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1. 发明专利

JP2003095762A CERAMIC STRUCTURE 审中-公开
公开(公告)号：JP2003095762A
公开(公告)日：2003-04-03
申请号：JP2001286747
申请日：2001-09-20
申请人： MEIDENSHA ELECTRIC MFG CO LTD , MEIDEN CERAMICS CORP
发明人： OGITA KIYOBUMI , IIDA KEN , KAWAGUCHI HIDEMI , INNAMI YOSHIYUKI
IPC分类号： E02D27/01 , C04B37/00
摘要： PROBLEM TO BE SOLVED: To obtain a ceramic structure having high tensile strength. SOLUTION: A cylindrical female screw member 4 having a female screw part 4a inside and a sheath tube 5 having a hole are formed from a ceramic material. The female screw member 4 is attached to the hole of the sheath tube 5. The sheath tube 5 with the female screw member 4 are calcined so that the female screw member 4 is pressed by the shrinkage of the sheath tube 5 to tightly fit and fix to each other.

2. 发明专利

JPH0113620B2 失效
公开(公告)号：JPH0113620B2
公开(公告)日：1989-03-07
申请号：JP9036780
申请日：1980-07-01
申请人： MEIDENSHA ELECTRIC MFG CO LTD
发明人： KASHIWAGI YOSHUKI , KASHIMOTO YUTAKA , SAKUMA SHINZO , WARABI JUNICHI , KOBARI YUKIO , KAWAGUCHI HIDEMI
IPC分类号： H01H33/66 , H01H33/662

3. 发明专利

JPS5717139A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5717139A
公开(公告)日：1982-01-28
申请号：JP9156880
申请日：1980-07-04
申请人： MEIDENSHA ELECTRIC MFG CO LTD
发明人： KOBARI YUKIO , KAWAGUCHI HIDEMI
IPC分类号： H01L21/52 , H01L21/58 , H01L23/04
摘要： PURPOSE:To reduce the hermetically fixed section of the subject semiconductor device by a method wherein an airtight fixing is performed using a material which will be softened by the high temperature heat load generated when soldering and a plastic deformation can be performed easily in the cooling process after soldering irrespective of a thermal expansion coefficient for ceramic. CONSTITUTION:A mounting section 35, having a concaved section 34, is formed on the side of the outer circumferential end of a current applying material 3, the mounting section 35 and the lower end of an insulated cylinder 1 are soldered, a sealing member 21 having L-shaped section is soldered on the upper section of said insulated cylinder and the sealing member 21 is fixed to the current applying material 4 through the intermediary of an auxiliary member 42. Thus, the airtight container is formed with the insulated cylinder 1, a pair of current applying materials 3 and 4, the covering fitting 21 and the auxiliary member, the movement of a semiconductor element 5 between current applying materials 3 and 4 is controlled by a retaining member 61 and the deaeration from and gas filling into the lead pipe provided in the insulated cylinder are performed and the above is sealed, thereby enabling to obtain a semiconductor having an excellent thermal and electrical characteristics with the least area of fixing section.

4. 发明专利

JP2002357098A FIRE-RESISTANT HEAT-RESISTING STRUCTURE 失效
公开(公告)号：JP2002357098A
公开(公告)日：2002-12-13
申请号：JP2001164193
申请日：2001-05-31
申请人： KAJIMA CORP , MEIDENSHA ELECTRIC MFG CO LTD , MEIDEN CERAMICS CORP
发明人： FURUICHI KOSUKE , HAYAKAWA YASUYUKI , TAKIMOTO KUNIHIKO , OTANI YOSHINOBU , IMANISHI KAZUO , OGITA KIYOBUMI , IIDA KEN , KAWAGUCHI HIDEMI
IPC分类号： E21D11/08 , E04B1/94 , E21D11/14
摘要： PROBLEM TO BE SOLVED: To provide a fire-resistant heat-resisting structure which ensures protection of a concrete structure even if exposed to flames, by retarding rise in temperature of segments, and is excellent in mounting efficiency and in flexibility in shaping and selection of a mounting means. SOLUTION: The fire-resistant heat-resisting structure is obtained by covering a segment surface with a fire-resistant heat-resisting section formed of a fire- resistant heat-resisting castable material containing aluminum oxide of 30 to 89 wt.%, silicon oxide of 5 to 60 wt.%, and silicon carbide of 1 to 50 wt.%. The fire-resistant heat-resisting section 2 formed of the castable material is fixed to the surface of a concrete body 1 constituted of the segments, to thereby form the concrete structure. To fix the fire-resistant heat-resisting section 2 to the concrete body 1, anchors for fixing may be employed, whereby the fire- resistant heat-resisting section 2 and the concrete body 1 are fixed to each other in one body. In an alternative method, anchors 3 as mounting members may be driven into mounting holes 2a to fix the fire-resistant heat-resisting section 2 to the concrete body, and then the mounting holes 2a after driving are blocked with the castable material.

5. 发明专利

JPH0226335B2 失效
公开(公告)号：JPH0226335B2
公开(公告)日：1990-06-08
申请号：JP8875080
申请日：1980-06-30
申请人： MEIDENSHA ELECTRIC MFG CO LTD
发明人： SAKUMA SHINZO , UMETANI EIJI , WARABI JUNICHI , KOBARI YUKIO , KAWAGUCHI HIDEMI
IPC分类号： H01H33/66

6. 发明专利

JPS5717527A VACUUM BREAKER 失效
公开(公告)号：JPS5717527A
公开(公告)日：1982-01-29
申请号：JP9256180
申请日：1980-07-07
申请人： MEIDENSHA ELECTRIC MFG CO LTD
发明人： SAKUMA SHINZOU , WARABI JIYUNICHI , KASHIMOTO YUTAKA , KOBARI YUKIO , KAWAGUCHI HIDEMI
IPC分类号： H01H33/66 , H01H33/662

7. 发明专利

JPS56156626A VACUUM BREAKER 失效
公开(公告)号：JPS56156626A
公开(公告)日：1981-12-03
申请号：JP5967580
申请日：1980-05-06
申请人： MEIDENSHA ELECTRIC MFG CO LTD
发明人： WARABI JIYUNICHI , SAKUMA SHINZOU , KAWAGUCHI HIDEMI , KOBARI YUKIO
IPC分类号： H01H33/66 , H01H33/662

8. 发明专利

JPS6041462B2 失效
公开(公告)号：JPS6041462B2
公开(公告)日：1985-09-17
申请号：JP9789880
申请日：1980-07-17
申请人： MEIDENSHA ELECTRIC MFG CO LTD
发明人： KOBARI YUKIO , KAWAGUCHI HIDEMI
IPC分类号： H01L23/04 , H01L23/051

9. 发明专利

JPS5723249A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：JPS5723249A
公开(公告)日：1982-02-06
申请号：JP9789780
申请日：1980-07-17
申请人： Meidensha Electric Mfg Co Ltd
发明人： KOBARI YUKIO , KAWAGUCHI HIDEMI
IPC分类号： H01L23/04 , H01L23/051 , H01L23/48
CPC分类号： H01L23/051 , H01L24/01 , H01L2924/0002 , H01L2924/00
摘要： PURPOSE:To facilitate assembly of a package for high power elements with low cost, by a method wherein a conductor is attached to each of the outer ends of two insulating tubes to whose inner ends plastically deformable sealing fittments have been brazed, and the sealing fittments are made to hermetically seal, with an element placed between said conductors. CONSTITUTION:A conductor 3 and a lead tube 62 made of e.g., copper and a sealing fittment 21 of copper or iron are brazed to one insulating tube 11 of, for instance, ceramics at a high temperature, and are cooled gradually. Similarly, a sealing fittment 22 and a conductor 4 are brazed to the other insulating tube 12 and are cooled gradually. An element 51 is mounted and fixed on a conductor 3 through an auxiliary member 52 made of, for instance, tungsten after positioning with an insulative holding member 61. An electrode (e.g., gate) terminal is connected to a lead tube 62 if necessary. Next, the fittments 21 and 22 are made to seal hermetically by pinching off or the like. The lead tube 62 is sealed for airtight assembly after introducing nitrogen gas from the lead tube 62. Thus, a hermetic package with easy assembly can be made without expensive material.
摘要翻译：目的：为了便于以低成本组装大功率元件的封装，通过一种方法，其中导体连接到两个绝缘管的每个外端，其内部可塑性可变形的密封配件已钎焊，并且密封配件被制成密封，放置在所述导体之间的元件。构成：由例如铜制的导体3和引线管62以及铜或铁的密封装置21在高温下钎焊到例如陶瓷的一个绝缘管11上，并逐渐冷却。类似地，密封配件22和导体4钎焊到另一个绝缘管12上并逐渐冷却。元件51在通过绝缘保持构件61定位之后，通过例如钨制成的辅助构件52安装并固定在导体3上。如果需要，电极（例如，栅极）端子连接到引线管62。接下来，使配件21和22通过夹紧等密封密封。在从导管62引入氮气之后，引线管62被密封用于气密组装。因此，可以在没有昂贵的材料的情况下制造易于组装的密封包装。

10. 发明专利

JPS5713637A VACUUM BREAKER AND METHOD OF PRODUCING SAME 失效
公开(公告)号：JPS5713637A
公开(公告)日：1982-01-23
申请号：JP8875080
申请日：1980-06-30
申请人： MEIDENSHA ELECTRIC MFG CO LTD
发明人： SAKUMA SHINZOU , UMETANI EIJI , WARABI JIYUNICHI , KOBARI YUKIO , KAWAGUCHI HIDEMI
IPC分类号： H01H33/66

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