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1. 发明专利

JP2012089680A Semiconductor measuring device 有权
标题翻译：半导体测量装置
公开(公告)号：JP2012089680A
公开(公告)日：2012-05-10
申请号：JP2010235091
申请日：2010-10-20
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： YASUDA KATSUO , NEI HIDEKI , FURUKAWA JUN
IPC分类号： H01L21/66 , G01R1/06 , G01R31/28
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor measuring device in which even a thin wafer to be tested can be supported with no deflection, and a probe needle can be brought into contact with the back electrode of a wafer to be tested reliably and easily with a simple structure.SOLUTION: The semiconductor measuring device comprises a wafer chuck with a support surface for supporting a wafer to be tested, at least three chuck pins penetrating the wafer chuck in the vertical direction, a first moving mechanism which moves the chuck pin in the vertical direction, at least one lower probe needle inserted in the inside of the chuck pin, a second moving mechanism which moves the lower probe needle in the vertical direction, a third moving mechanism which moves the wafer chuck in the vertical direction and the horizontal direction, and a tester connected electrically with an upper prove needle and the lower probe needle.
摘要翻译：要解决的问题：提供一种半导体测量装置，其中甚至可以不偏转地支撑待测试的薄晶片，并且可以使探针与待测试的晶片的背电极接触并且结构简单。解决方案：半导体测量装置包括具有用于支撑被测试晶片的支撑表面的晶片卡盘，至少三个在垂直方向上穿透晶片卡盘的卡盘销，第一移动机构，其将卡盘销移动到至少一个下部探针插入卡盘销的内侧;第二移动机构，其使上述下部探针沿垂直方向移动;第三移动机构，其使上述晶片卡盘沿上下方向和该水平方向移动; 以及与上部探针和下部探针针电连接的测试仪。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2010245508A Wafer alignment device and wafer alignment method 审中-公开
标题翻译：波形对准设备和波形对准方法
公开(公告)号：JP2010245508A
公开(公告)日：2010-10-28
申请号：JP2010014369
申请日：2010-01-26
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： YASUDA KATSUO , MASUDA HIKARI , SUGA NORITO
IPC分类号： H01L21/68 , H01L21/027 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To correctly align a wafer in a short period of time. SOLUTION: The wafer alignment device is provided with a control unit carrying out: a correction processing for correcting wafers for the second and succeeding wafers based on a position of the first wafer; a low magnification correction processing for correcting in directions of X, Y and θ to wafers for the second and succeeding wafers based on an amount of deviation of two low magnification alignment patterns previously determined and a reference position; and a high magnification correction processing for correcting in directions of X, Y and θ to wafers the second and succeeding wafers based on an amount of deviation of two high magnification alignment patterns previously determined and a reference position. The wafer alignment method carries out positioning of the wafers in continuously and alternately processing a plurality of wafers by a processing function same as that of the processing of the wafer alignment device. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了在短时间内正确对准晶圆。解决方案：晶片对准装置设置有控制单元，该控制单元执行基于第一晶片的位置来校正第二和后续晶片的晶片的校正处理; 基于先前确定的两个低倍率对准图案的偏差量和基准位置，对第二和后续晶片的晶片的X，Y和θ的方向进行校正的低倍率校正处理; 以及高倍率校正处理，用于基于先前确定的两个高倍率对准图案的偏差量和参考位置，在X，Y和θ的方向上校正第二和后续晶片的晶片。晶片对准方法通过与晶片对准装置的处理相同的处理功能来连续地并且交替地处理多个晶片来进行晶片的定位。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2013117476A Probe assembly for inspecting semiconductor device for power and inspection device using the same 有权
标题翻译：用于检查用于功率和检测装置的半导体器件的探针组件
公开(公告)号：JP2013117476A
公开(公告)日：2013-06-13
申请号：JP2011265798
申请日：2011-12-05
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： YASUDA KATSUO , MASUDA HIKARI , NEI HIDEKI , ISHIWATARI TATSUYA
IPC分类号： G01R31/26 , G01R1/073 , H01L21/66
CPC分类号： G01R1/067 , G01R1/06777 , G01R1/44 , G01R31/2608
摘要： PROBLEM TO BE SOLVED: To provide a probe assembly for inspecting a semiconductor device for power for preventing the rise of temperature due to the electric conduction of a probe or a semiconductor device, and for performing accurate measurement and an inspection device using the probe assembly.SOLUTION: There is provided the probe assembly for inspecting a semiconductor device for power including: a probe block having a plurality of probe storage holes; a plurality of probes respectively stored in the probe storage holes, that is, the probes the outer periphery of each of which is brought into contact with the inner periphery of each of the probe storage holes, and the lower end of each of which to be brought into contact with an object in inspection is projected from the probe block; and one or more cooling means for cooling the probe block. There is provided an inspection device including the probe assembly.
摘要翻译：要解决的问题：提供一种用于检查用于防止由于探针或半导体器件的导电引起的温度上升的电力的半导体器件的探针组件，并且用于执行精确的测量和使用该测量装置的检查装置探头组件。解决方案：提供用于检查用于功率的半导体器件的探针组件，包括：具有多个探针存储孔的探针块; 分别存储在探针存储孔中的多个探针，即探针，其每个的外周与每个探针存储孔的内周接触，并且每个探针的下端为与检测对象物体接触从探针块投射出来; 以及用于冷却探针块的一个或多个冷却装置。提供了包括探针组件的检查装置。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2007183194A Probing apparatus 审中-公开
标题翻译：探测器
公开(公告)号：JP2007183194A
公开(公告)日：2007-07-19
申请号：JP2006002178
申请日：2006-01-10
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： HASEGAWA YOSHIE , MASUDA HIKARI , YASUDA KATSUO , WASHIO KENICHI , HASEGAWA MASASHI
IPC分类号： G01R31/28 , G01R1/06 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To prevent the surfaces of a probe card and a body to be inspected from tilting with respect to an X-Y plane of an inspection stage, even if the parallelism between the probe card and the body to be inspected is adjusted.
SOLUTION: The probing apparatus includes a cradle for receiving a flat-plate-form body to be inspected having a plurality of electrodes; an inspection stage for supporting the cradle and making the body to be inspected that has been received at the cradle move, at least in the three directions of X-direction and Y-direction intersecting each other, in a plane in parallel with the body to be inspected and Z-direction intersecting both the directions; a probe base located at a distance from the inspection stage in the Z-direction; the probe card having a plurality of probes and supported at the probe base, in such a way that probe needle tips are oriented toward the side of the inspection stage; and a displacement mechanism for making the probe card displace with respect to the inspection stage for adjusting the parallelism between the body to be inspected received at the inspection stage and the probe card.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了防止探针卡和身体的表面相对于检查台的XY平面倾斜检查，即使探针卡和要检查的身体之间的平行度是调整。解决方案：探测装置包括用于接收待检查的平板形体的多个电极的支架; 至少在X方向和Y方向的三个方向上彼此相交的支撑托架并使待检查的身体被检查的检查台在与主体平行的平面中移动被检查，Z方向与两个方向相交; 位于距Z检验台一定距离的探头基座; 所述探针卡具有多个探针并且被支撑在所述探针基部处，使得所述探针针尖朝向所述检查台的侧面; 以及用于使探针卡相对于检查台位移的位移机构，用于调节在检查台接收的待检查体与探针卡之间的平行度。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2007183193A Probing apparatus 审中-公开
标题翻译：探测器
公开(公告)号：JP2007183193A
公开(公告)日：2007-07-19
申请号：JP2006002177
申请日：2006-01-10
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： HASEGAWA YOSHIE , MASUDA HIKARI , YASUDA KATSUO , WASHIO KENICHI , HASEGAWA MASASHI
IPC分类号： G01R31/28 , G01R1/073 , H01L21/66
CPC分类号： G01R31/2889
摘要： PROBLEM TO BE SOLVED: To facilitate parallelism adjustment during inspection in a probing apparatus for inspecting flat-plate-form bodies, such as semiconductor integrated circuits.
SOLUTION: The probing apparatus 10 includes an inspection stage 22 for making a body to be inspected 12 that has been received at a cradle 20 move, at least in the three directions of X-direction and Y-direction intersecting each other in a plane in parallel with the body to be inspected 12, and Z-direction intersecting both the directions; a probe card 30 supported at a distance from the inspection stage 22 in the Z-direction, in such a way that probe needle tips 44a are oriented toward the side of the inspection stage 22; a displacement mechanism 28 for making the probe card 30 and the inspection stage 22 displace relatively to each other for adjusting the parallelism between the body to be inspected 12 received at the inspection stage 22 and the probe card 30; a plurality of measuring devices 70, arranged at a distance from one another in the X-direction and the Y-direction, in either the inspection stage 22 or the probe card 30; and a control part 52 for storing intervals measure by each of measuring devices 70.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了便于在用于检查诸如半导体集成电路的平板形体的检测装置中的检查期间的并行度调整。解决方案：探测装置10至少在X方向和Y方向的三个方向上至少在彼此相交的三个方向上包括用于使被检查体12的托架20移动的检查台22 与要检查的身体平行的平面12，并且Z方向与两个方向相交; 在Z方向上与检查台22隔开距离地支撑的探针卡30，使得探针针尖44a朝向检查台22侧; 用于使探针卡30和检查台22彼此相对位移的位移机构28用于调节在检查台22处接收的待检查体12与探针卡30之间的平行度; 在检查台22或探针卡30中在X方向和Y方向上彼此间隔设置的多个测量装置70; 以及用于存储每个测量装置70的间隔测量的控制部分52.权利要求：（C）2007，JPO＆INPIT

6. 发明专利

JP2008016676A Probe card automatic exchanging mechanism and inspecting device 审中-公开
标题翻译：探针卡自动切换机构及检测装置
公开(公告)号：JP2008016676A
公开(公告)日：2008-01-24
申请号：JP2006187071
申请日：2006-07-06
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： YASUDA KATSUO , MASUDA HIKARI , YAMAGUCHI NORIHIDE
IPC分类号： H01L21/66
摘要： PROBLEM TO BE SOLVED: To distribute functions for simplifying structure and to make rigidity improved.
SOLUTION: A probe card automatic exchanging mechanism automatically exchanges probe cards according to kind of a semiconductor wafer. The mechanism comprises a card-fixing part which fixes and supports the probe card; a card-transport part which transports probe card between the card fixing part and the outside; and a card-exchanging part which removes the probe card fixed to the card-fixing part and shifts it to the card transport part; and then attaches a new probe card that has been shifted down to immediately under the card fixing part by the card transport part, to the card-fixing part. The card exchanging part comprises a clamp for supporting a card holder, a rotation ring which vertically moves the clamp, a rotational driver for rotates the rotating ring, and a holder rotating mechanism which makes the card holder rotate, and the holder rotating mechanism is provided to the card transport part side.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了简化结构和提高刚性而分配功能。解决方案：探针卡自动交换机构根据半导体晶圆的种类自动交换探针卡。该机构包括固定和支撑探针卡的卡固定部分; 在卡固定部和外部之间传送探针卡的卡传送部; 以及卡片交换部件，其移除固定在卡片固定部件上的探针卡并将其移动到卡片传送部件; 然后将通过卡传送部分向下移动到卡固定部分下方的新探针卡附接到卡固定部。卡片更换部分包括用于支撑卡夹的夹具，使夹具垂直移动的旋转环，旋转旋转环的旋转驱动器和使卡夹转动的保持器旋转机构，并且提供保持器旋转机构到卡运输部分。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2007095993A Method of aligning probe point with electrode of inspection body 有权
标题翻译：用检测体电极校准探针点的方法
公开(公告)号：JP2007095993A
公开(公告)日：2007-04-12
申请号：JP2005283483
申请日：2005-09-29
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： HASEGAWA YOSHIE , WASHIO KENICHI , YASUDA KATSUO , HASEGAWA MASASHI
IPC分类号： H01L21/66 , G01R1/073 , G01R31/26 , G01R31/28
摘要： PROBLEM TO BE SOLVED: To facilitate work for aligning a probe point with an electrode of an inspection body after mounting on a prober. SOLUTION: Before a probe card is placed on the prober, probe information is determined regarding at least three reference probes P4, P5 and P6 among a plurality of probes 38. The method determines at least either point positions indicating coordinate positions of the points of the reference probes P4, P5 and P6 with the probe card placed on the prober, or electrode positions indicating coordinate positions of electrodes corresponding to the reference probes P4, P5 and P6 with the planar inspection body 12 having a plurality of electrodes corresponding to the probes 38. Based on the probe information and at least either the point positions or the electrode positions, the probe card and the inspection body 12 placed on the prober are relatively displaced to have the points of the reference probes P4, P5 and P6 aligned with the electrodes of the inspection body. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了便于在安装在探测器上之后将检测点与检查体的电极对准的工作。解决方案：在将探针卡放置在探测器上之前，针对多个探针38中的至少三个参考探针P4，P5和P6确定探针信息。该方法确定指示坐标位置的至少一个点位置参考探针P4，P5和P6与探针卡放置在探测器上的点，或指示对应于参考探针P4，P5和P6的电极的坐标位置的电极位置，其中平面检查体12具有对应于根据探针信息和至少点位置或电极位置，放置在探测器上的探针卡和检查体12相对移位，使得参考探针P4，P5和P6的点对准与检查体的电极。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2012112776A Inspection method for multilayer-chip device and multilayer-chip device rearrangement unit, and inspection equipment for multilayer-chip device 有权
标题翻译：用于多层芯片设备和多层设备拆除单元的检查方法以及用于多层设备的检查设备
公开(公告)号：JP2012112776A
公开(公告)日：2012-06-14
申请号：JP2010261448
申请日：2010-11-24
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： YASUDA KATSUO , MIYAGI YUJI
IPC分类号： G01R31/26 , G01R1/06 , H01L21/66
CPC分类号： G01R31/2893
摘要： PROBLEM TO BE SOLVED: To enable accurate, efficient, and low-cost inspection of a multilayer-chip device including chips having different external dimensions.SOLUTION: There is provided a multilayer-chip device inspection method for inspecting a multilayer-chip device configured by laminating a plurality of chips, which are diced and divided from an inspection-target substrate which has been inspected by inspection equipment. Each multilayer-chip device is inspected in such a way that: on an adhesive layer of a multilayer-chip device tray having the same shape and external dimension as the inspection-target substrate before dicing, one or more of the multilayer-chip devices are aligned with and adhesively supported at the positions where the respective chips were in the inspection-target substrate before dicing, and the multilayer-chip device tray is set on the inspection equipment in the same manner as in the inspection of the inspection-target substrate to carry out inspection.
摘要翻译：要解决的问题：为了能够对包括具有不同外部尺寸的芯片的多层芯片器件进行准确，有效和低成本的检查。解决方案：提供了一种多层芯片器件检查方法，用于检查通过层叠多个芯片而构成的多层芯片器件，所述多个芯片器件通过检查设备被检查的检查目标衬底切割和分割。对每个多层芯片器件进行检查，使得：在切片之前，与检查对象基板具有相同形状和外部尺寸的多层芯片器件托盘的粘合剂层上，一个或多个多层芯片器件在切割之前，将各个芯片对准检查对象基板的位置对准并粘合地支撑，并且以与检查对象基板的检查相同的方式将多层芯片装置托盘设置在检查设备上进行检查。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2010266403A Inspection apparatus 有权
标题翻译：检查装置
公开(公告)号：JP2010266403A
公开(公告)日：2010-11-25
申请号：JP2009120106
申请日：2009-05-18
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： WASHIO KENICHI , YASUDA KATSUO , OSHIMA TOSHIKAZU , HIRAI TAKEHIKO
IPC分类号： G01R31/28 , G01R1/073 , H01L21/66
CPC分类号： G01R31/2891 , G01R31/026
摘要： PROBLEM TO BE SOLVED: To correctly control a temperature, reduce noise, and in addition eliminate failures in contact so as to improve the measurement accuracy.
SOLUTION: An inspection apparatus includes a probe device, including a contact coming into contact with an electrode of an object to be inspected, and having a heater incorporated for correcting a shift in the position of the contact with the electrode due to a difference in temperature from the object; a tester for transmitting an inspection signal to the probe device and also supplying power to the heater; a power supply system provided in the tester for supplying power to the heater; and a temperature control unit for controlling the heater of the probe device via the power supply system and includes a heater power supply shut-off open/close switch in the power supply system. In addition, the apparatus includes a connector, including a male connector part and a female connector part provided at the other end. The apparatus, further, includes a cable check device at a contact point in detachable contact with the power supply system.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：正确控制温度，降低噪音，另外消除接触故障，以提高测量精度。解决方案：检查装置包括探针装置，其包括与被检查物体的电极接触的接触件，并且具有加热器，该加热器用于校正与电极的接触位置的偏移，这是由于物体温差; 用于将检查信号发送到探针装置并且还向加热器供电的测试器; 设置在所述测试器中以向所述加热器供电的供电系统; 以及温度控制单元，用于经由电源系统控制探针装置的加热器，并且包括电源系统中的加热器电源切断开闭开关。此外，该装置包括一个连接器，包括一个阳连接器部分和一个设在另一端的阴连接器部分。该装置还包括在与电源系统可拆卸接触的接触点处的电缆检查装置。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2006162476A Prober 有权
标题翻译： PROBER
公开(公告)号：JP2006162476A
公开(公告)日：2006-06-22
申请号：JP2004355810
申请日：2004-12-08
申请人： Micronics Japan Co Ltd , 株式会社日本マイクロニクス
发明人： YASUDA KATSUO , WASHIO KENICHI
IPC分类号： G01R31/28 , G01R1/06 , G01R1/073 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To restrain an influence by heat to the minimum, and to make inspection work more efficient.
SOLUTION: This prober 1 has a probe card 5 provided with a probe needle 12 for contacting with a wafer 11 to be inspected, and heats the wafer 11 to conduct inspection. A heater 28 is provided between the probe card 5 and a card holder 6. The heater 28 is formed into both-face heating structure and is provided in a heat quantity balanced position. In the heat quantity balanced position, a heat quantity required for heating the probe card 5 to a set temperature with the heater 28 by supplying heat from the heater 28 to a center side of the probe card 5 is balanced with a heat quantity required for heating the card holder 6 to a set temperature with the heater 28 by supplying heat from the heater 28 to a card holder side, and times required for heating to the set temperatures are balanced in the position.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：将热量的影响限制在最低限度，并使检查工作更有效率。解决方案：该探针1具有探针卡5，该探针卡5设置有用于与要检查的晶片11接触的探针12，并加热晶片11进行检查。加热器28设置在探针卡5和卡保持件6之间。加热器28形成为双面加热结构，并设置在热量平衡位置。在热量平衡位置，将加热器28通过从加热器28供给到探针卡5的中心侧而将探针卡5加热到设定温度所需的热量与加热所需的热量平衡通过将加热器28的热量从加热器28供给到卡保持器侧，将卡夹持器6设定到设定温度，加热到设定温度所需的时间在该位置上平衡。版权所有（C）2006，JPO＆NCIPI

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