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1. 发明专利

JPS59134854A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：JPS59134854A
公开(公告)日：1984-08-02
申请号：JP896383
申请日：1983-01-21
申请人： Mitsubishi Electric Corp
发明人： HIROSE MINETAROU , KAMIMURA SHIYUNICHI , NAKAGAWA KOUICHI , BANJIYOU TOSHINOBU
IPC分类号： H01L23/02 , H01L23/12 , H01L23/50
CPC分类号： H01L23/12 , H01L2224/48247
摘要： PURPOSE:To obtain a semiconductor device which is airtight, has a strength against impact and is readily assembled by superposing a middle cover having a recess for a cover which passes between longitudinal and perpendicular end faces on a base, on which a semiconductor element is mounted, and covering a cover having a window at the position corresponding to the element in the recess. CONSTITUTION:A ceramic middle cover 9 of ceramic material is sealed with glass 10 on a sealer 4 of a base 1, and the fixing part of an external lead 3 is sealed. A recess end 9b which is perpendicular to the longitudinal direction is formed at the center of the cover 9, and a hole 9a which has an area larger than the recess of the base 1 is formed on the part opposed to the element in the recess 9b. A cover 11 which is formed so that an ultraviolet ray passing glass window 7 is formed in the same plane as the surface is superposed on the recess 9b at the opposed position to the element, and fixed with a sealer 12. According to this structure, the fixed part of the lead 3 can be sufficiently sealed, no removable of the cover 11 occurs due to an impact, the mounting of the cover is facilitated, and an automatic assembling can be performed.
摘要翻译：目的：为了获得气密的半导体器件，具有抵抗冲击的强度，并且通过将具有用于覆盖半导体元件的基底上的在纵向和垂直端面之间通过的盖的凹部的中间盖叠置在一起而容易地组装并且覆盖在与凹部中的元件相对应的位置处具有窗口的盖。构成：陶瓷材料的陶瓷中间盖9用玻璃10密封在基座1的密封件4上，外部引线3的固定部分被密封。在盖9的中央部形成有与长度方向垂直的凹部9b，在与凹部9b的元件相对的部分形成有比基体1的凹部大的面积的孔9a 。形成为使得紫外线透过玻璃窗7形成在与元件相对的位置处与凹槽9b重叠的同一平面上的盖11，并且用密封件12固定。根据该结构，引线3的固定部分可以被充分地密封，由于冲击而不会发生盖11的可移除，因此容易安装盖，并且可以进行自动组装。

2. 发明专利

JPS58185793A Partial plating device for lead frame 失效
标题翻译：引导框架的部分镀层装置
公开(公告)号：JPS58185793A
公开(公告)日：1983-10-29
申请号：JP6904282
申请日：1982-04-23
申请人： Mitsubishi Electric Corp
发明人： TOKUNAGA TAKAO , BANJIYOU TOSHINOBU , SUEZAKI HIDEAKI , TANAKA YOUJI
IPC分类号： C25D5/02 , C25D7/00 , H01L23/48 , H01L23/50
摘要： PURPOSE: To improve production capacity and to reduce cost by providing a guide rail in such a way that a lead frame moves in parallel on the guide rail, and feeding and discharging the frame to and from the rail by means of frame feed pawls.
CONSTITUTION: A lead frame 1 is set on a temporary placement rail 12, and a feed pawl 14 is moved downward to the rear of the frame 1 by means of an air cylinder 16. An air cylinder 17 operates to advance a conveyor table 15 which transfers the frame 1 onto a guide rail 9, then the pawl 14 ascends and retreats. A press plate 7 is moved downward by the operation of an air cylinder 22, and a guide rail holder 18 contacts a guide rail holding tabel 24; further, a pin hole 1a for positioning the frame 1 is inserted onto a pilot pin 6, and the plate 7 presses a mask jig 2. The plate 7 on completion of the plating work ascends and the table 15 moves to (a)→(b)→(c)→(d) so that the frame 1 is removed from the rail 9 and is placed on a rail 13.
COPYRIGHT: (C)1983,JPO&Japio
摘要翻译：目的：通过以引导框架在导轨上平行移动的方式提供导轨，并通过框架进给爪将框架与轨道进给和排出，从而提高生产能力并降低成本。构成：引线架1设置在临时放置轨道12上，并且进给爪14通过气缸16向下移动到框架1的后部。气缸17操作以使输送台15前进将框架1转移到导轨9上，然后棘爪14上升和后退。压板7通过气缸22的操作向下移动，导轨保持架18接触导轨保持片24; 此外，将用于定位框架1的销孔1a插入到引导销6上，并且板7按压掩模夹具2.在电镀操作完成时，板7上升，并且台15移动到（a）（b ）（c）（d），使得框架1从导轨9移除并放置在轨道13上。

3. 发明专利

JPS58137235A HERMETIC SEALING METHOD FOR SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPS58137235A
公开(公告)日：1983-08-15
申请号：JP2020382
申请日：1982-02-09
申请人： MITSUBISHI ELECTRIC CORP
发明人： OOSAKA SHIYUUICHI , BANJIYOU TOSHINOBU
IPC分类号： H01L23/02 , H01L21/50
摘要： PURPOSE:To obtain hermetic sealing method for semiconductor package which assures sealing within a short period of time by forming metallized layer to the edge of ceramic cover, and forming, after plating such layer, a soluble metal layer on said plated layer. CONSTITUTION:A ceramic package 4 comprising a recess 2 for housing a semicondutor element 1 and a lead 3 is prepared. At the periphery of ceramic cover 8, a high melting point metallized layer 9 is formed corresponding to a metallized layer 5. A plating layer 10 is formed thereon and a soluble metal layer 11 is formed thereon. The ceramic cover 8 on which such soluble metal layer 11 is integrated is placed in such a way that it overlaps on the side edge of aperture of the package 4. The soluble metal layer 11 is melted when said package passes through the heating furnace. Thereby the ceramic cover 8 and package 4 are integrated through melting of the metal layer.

4. 发明专利

JPS58135646A MANUFACTURE OF RESIN SEALED TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS58135646A
公开(公告)日：1983-08-12
申请号：JP1851482
申请日：1982-02-05
申请人： MITSUBISHI ELECTRIC CORP
发明人： TOKUNAGA TAKAO , SHINOHARA TOSHIAKI , MICHII KAZUNARI , BANJIYOU TOSHINOBU
IPC分类号： H01L21/56
摘要： PURPOSE:To eliminate the damage and wear of a blade as well as to contrive improvement in workability of the titled semiconductor device by a method wherein the resin protruding from the resin part, which is formed when the resin process for formation of the resin sealed part to be used for the sealing of a semiconductor chip, is removed using a high-pressure liquid stream. CONSTITUTION:When the mold IC, for which a resin sealing process has been perfomred, is placed on a supporting stand 11 and a high-pressure water stream 15 is jetted against burrs 10 from a nozzle 16, the burrs 10 are cut off from the resin sealed part 9 by the impact force of the high-pressure water stream jetted on the burrs. As the burrs are removed from the resin sealed part 9 using the high-pressure water stream 15 as above-mentioned, the damage and wear of a blade is eliminated and the workability of the removing work of th burrs 10 can be improved.

5. 发明专利

JPS5817640A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5817640A
公开(公告)日：1983-02-01
申请号：JP11666481
申请日：1981-07-24
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAKAGAWA KOUICHI , TACHIKAWA TOORU , BANJIYOU TOSHINOBU
IPC分类号： B41M1/30 , H01L23/00 , H01L23/544 , H05K1/02 , H05K1/18
摘要： PURPOSE:To enable to trace a rod history even if a conventional marking is vanished and to automatically process a semiconductor by forming a readable type marking on the surface of the device and forming a bar code type marking at the prescribed positions. CONSTITUTION:In a drawing, numeral 1 designates an IC, 2 a front surface, while 3 a back surface. The surface 2 is a surface which necessitates identifying by a personnel a marking even after the IC1 is eventually mounted on a printed board. On the surface 2 is printed marking characters 4 in the size of the degree capable of reading by the personnel. On the surface 3 is printed a bar code marking 5 which is not read by the personnel but capable of being identified for the information by converting the optical information into an electric signal. Even if the characters 4 capable of being identified by the personnel on the surface 2 are, for example, vanished, the tracing of the rod history can be performed by the marking 5 of the bar code.

6. 发明专利

JPS5715434A BONDING APPARATUS 失效
公开(公告)号：JPS5715434A
公开(公告)日：1982-01-26
申请号：JP9011480
申请日：1980-06-30
申请人： MITSUBISHI ELECTRIC CORP
发明人： TACHIKAWA TOORU , BANJIYOU TOSHINOBU , NAKAGAWA KOUICHI
IPC分类号： H01L21/677 , H01L21/52 , H01L21/60
摘要： PURPOSE:To enhance the positioning accuracy in a flip chip type apparatus by detecting a chip position in a moving path of a holder adsorbing a chip and controlling the relative position of the chip and a container according to the deviation in the position being compouted. CONSTITUTION:A chip 4 positioned at the holding position A is adsorbed with a holder 7 at a holding section 1. An XY table 8 is driven to move the holder 7 to the joining position B where a container is positioned. Once the holder 7 is stopped at the detecting position, a detector 10 with a TV camera, for instance, detects the relative position between the chip 4 and the holder 7 and an arithmetic device 10 calculated the deviation in the position of the chip 4 from the detection signal. Based on the results, while the movement of the table 8 is controlled (or the position of the container is corrected), the chip 4 is carried to the joining position B and joined with the container. This enables the correction of any deviation during the adsorption of the chip thereby accomplishing a highly accurate bonding with a correct positioning.

7. 发明专利

JPS5661147A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5661147A
公开(公告)日：1981-05-26
申请号：JP13714479
申请日：1979-10-23
申请人： MITSUBISHI ELECTRIC CORP
发明人： OOSAKA SHIYUUICHI , BANJIYOU TOSHINOBU
IPC分类号： H01L21/673 , H01L21/52 , H01L23/00 , H01L23/04
摘要： PURPOSE:To simplify the package of a completed device by making an alignment formation section around a metallic layer in a container wherein a positioning mark is provided on a semiconductor element surface and the element is exactly housed in the container. CONSTITUTION:Notches are provided around a metallic layer 20 provided in a container 1 and a plurality of alignment formation sections are provided. A positioning mark 23 corresponding to the alignment formation Section 21 is provided on an LED22 surface. The position is exactly aligned and the LED is housed in the metallic layer 20. Comb tooth 25 having equal pitches are made at the external circumference of a metallic layer 24 and alignment formation Sections 26 are made by extruding tooth at plural places. Positioning marks 28 corresponding to the alignment formation Sections 26 are provided on the surface of a photo diode 27 and the position is exactly aligned to house the photo diode 27 in the metallic layer 24. In this composition, fine position adjustment is unnecessary when a semiconductor element is packed in an apparatus after housing a semiconductor element in a container, and installation work will be simplified.

8. 发明专利

JPS5650368A SEMICONDUCTOR DEVICE FOR LIQUID CRYSTAL DISPLAY 失效
公开(公告)号：JPS5650368A
公开(公告)日：1981-05-07
申请号：JP12754279
申请日：1979-10-01
申请人： MITSUBISHI ELECTRIC CORP
发明人： TOKUNAGA TAKAO , BANJIYOU TOSHINOBU
IPC分类号： G09F9/00 , G02F1/133 , G02F1/1345

9. 发明专利

JPS54146577A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：JPS54146577A
公开(公告)日：1979-11-15
申请号：JP5514178
申请日：1978-05-09
申请人： Mitsubishi Electric Corp
发明人： KAMIMURA SHIYUNICHI , TOKUNAGA TAKAO , BANJIYOU TOSHINOBU
IPC分类号： H01L23/50 , H01L23/28 , H01L23/48
CPC分类号： H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01078 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PURPOSE: To avoid the marking migration to the sealing resin by giving the silver plating only to the dipad and the linear junction area.
CONSTITUTION: For lead frame 1, silver plating 9 is applied only to the area near the mounting surface of semiconductor device 5 of dipad 2 as well as to the area near the linear junction part of lead 3. And the connection via solder maerial 6 or gold thin wire 7 and the sealing via resin 8 are identical to the conventional ones. In this constitution, lead 3 features a direct touch for the material (Kovar or copper) of the lead frame to the resin and higher adhesive force than the silver. As a result, no water permeates to enhance the moisture resistance, and furthermore no migration occurs due to absence of silver there with no impairment caused to the insulating performance.
COPYRIGHT: (C)1979,JPO&Japio
摘要翻译：目的：为了避免标记向密封树脂的迁移，只能通过给银镀层和线性接合区域进行镀银。构成：对于引线框架1，镀银9仅施加到二极管2的半导体器件5的安装表面附近的区域以及引线3的线性接合部分附近的区域。并且通过焊料6或金细线7和密封通孔树脂8与常规的相同。在这种结构中，铅3具有对引线框架的材料（科瓦或铜）与树脂的直接接触，并且具有比银更高的粘合力。结果，没有水渗透以增强耐湿性，并且由于不存在银而不会因绝缘性能而发生损伤而发生迁移。

10. 发明专利

JPS5428569A WIRE BONDING DEVICE 失效
公开(公告)号：JPS5428569A
公开(公告)日：1979-03-03
申请号：JP9437477
申请日：1977-08-05
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAKAGAWA KOUICHI , OCHI KATSUNORI , BANJIYOU TOSHINOBU
IPC分类号： H01L21/60
摘要： PURPOSE:To avoid the contact failure among the wires by providing the projection part to the heat panel and then inserting the projection part between the dipad at the wire junction time and the lead of the frame to push up the bonding wire.

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