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1. 发明专利

JP2008227260A Electronic device 审中-公开
标题翻译：电子设备
公开(公告)号：JP2008227260A
公开(公告)日：2008-09-25
申请号：JP2007065051
申请日：2007-03-14
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KOBAYASHI YUTAKA , ISHIKAWA TETSUSHI
IPC分类号： H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide an electronic device in which a plurality of units are installed and whose contact cooling area is made large to dissipate heat generated by electronic components in the units while securing the insertability/extractability of the units.
SOLUTION: The electronic device is so configured that auxiliary cooling plates 8 connected to a cooling surface 6 through hinges 7 are added, and that the auxiliary cooling plates 8 are rotated by rotation of the hinges 7 to make a heat dissipating section of the unit 3 sandwiched between a cooling plate and the auxiliary cooling plates 8 and contacted therewith, thereby increasing contact areas 61, 62 of the unit 3 and the cooling plate to decrease the thermal resistance of contact portions.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种其中安装了多个单元并且其接触冷却区域大的电子设备，以在确保单元的可插入性/可提取性的同时散发单元中的电子部件产生的热量。解决方案：电子设备被配置成使得通过铰链7连接到冷却表面6的辅助冷却板8被添加，并且辅助冷却板8通过铰链7的旋转而旋转，从而使散热部分单元3夹在冷却板和辅助冷却板8之间并与之接触，从而增加了单元3和冷却板的接触区域61,62，以降低接触部分的热阻。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2008227054A Electronic device 审中-公开
标题翻译：电子设备
公开(公告)号：JP2008227054A
公开(公告)日：2008-09-25
申请号：JP2007061625
申请日：2007-03-12
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ISHIKAWA TETSUSHI
IPC分类号： H05K7/20 , H01L23/34 , H01L23/473 , H05K7/18
摘要： PROBLEM TO BE SOLVED: To provide a cooling member which minimizes a temperature difference between an electronic component mounted in an electronics module and a cooling liquid for cooling the electronic component and supplied from the outside and which is excellent in terms of maintenance nature at the time of the removal of the electronics module.
SOLUTION: A radiation surface which is in contact with and thermally connected with a cooling plate 18 and an attaching surface on which a plurality of modules 9 on which a heat generative electronic component is mounted are attached, are provided. A circulation flow path for a cooling medium, in which a compressor 43 and an expansion valve 48 are provided, is formed between the attaching surface and the radiation surface. The module is thus cooled by use of a cooling cycle.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种冷却构件，其使安装在电子模块中的电子部件与用于冷却电子部件并从外部供给的冷却液之间的温差最小化，并且在维护性方面优异在移除电子模块时。解决方案：提供与冷却板18和安装表面接触并热连接的辐射表面，其上安装有生热电子部件的多个模块9。在安装表面和辐射表面之间形成有用于设置有压缩机43和膨胀阀48的冷却介质的循环流路。因此，通过使用冷却循环来冷却模块。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007324212A Module with built-in microchannel and module assembly 审中-公开
标题翻译：具有内置微型通道和模块组件的模块
公开(公告)号：JP2007324212A
公开(公告)日：2007-12-13
申请号：JP2006150117
申请日：2006-05-30
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： CHIBA HIROSHI , ISHIKAWA HIROAKI , AYA ATSUSHI , SUMIYA HIROAKI , KITAMURA YOICHI , NAMATAME MASAAKI , MATSUOKA HIROAKI , ISHIKAWA TETSUSHI , TSUYAMA YASUNORI , NAKAJIMA KOJI
IPC分类号： H01L23/473 , H01L23/40
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To obtain a module with a built-in microchannel wherein a microchannel and a carrier are readily joined together, while keeping with alignment accuracy high, and to obtain a module assembly. SOLUTION: A pair of alignment projections 15 are provided on the surface of a carrier 12, protruding upright in such a manner that their flat alignment surfaces 15a are set perpendicular to the surface of the carrier 12 and cross each other at right angles. A cooling medium supply path 16 and a cooling medium discharge path 17 are bored in the carrier 12 away from each other by a prescribed distance, by making the directions of the flow paths 16 and 17 cross the surface of the carrier 12 at right angles. A heat sink structure 1 is aligned, with the sides of its base substance are brought into contact with the alignment surfaces 15a of the alignment projections 15, and joined to the carrier 12. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了获得具有内置微通道的模块，其中微通道和载体容易地接合在一起，同时保持高对准精度，并获得模块组件。解决方案：一对对准突起15设置在载体12的表面上，突出的方式使得它们的平坦对准表面15a垂直于载体12的表面设置并以直角彼此交叉。通过使流路16和17的方向成直角地与载体12的表面交叉，将冷却介质供给路径16和冷却介质排出路径17彼此远离地规定距离地开口。对准散热器结构1，其基体的侧面与对准突起15的对准表面15a接触，并与载体12接合。（C）2008，JPO＆INPIT

4. 发明专利

JP2004119939A Cooling device 有权
公开(公告)号：JP2004119939A
公开(公告)日：2004-04-15
申请号：JP2002285079
申请日：2002-09-30
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NAKAO KAZUNARI , CHIBA HIROSHI , KASHIBA YOSHIHIRO , ISHIKAWA TETSUSHI , MATSUO KUNIFUMI
IPC分类号： F25D9/00 , H01L23/473 , H05K7/20
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To obtain a cooling device provided with an efficient cooling function, in which the refrigerant is not limited to an insulating liquid, and which is suitable for a conductive refrigerant, without having to select the kinds of the refrigerants, such as a conductive liquid, an insulating liquid, and a gas, and which does not increase a flow rate of the refrigerant. SOLUTION: The cooling device is provided with a base plate, a plurality of arc-shaped wires whose respective both ends are jointed to the base plate, a lid part in which a channel part to flow the refrigerant in-between the base plate is formed and which is arranged in contact with or in close vicinity to the wires, and an inlet and an outlet of the refrigerant to the channel part. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2007250752A Electronic equipment 审中-公开
标题翻译：电子设备
公开(公告)号：JP2007250752A
公开(公告)日：2007-09-27
申请号：JP2006071005
申请日：2006-03-15
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ISHIKAWA TETSUSHI
IPC分类号： H05K7/20
摘要： PROBLEM TO BE SOLVED: To solve the problem wherein electronic equipment is inferior in maintainability because modules provided to the apparatus are required to be dismounted one by one when a check is conducted in a case, in which the modules are separately liquid-cooled down by bringing a cooling board into contact with each module containing electronic components. SOLUTION: The electronic equipment is configured in such a manner that a cooling unit 12 provided with a cooling medium passage and a board circuit are mounted on a lattice-shaped chassis composed of frames which are uniform in cross section in a longer direction, a block 4 mounted with two or more modules 9 is inserted in the chassis, heat dissipating plates 42 which dissipate heat internally generated heat are provided to the block 4, and the coolers of the frames are made to bear against the heat dissipating plates of the block 4. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题为了解决电子设备的可维护性差的问题，因为在对模块进行分离的情况下进行检查时，需要逐个拆卸设置在设备上的模块，通过使冷却板与包含电子部件的每个模块接触来冷却。解决方案：电子设备被构造成使得设置有冷却介质通道和板电路的冷却单元12安装在由长方形截面均匀的框架构成的格子状底盘上将安装有两个或更多个模块9的块4插入到底盘中，将散热热内部产生的热的散热板42提供到块4，并且使框架的冷却器抵靠散热板块4.版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006245114A Cooling member 审中-公开
标题翻译：冷却会员
公开(公告)号：JP2006245114A
公开(公告)日：2006-09-14
申请号：JP2005055977
申请日：2005-03-01
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SUGIURA YASUSUKE , ISHIKAWA TETSUSHI
IPC分类号： H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a cooling member which suppresses a temperature difference between an electronic component mounted inside an electronics module and a cooling medium for cooling the electronic component which is supplied from outside, and has a good maintenability at the time of removing the electronics module.
SOLUTION: The cooling member includes a chassis 7 which has a heat radiation surface in contact with and thermally connected to a cooling plate 3, and a mounting surface with a plurality of modules 2 mounted with the pyrogenetic electronic component 8, and which is formed with passages 20 and 21 wherein an actuation liquid which evaporates and condenses between the mounting surface and the heat radiation surface is sealed; and a fixing member which fixes the chassis 7 by bringing the heat radiation surface of the chassis 7 into contact with the cooling plate 3.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种冷却构件，其抑制安装在电子模块内部的电子部件与用于冷却从外部供应的电子部件的冷却介质之间的温度差，并且具有良好的维护性去除电子模块。解决方案：冷却构件包括具有与冷却板3接触并热连接的散热表面的底架7和具有安装有热电电子部件8的多个模块2的安装表面，并且其中形成有通道20和21，其中在安装表面和散热表面之间蒸发并冷凝的致动液体被密封; 以及固定构件，其通过使底架7的散热面与冷却板3接触来固定底盘7.版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005244014A Heat sink and cooling apparatus 有权
标题翻译：热水和冷却装置
公开(公告)号：JP2005244014A
公开(公告)日：2005-09-08
申请号：JP2004053246
申请日：2004-02-27
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： CHIBA HIROSHI , NAKAO KAZUNARI , ISHIKAWA HIROAKI , YAMAUCHI EIJI , NAKAJIMA KOJI , SUGIURA YASUSUKE , ISHIKAWA TETSUSHI , MAEKAWA HIROTOSHI
IPC分类号： H05K7/20 , H01L23/36
摘要： PROBLEM TO BE SOLVED: To provide a heat sink, having high heat transfer rate on the backs of projections formed, in order to increase the heat transmission area and thereby having high cooling capacity.
SOLUTION: The heat sink 2 is provided with a base 4 having a first face 4a, thermally connected to a heating element 3 and projections 6 formed on a second face 4b, which is located on a side of the base 4 opposite to the first face 4a and constitutes a part of a cooling medium passage. An inclined face 6a, having an attack angle with respect to the main flow of the cooling medium is formed on each projection 6. The inclined face 6a is formed so that an intersecting line with an XZ plane rectangular to the cooling medium main flow direction (Y direction) makes an acute angle with the normal direction (Z direction) of the second face 4b. Since the inclined face 6a is formed, in a state inclined from the second face 4b on a position observed from the cooling medium main flow direction, a pair of asymmetrical vertical eddies, having respectively different turning radii, are generated. Thereby, a stagnation region on the back side of the projection 6 is reduced, due to the vertical eddies having large rotational radii and heat transfer rate on the back of the projection can be improved.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供散热器，在形成的突起的背面上具有高传热率，以增加传热面积，从而具有高冷却能力。解决方案：散热器2设置有底座4，底座4具有热连接到加热元件3的第一面4a和形成在第二面4b上的突起6，第二面4b位于与基座4相对的一侧第一面4a构成冷却介质通道的一部分。在每个突起6上形成具有相对于冷却介质的主流的攻角的倾斜面6a。倾斜面6a形成为与冷却介质主流动方向（XZ）成矩形的XZ平面的交线 Y方向）与第二面4b的法线方向（Z方向）成锐角。由于倾斜面6a形成在从冷却介质主流动方向观察的位置处从第二面4b倾斜的状态下，产生分别具有不同的转动半径的一对不对称的垂直涡流。由此，由于具有大的旋转半径的垂直涡流，突起6的后侧上的停滞区域减小，并且能够提高突起的背面的传热率。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2005203528A Cooling member and electronic apparatus 审中-公开
标题翻译：冷却部件和电子设备
公开(公告)号：JP2005203528A
公开(公告)日：2005-07-28
申请号：JP2004007675
申请日：2004-01-15
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SUGIURA YASUSUKE , ISHIKAWA TETSUSHI
IPC分类号： F28D15/02 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a cooling member which can suppress temperature difference between an electronic component mounted into an electronics module and a coolant for cooling the electronic component inside the cooling member.
SOLUTION: The electronic device comprises an electronics module which accommodates a heat generating electronic component and is provided with an internal path for flow of the coolant, a plurality of supplying ports and exhausting ports which are communicated with the internal flow path of the electronics module, a supplying flow path for supplying the coolant to the internal flow path of each electronics module through the supplying port, an exhausting flow path for exhausting the coolant from the internal flow path of each electronics module via the exhausting port, and a structural member comprising a supplying flow path and an exhausting flow path.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可以抑制安装在电子模块中的电子部件与用于冷却冷却部件内部的电子部件的冷却剂之间的温度差的冷却部件。解决方案：电子设备包括电子模块，其容纳发热电子部件，并且设置有用于冷却剂流动的内部路径，多个供应端口和排出端口，其与所述冷却剂的内部流动路径连通电子模块，用于通过供应端口将冷却剂供应到每个电子模块的内部流动路径的供应流动路径，用于经由排气口从每个电子模块的内部流动路径排出冷却剂的排气流动路径，以及结构构件包括供给流路和排气流路。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2009277694A Liquid-cooled electronic apparatus 审中-公开
标题翻译：液体冷却电子设备
公开(公告)号：JP2009277694A
公开(公告)日：2009-11-26
申请号：JP2008124754
申请日：2008-05-12
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： MATSUOKA HIROAKI , ISHIKAWA TETSUSHI
IPC分类号： H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a liquid-cooled electronic apparatus capable of improving cooling performance.
SOLUTION: The liquid-cooled electronic apparatus has plate-like metal first and second bases 1 and 2, a plurality of electronic parts 3 including a heating part mounted on both the first and second bases 1 and 2, a cooling unit 4 sandwiched between the first and second bases 1 and 2, a metal ring 5 sandwiched between the first and second bases 1 and 2 so as to surround a cooling unit 4, and a ring-shaped gasket 6 sandwiched between the first and second bases 1 and 2 so as to surround the cooling unit 4 on the inside of the metal ring 5.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够改善冷却性能的液冷电子设备。解决方案：液冷电子设备具有板状金属第一和第二基座1和2，多个电子部件3，其包括安装在第一和第二基座1,2上的加热部件，冷却单元4 夹在第一和第二基座1和2之间的金属环5，夹在第一和第二基座1和2之间以围绕冷却单元4的金属环5和夹在第一和第二基座1和第二基座1之间的环形垫片6 以便围绕金属环5的内部的冷却单元4。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2009253140A Electronic equipment 审中-公开
标题翻译：电子设备
公开(公告)号：JP2009253140A
公开(公告)日：2009-10-29
申请号：JP2008101274
申请日：2008-04-09
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ISHIKAWA TETSUSHI
IPC分类号： H05K7/20
摘要： PROBLEM TO BE SOLVED: To obtain electronic equipment that reduces replacement work of a plurality of electronics modules while maintaining the cooling performance inside the electronics module.
SOLUTION: The electronic equipment is configured, such that a plurality of blocks are stored in a line inside each of a plurality of compartments formed in between each inlet-side flow passage 4A, 4B and each outlet-side flow passage 5; each partition wall 33 partitioning the compartments is formed with a plurality of communication holes 7 communicating with each inlet-side flow passage 4A, 4B and each outlet-side flow passage 5; each flange part of each block face-to-face bonded onto each partition wall 33 is formed with an inflow hole communicating with each communication hole 7 so as to allow a coolant to flow into the inside of each block, and an outflow hole communicating with each communication hole 7 so as to allow the coolant cooling modules to flow out to the outside.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：获得减少多个电子模块的替换工作同时保持电子模块内部的冷却性能的电子设备。解决方案：电子设备被构造成使得多个块被存储在形成在每个入口侧流动通道4A，4B和每个出口侧流动通道5之间的多个隔室的每一个内的管线中; 分隔隔室的每个分隔壁33形成有与每个入口侧流动通道4A，4B和每个出口侧流动通道5连通的多个连通孔7; 每个块的每个凸缘部分被接合到每个分隔壁33上形成有与每个连通孔7连通的流入孔，以使冷却剂流入每个块的内部，并且与每个连通孔7，以使冷却剂冷却模块能够流出到外部。版权所有（C）2010，JPO＆INPIT

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