit by using a high dielectric-constant board as a bias circuit board and forming a circuit element to the board. CONSTITUTION:Four bias circuits exist in parallel. Metallized sections 1 among the bias circuits inhibit the mutual effects of the bias circuits. A metallized section 3 is grounded. Gold wires, etc., are used for connection with the metallized sections 1, an active section and a lead frame. Length in the longitudinal direction of the metallized sections is set equal to a quarter of a processing wavelength, thus forming an inductor, then preventing the intrusion to a DC power supply of microwaves. Accordingly, when a board having a dielectric constant of 2000 or more is used, the magnitude of the bias circuit can be made half that of conventional devices.

10. 发明专利

JPH05327322A HIGH FREQUENCY FILTER 失效
公开(公告)号：JPH05327322A
公开(公告)日：1993-12-10
申请号：JP16013192
申请日：1992-05-26
申请人： MITSUBISHI ELECTRIC CORP
发明人： OKUDA TOSHIO
IPC分类号： H01P7/08
摘要： PURPOSE:To cut off one or two kinds of waves or more without forming any short-circuit point on a high frequency transmission line only with an MIC line. CONSTITUTION:An MIC line 11 having a certain length is arranged on the high frequency transmission line, and an MIC line 12 having a length adding a length lambda/2 of the 1/2 wavelength of a frequency lambda1 to be cut to the length of the above-mentioned MIC line is added parallelly to the MIC line 11. Therefore, since the filter is composed of only the MIC lines, the accuracy as the filter is improved, and the yield is improved. Further, since the above-mentioned filter is added to the input side of an amplifier and waves at the 1/2 frequency of an amplified frequency are cut, stable amplification is obtained.

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