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1. 发明专利

JP2010107365A Inspection device for substrate connection 有权
标题翻译：用于基板连接的检查装置
公开(公告)号：JP2010107365A
公开(公告)日：2010-05-13
申请号：JP2008279905
申请日：2008-10-30
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KANETANI MASAO , SUGIHARA TAKESHI , ZUSHI YUJI
IPC分类号： G01R31/28 , G01R1/06 , G01R31/04
摘要： PROBLEM TO BE SOLVED: To provide an inspection device for substrate connection capable of detecting a failure in connection and determining whether a measured substrate is good or defective even with the failure in connection.
SOLUTION: The inspection device 1 for substrate connection includes a probe unit 7 equipped with probes 8, an interface substrate 5, a TDR measuring device 10 for measuring electric characteristics, and a personal computer 15. The plurality of probes 8 are concurrently in contact with a plurality of lands provided on a printed board 2. A pulse generated by the TDR measuring device is input from the probe into the land, and in addition reflected waves are measured. By comparing a reflection waveform of the reflected waves with a reference waveform, whether or not the probe has a failure in connection can be determined.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够检测连接故障的基板连接检查装置，并且即使连接失败，也可以确定测量的基板是良好还是有缺陷的。＆lt; P＆gt;解决方案：用于基板连接的检查装置1包括具有探针8，接口基板5，用于测量电特性的TDR测量装置10和个人计算机15的探针单元7.多个探针8同时与设置在印刷电路板2上的多个焊盘接触。由TDR测量装置产生的脉冲从探头输入到焊盘，并且另外测量反射波。通过将反射波的反射波形与参考波形进行比较，可以确定探头是否具有连接故障。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2010093207A Wiring structure for solder bond inspection of printed circuit board 有权
标题翻译：印刷电路板焊接检查接线结构
公开(公告)号：JP2010093207A
公开(公告)日：2010-04-22
申请号：JP2008264429
申请日：2008-10-10
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIMAZAKI MUTSUMI , KANETANI MASAO
IPC分类号： H05K3/34 , H05K1/11
摘要： PROBLEM TO BE SOLVED: To obtain a wiring structure for solder bond inspection which achieves the measurement of impedance difference according to the bonded state of a solder bond portion using TDR, in a printed circuit board having the solder bond portion.
SOLUTION: The printed circuit board includes transmission lines 4, 7 of transmission delay time Ls, which connect between pads 2, 5 to which a terminal for power feeding of electronic components to be mounted is solder-bonded and power feeding layers 3, 6, test pads 8, 9 arranged in the position where the transmission delay time from the pads on the transmission lines is Lt (Lt≤Ls/2). When the test pads 8, 9 are arranged apart from the transmission lines 4, 7, between the test pads 8, 9 and the transmission lines 4, 7 is connected through branch transmission lines 10, 11 whose transmission delay time is a (a≤Ls-Lt).
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：在具有焊料接合部分的印刷电路板中，获得焊接接合检查的接线结构，其实现使用TDR的焊接接合部分的接合状态下的阻抗差的测量。
解决方案：印刷电路板包括传输延迟时间Ls的传输线路4,7，其连接在焊盘2,5之间，用于供电的电子部件的端子焊接到其上并且馈电层3 ，6，布置在从传输线上的焊盘的传输延迟时间为Lt（Lt≤Ls/ 2）的位置的测试焊盘8,9。当测试焊盘8,9与传输线路4,7分开时，测试焊盘8,9与传输线路4,7之间的传输延迟时间为（a≤ LS-LT）。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2004363276A High-frequency circuit module 审中-公开
公开(公告)号：JP2004363276A
公开(公告)日：2004-12-24
申请号：JP2003159016
申请日：2003-06-04
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KANETANI MASAO
IPC分类号： H01L23/12 , H01P5/02
摘要： PROBLEM TO BE SOLVED: To obtain a high-frequency circuit module in which the reflection of a high frequency generated in the connecting section of a carrier substrate and a main substrate is reduced and the deterioration of high-frequency characteristics by the connecting section of the carrier substrate and the main substrate is prevented. SOLUTION: The high-frequency circuit module has the main substrate 103, the carrier substrates 102 loaded on the main substrate 103, a semiconductor element 101 joined on the carrier substrates and connecting sections 108 connecting a first signal conductor 105 on the main substrate and second signal conductors 106 on the carrier substrates. The surface height of the carrier substrates is constituted so as to coincide with that of the main substrate, and discontinuous sections of impedance in the connecting sections are eliminated while a distribution constant line such as a microstrip line transmitting a high-frequency signal is connected continuously without a shape change. COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2012053010A Tdr type testing apparatus 有权
标题翻译： TDR型测试仪
公开(公告)号：JP2012053010A
公开(公告)日：2012-03-15
申请号：JP2010197919
申请日：2010-09-03
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KANETANI MASAO , NAKANO KAZUKI
IPC分类号： G01R31/26 , G01R31/04
摘要： PROBLEM TO BE SOLVED: To facilitate the execution of a TDR test of various types of LSIs having solder balls with same pitch and same shape but different pin assignments.SOLUTION: A testing apparatus according to a present invention includes: a TDR device for generating a TDR signal; a signal branch substrate formed with branches for selecting a connecting destination of the TDR signal generated by the TDR device; a first probe having a first thickness; a second probe having a second thickness which is thinner than the first thickness; a probe socket in which a plurality of through-holes corresponding to the first thickness are opened into a grid shape; and a locking socket substrate which has a plurality of locking holes corresponding to the second thickness opened into a grip shape and in which the TDR signal whose connecting destination is branched by the signal branch substrate is input. The surface of the locking socket substrate is formed with a GND wiring, and electrodes formed at side face parts of the locking holes are connected to the branches of the signal branch substrate corresponding to each other.
摘要翻译：要解决的问题：为了便于执行具有相同间距和相同形状但具有不同引脚分配的焊球的各种类型的LSI的TDR测试。解决方案：根据本发明的测试设备包括：TDR设备，用于产生TDR信号; 形成有用于选择由TDR装置生成的TDR信号的连接目的地的分支的信号分支基板; 具有第一厚度的第一探针; 具有比第一厚度薄的第二厚度的第二探针; 其中与第一厚度相对应的多个通孔被打开成网格形状的探针插座; 以及锁定插座基板，其具有与所述第二厚度相对应的多个锁定孔，所述第二厚度被打开成夹持形状，并且其中输入了由所述信号分支基板分支的连接目的地的TDR信号。锁定插座基板的表面形成有GND布线，并且形成在锁定孔的侧面部分的电极连接到彼此对应的信号分支基板的分支。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011075498A Inspection apparatus, and inspection method 审中-公开
标题翻译：检验仪器和检验方法
公开(公告)号：JP2011075498A
公开(公告)日：2011-04-14
申请号：JP2009229634
申请日：2009-10-01
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NAKANO KAZUKI , KANETANI MASAO
IPC分类号： G01R31/04 , G01R31/28 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide an inspection apparatus and method, capable of easily resolving a pseudo contact and detecting fine defects such as cracks and so on by an electric inspection.
SOLUTION: The inspection apparatus inspects a conductive state between an inspection object substrate 6 having an electronic component 10 mounted on a mounting surface thereon and the electronic component 10. The apparatus includes a holding means 8 for holding the inspection object, heat treatment means 3 and 4 for selectively heating or cooling the electronic component 10 so that the electronic component 10 is warped by a temperature gradient, and an inspection means 1 for inspecting the conductive state between the electronic component 10 and the substrate 6 with the electronic component 10 being warped.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种检查装置和方法，其能够容易地解决伪接触并且通过电检查来检测诸如裂纹等的细小缺陷。
解决方案：检查装置检查安装在其上的电子部件10的检查对象基板6与电子部件10之间的导电状态。该装置包括用于保持检查对象的保持机构8，热处理用于选择性地加热或冷却电子部件10以使得电子部件10由温度梯度翘曲的装置3和4以及用于通过电子部件10检查电子部件10和基板6之间的导电状态的检查装置1 被扭曲。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2009250761A Substrate connection inspection apparatus 审中-公开
标题翻译：基板连接检查装置
公开(公告)号：JP2009250761A
公开(公告)日：2009-10-29
申请号：JP2008098335
申请日：2008-04-04
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KANETANI MASAO , SHIMAZAKI MUTSUMI , ISHII HIROYUKI
IPC分类号： G01R31/02 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a substrate connection inspection apparatus for inspecting in a short time connections between a semiconductor device and a mounting substrate mounted with the semiconductor device, and for detecting a defective article.
SOLUTION: The substrate connection inspection apparatus 1 includes a probe section 7 wherein probes 8 are arranged, an interface substrate 5, a TDR measuring instrument 10, and a personal computer 15. The plurality of probes 8 are simultaneously brought into contact with a plurality of lands 4 provided on the printed substrate 2 mounted with the semiconductor device 50. Along with inputting pulses generated in the TDR measuring instrument 10 from the probes to the lands, reflected waves reflected after being input are measured.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于在半导体器件和安装有半导体器件的安装基板之间的短时间连接中检查并检测缺陷物品的基板连接检查装置。＆lt; P＆gt;解决方案：基板连接检查装置1包括其中布置有探针8的探针部分7，界面基底5，TDR测量仪器10和个人计算机15.多个探针8同时与设置在安装有半导体器件50的印刷基板2上的多个焊盘4.除了在TDR测量仪器10中从探针到焊盘输入脉冲之外，还测量在输入之后反射的反射波。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2005085815A Wavelength stabilizing unit 审中-公开
标题翻译：波长稳定单元
公开(公告)号：JP2005085815A
公开(公告)日：2005-03-31
申请号：JP2003312997
申请日：2003-09-04
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KANETANI MASAO , KITAGAWA FUSAYASU , UTO KENICHI
IPC分类号： H01S5/0687
摘要： PROBLEM TO BE SOLVED: To obtain a wavelength stabilizing unit for performing the wavelength control of a laser beam stably at high speed.
SOLUTION: A wavelength stabilizing unit is equipped with an LD 101 which is capable of changing a laser beam in wavelength with a temperature change; a Peltier element 102 and a Peltier drive circuit 110 which control the temperature of the LD 101; a thermistor 109 which detects the temperature of the LD 101; a PD1 (104) which detects the volume of light emitted from the LD 101 as a first PD current; a PD2 (105) which detects light penetrating through an etalon filter 103 as a second PD current so as to detect a wavelength; and a memory in which a table is previously stored wherein the temperature of the LD 101, the wavelength of a laser beam emitted from the LD 101, the first PD current, and the second PD current are measured while the LD 101 is changed in temperature, and are tabled with the measurement data as a target value. A CPU 107 computes a present wavelength from outputs of the PD2 and the PD1, and the present wavelength is compared with the data stored in the memory to detect a present position for control.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：获得用于稳定地高速执行激光束的波长控制的波长稳定单元。解决方案：波长稳定单元配备有能够随温度变化改变波长的激光束的LD 101; 控制LD 101的温度的珀耳帖元件102和珀尔帖驱动电路110; 检测LD 101的温度的热敏电阻109; PD1（104），其检测从LD 101发射的光的体积作为第一PD电流; PD2（105），其检测穿过标准具滤光器103的光作为第二PD电流，以便检测波长; 以及存储器，其中预先存储表格，其中LD 101的温度，从LD 101发射的激光束的波长，第一PD电流和第二PD电流被测量，同时LD 101的温度变化，并将测量数据作为目标值。 CPU 107从PD2和PD1的输出计算当前波长，并将本波长与存储在存储器中的数据进行比较，以检测当前位置进行控制。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2014055803A Inspection method and inspection apparatus of semiconductor device 审中-公开
标题翻译：半导体器件的检查方法和检查装置
公开(公告)号：JP2014055803A
公开(公告)日：2014-03-27
申请号：JP2012199688
申请日：2012-09-11
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KANETANI MASAO , ISHII HIROYUKI
IPC分类号： G01R31/26
摘要： PROBLEM TO BE SOLVED: To provide an inspection method of a semiconductor device which can identify a defective part of the semiconductor device without breaking the semiconductor device.SOLUTION: The inspection method of a semiconductor device includes: a first process of performing a first step of applying a pulse wave to each of a plurality of measurement positions through a coaxial probe 15 connected to each of the plurality of measurement positions of a diode 5 which is a semiconductor element, and a second step of measuring a reflection wave which is a pulse wave reflected from the diode 5 through the coaxial probe 15, sequentially for each of the plurality of measurement positions; and a second process of calculating a defective part 2 of the diode 5 on the basis of a plurality of reflection waves measured at the plurality of measurement positions.
摘要翻译：要解决的问题：提供一种可以识别半导体器件的缺陷部分而不破坏半导体器件的半导体器件的检查方法。解决方案：半导体器件的检查方法包括：执行第一步骤的第一步骤通过连接到作为半导体元件的二极管5的多个测量位置中的每一个的同轴探头15向多个测量位置中的每一个施加脉搏波，以及测量作为脉冲波的反射波的第二步骤通过同轴探针15从二极管5反射，对于多个测量位置中的每一个依次反射; 以及基于在多个测量位置处测量的多个反射波来计算二极管5的缺陷部分2的第二处理。

9. 发明专利

JP2011191185A Inspection apparatus and manufacturing method of electronic apparatus 审中-公开
标题翻译：电子设备的检查装置和制造方法
公开(公告)号：JP2011191185A
公开(公告)日：2011-09-29
申请号：JP2010057667
申请日：2010-03-15
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NAKANO KAZUKI , KANETANI MASAO
IPC分类号： G01R31/04 , G01R31/28
摘要： PROBLEM TO BE SOLVED: To provide an inspection apparatus for inspecting a plurality of objects to be measured, in a short time, by using a low-cost and simple apparatus, and to provide a manufacturing method of an electronic apparatus.
SOLUTION: The inspection apparatus for applying pulse to a connection in the electronic apparatus via a probe 22, and for inspecting an electrical connection of the connection by measuring a reflection wave of the pulse includes a pulse generator 41 for generating the pulse; transmission paths 3, 23 for transmitting the pulse generated by the pulse generator 41; a distributor 24 for distributing the pulse transmitted from the transmission paths 3, 23, and transmitting a plurality of the distributed pulses, from a plurality of connection ends 24a to the probe 22; and measurement apparatuses 4, 5 for measuring the reflection wave from the electronic apparatus, when a plurality of the pulses distributed by the distributor 24 are applied to the connection in the electronic apparatus.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于在短时间内通过使用低成本和简单的装置来检查多个被测量物体的检查装置，并提供电子设备的制造方法。解决方案：用于通过探针22向电子设备中的连接施加脉冲并且通过测量脉冲的反射波检查连接的电连接的检查装置包括用于产生脉冲的脉冲发生器41; 用于发送由脉冲发生器41产生的脉冲的传输路径3,23; 分配器24，用于分配从传输路径3,23发送的脉冲，并将多个分布式脉冲从多个连接端部24a传送到探头22; 以及当由分配器24分配的多个脉冲施加到电子设备中的连接时，用于测量来自电子设备的反射波的测量装置4,5。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2011149790A Substrate connection inspection apparatus 审中-公开
标题翻译：基板连接检查装置
公开(公告)号：JP2011149790A
公开(公告)日：2011-08-04
申请号：JP2010010729
申请日：2010-01-21
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KANETANI MASAO , NAKANO KAZUKI
IPC分类号： G01R31/04 , G01R31/28
摘要： PROBLEM TO BE SOLVED: To provide a substrate connection inspection apparatus capable of easily measuring a substrate section to be measured having a different electrode arrangement as an object to be measured.
SOLUTION: The substrate connection inspection apparatus 1 includes a TDR measuring device 3, a signal distribution substrate section 5, and a relay board section 21. The signal distribution substrate section 5 includes a signal distribution substrate main body 7, relay board probes 9, and a high-frequency relay 11. The relay board section 21 includes a relay board main body 23 and probes 24 for a substrate to be measured. The probes 24 for a substrate to be measured are arranged correspondingly to the arrangement of electrodes 37 formed in a substrate section to be measured 31 to be an object to be measured.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够容易地测量具有不同电极布置的待测量的基板部分作为待测量对象的基板连接检查装置。＆lt; P＆gt;解决方案：基板连接检查装置1包括TDR测量装置3，信号分配基板部分5和中继板部分21.信号分配基板部分5包括信号分配基板主体7，中继板探针 9和高频继电器11.继电器板部分21包括中继板主体23和用于待测基板的探头24。用于待测量基板的探针24对应于形成在待测量的基板部分31中的电极37的布置成为待测对象。版权所有（C）2011，JPO＆INPIT

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