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    • 1. 发明专利
    • Tap switching device
    • TAP切换装置
    • JP2010258266A
    • 2010-11-11
    • JP2009107681
    • 2009-04-27
    • Mitsubishi Electric Corp三菱電機株式会社
    • MIHARA YUJIKINOSHITA YOSHIMIFURUKAWA SHIGEYOSHIYAMASHITA KUNIO
    • H01F29/04H01H1/56H01H33/66
    • PROBLEM TO BE SOLVED: To provide a tap switching device that can be made compact. SOLUTION: A changeover switch 22 of the tap switching device 101 includes an output member 89 which rotates on a predetermined axis 71, a plurality of fixed contacts 63 electrically connected to different taps, respectively, a movable contact 81 which operates as the output member 89 rotates to selectively connect with the plurality of fixed contacts 63, a first vacuum valve VSR connected between a predetermined node and a current limiting resistance R, and a second vacuum valve VSM connected between the predetermined node and the movable contact 81, wherein the movable contact 81, the plurality of fixed contacts 63, the first vacuum valve VSR, and the second vacuum valve VSM are provided crossing the same plane orthogonal to the predetermined axis 71, and the movable contact 81 is provided inside the plurality of fixed contacts 63, the first vacuum valve VSR, and the second vacuum valve VSM in a radial direction centering on the predetermined axis 71. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供可以制造成小型的抽头切换装置。 抽头切换装置101的切换开关22包括:在预定轴线71上旋转的输出构件89,分别与不同抽头电连接的多个固定触头63,可动触点81作为 输出构件89旋转以选择性地连接多个固定触点63,连接在预定节点和限流电阻R之间的第一真空阀VSR和连接在预定节点和可动触点81之间的第二真空阀VSM,其中 与可动接点81,多个固定接点63,第一真空阀VSR以及第二真空阀VSM交叉设置在与规定轴线71正交的同一平面上,可动接点81设置在多个固定接点 63,第一真空阀VSR和第二真空阀VSM沿径向以预定轴线71为中心。版权所有(C)2011,JPO&INPI Ť
    • 3. 发明专利
    • LASER BEAM WIDTH ENLARGING MECHANISM
    • JPH01128483A
    • 1989-05-22
    • JP28797287
    • 1987-11-12
    • MITSUBISHI ELECTRIC CORP
    • KOBAYASHI TOSHIYUKINISHIDA YOSHIHIDEKINOSHITA YOSHIMIODA MASAO
    • G02B27/09H01L21/205H01S3/00H01S3/101
    • PURPOSE:To enlarge laser beam width at low cost and to enable distribution of light intensity relatively uniform by using a laser beam high-speed parallel traveling part for obtaining a wide laser beam and a mirror system consisting of a plane mirror. CONSTITUTION:A laser beam A1 with a beam diameter of c is reflected by a laser beam high-speed parallel traveling part 5 and becomes a wide laser beam A2, thus entering a mirror system 6. Then, it is reflected by plane mirrors 6A and 6B and a wide laser beam A3 is folded as it is accumulated on the inciding side laser beam A2 in parallel and in width direction, thus entering a mirror system 7. Then, being reflected by plane mirrors 7A and 7B, a wide laser beam A4 is folded back as it is accumulated on the laser beam A3 in parallel and in width direction, thus entering a mirror system 8. Then, being reflected by plane mirrors 8A and 8B, a wide laser beam A5 is folded back as it is accumulated on the laser beam A4 in parallel and in width direction, reaches a laser beam absorber 9, thus resulting in extinction. Therefore, by allowing a laser beam high-speed parallel traveling part 5 to perform reciprocating motion at high speed between arrows B11 and B12, a laser beam in an elliptic shape whose longer diameter is d and shorter diameter is c at the sectional area with uniform light intensity distribution can be formed.
    • 4. 发明专利
    • THIN FILM FORMING DEVICE
    • JPS6483669A
    • 1989-03-29
    • JP24230587
    • 1987-09-25
    • MITSUBISHI ELECTRIC CORP
    • KOBAYASHI TOSHIYUKINISHIDA YOSHIHIDEKINOSHITA YOSHIMIODA MASAO
    • H01L21/205C23C16/48C23C16/50H01L21/31
    • PURPOSE:To efficiently form a thin film having a uniform film thickness with good efficiency at a high film forming speed by introducing a gaseous material and gaseous plasma into a reaction chamber, then projecting a laser beam and driving a substrate at an uniform speed by driving of a driving mechanism while discharging an exhaust gas. CONSTITUTION:A substrate holding and heating member 3 which holds and heats the substrate 2 is disposed in the reaction chamber 1. On the other hand, the gaseous material such as silane is supplied from a gaseous material feed port 25 and further, the gaseous plasma obtd. by converting a reactive gas such as N2O to plasma by a plasma device 7 is introduced from a gaseous plasma feed port 28 into the chamber. The laser beam 9 generated by a laser beam oscillator 10 is introduced through a transmission window 15 for introducing the laser beam into the chamber. The above- mentioned gas for film formation is thereby cracked and the thin film of Si3N4, etc., is formed on the surface of the above-mentioned substrate 2. The gas after the film formation reaction is discharge from a discharge port 11. The above-mentioned substrate holding and heating member 3 is moved at the constant speed in an arrow C-D direction by driving of the driving mechanism 24 at this time. The distances between the feed ports 25, 28 and the discharge port 11 is, therefore, shortened and the uniformity of the flow of the gas is improved.
    • 5. 发明专利
    • SYSTEM FOR MANUFACTURE OF SEMICONDUCTOR
    • JPS6376320A
    • 1988-04-06
    • JP22251586
    • 1986-09-18
    • MITSUBISHI ELECTRIC CORP
    • ODA MASAOKOBAYASHI TOSHIYUKIOTOMO YOSHIMIKINOSHITA YOSHIMI
    • H01L21/31H01L21/205H01L21/263
    • PURPOSE:To eliminate the need to remove a reaction product adhering to a light- incidence window from a reaction chamber and to efficiently facilitate the removal of the reaction product by a system wherein an ultrasonic generator is installed at the light-incidence window. CONSTITUTION:If a reaction gas is introduced into a reaction chamber 1 from the direction of an arrow 4, this reaction gas is excited by a beam of light from a light source 2 and is decomposed. A reaction product produced by this process is deposited on a substrate 5, and a thin film is formed. If the reaction product adheres to a light- incidence window 6 and the transmissivity of the beam of light is-lowered, the reaction product which has adhered to the lightincidence window 6 can be removed in such a way that an ultrasonic generator 10 slightly vibrates the light-incidence window 6 at a high frequency of, e.g., higher than several kHz. Because the reaction chamber 1 is of vertical structure, the removed reactionproduct is discharged to the outside of the system through an outlet installed at the lower part of the reaction chamber 1 without contaminating the inside wall, etc. of the reaction chamber. By installing the ultrasonic generator at the light-incidence window in this manner, it is possible to efficiently remove the reaction product which adheres to the light-incidence window and to improve the processing efficiency and the throughput.
    • 6. 发明专利
    • PRODUCTION APPARATUS FOR SEMICONDUCTOR
    • JPS6341016A
    • 1988-02-22
    • JP18572286
    • 1986-08-06
    • MITSUBISHI ELECTRIC CORP
    • ODA MASAOKOBAYASHI TOSHIYUKIKINOSHITA YOSHIMIOTOMO YOSHIMIYOSHIZAWA KENJITAKI MASAKAZU
    • H01L21/302H01L21/205H01L21/263H01L21/31
    • PURPOSE:To shorten a space between a substrate and a light source, and to increase optical illuminance by keeping the inside of a light source chamber under decompression in response to the degree of vacuum in a reaction chamber while using a substrate anchor block as a ground electrode and arranging a counter electrode sufficiently transmitting beams on the inside of the reaction chamber of a beam entrance window. CONSTITUTION:The inside of a device is evacuated, a discharge stop valve 18b is closed and the inside of the device is maintained under the state of decompression, thus simply removing pressure difference between a reaction chamber 1 and a light source chamber 2 on film formation extremely easily. Consequently, the plate thickness of a beam entrance window 7 can be thinned, and a light source 6 can be brought near to the substrate 5 side without lowering light transmittance by the increase of plate thickness. Accordingly, a thin-film can be shaped under the state in which optical illuminance on the substrate 5 is elevated sufficiently, thus remarkably improving the efficiency of formation of the thin-film. When a reaction product adheres on the light source chamber 2 side of the beam entrance window 7 and light transmittance lowers on film formation, the arrangement of a counter-electrode 14 and a substrate anchor block 3 as a ground electrode and etching by plasma discharge utilizing evacuation action on the inside of the light source chamber 2 are used, thus eliminating the lowering of light transmittance.
    • 8. 发明专利
    • Semiconductor manufacturing equipment
    • 半导体制造设备
    • JPS61108124A
    • 1986-05-26
    • JP23074584
    • 1984-11-01
    • Mitsubishi Electric Corp
    • KOBAYASHI TOSHIYUKIOTOMO YOSHIMIKINOSHITA YOSHIMIODA MASAO
    • H01L21/205H01L21/263
    • H01L21/6719C23C16/4583C23C16/482H01L21/67115
    • PURPOSE:To augment and equalize the intensity of illumination by a method wherein, when reaction gas contained in a reaction chamber is irradiated with light making photochemical initiation to deposit thin films on a substrate arranged in the reaction gas, linear lamp groups are respectively arranged outside the slopes of almost isoceles triangular section of the reaction chamber while the reaction gas is supplied from the top of the chamber. CONSTITUTION:A reaction chamber 11 containing a substrate 5 to deposit thin films is composed of almost isoceles triangular while light entrance windows 6 made of light transmitting material are provided on the two slopes to arrange respective linear lamp groups 12 outside the slopes. Besides, an inlet 7 with a nozzle 17 for supplying reaction gas 4 is provided on the top of reaction chamber 11 while an opposing outlet 8 is formed on the bottom surface. On the other hand, a movable table 19 with a heater 3 built-in is provided on the bottom surface to mount a substrate 5 on the table 19 to be slided by means of a connector 19a and a ball screw 23 etc. In such a constitution, the distances between the peripheral parts and central part of substrate 5 and the lamp groups may be differentiated from one another to form thin films with even film thickness.
    • 目的:通过一种方法来增强和均衡照明强度,其中当反应室中包含的反应气体被照射光化学引发以在布置在反应气体中的基板上沉积薄膜时,线性灯组分别布置在外部 反应室的大致等角三角形部分的斜面,同时从室的顶部供应反应气体。 构成:包含用于沉积薄膜的基板5的反应室11由几乎等角三角形组成,而在两个斜面上设置由透光材料制成的光入口窗6,以将各个线性灯组12布置在斜坡外。 此外,在反应室11的顶部设置有用于供给反应气体的喷嘴17的入口7,同时在底面形成有相对的出口8。 另一方面,内置加热器3的可移动台19设置在底面上,以便通过连接器19a和滚珠丝杠23等将基板5安装在桌子19上以被滑动。在这种 外围部分和基板5的中心部分与灯组之间的距离可以彼此不同以形成具有均匀膜厚度的薄膜。