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1. 发明专利

JP2009030163A Surface treatment method for copper or copper alloy 审中-公开
标题翻译：铜或铜合金的表面处理方法
公开(公告)号：JP2009030163A
公开(公告)日：2009-02-12
申请号：JP2008143286
申请日：2008-05-30
申请人： Mec Kk , メック株式会社
发明人： FURUKAWA YOSHIAKI , OKADA MASAO , YAGUMA NORIKO
IPC分类号： C23F11/00
摘要： PROBLEM TO BE SOLVED: To provide a surface treatment method for copper or a copper alloy, with which a uniform rust preventive film can be formed even to a fine part, management of a liquid is not required, the amount of a treatment agent is small, and treatment can be performed at a low cost.
SOLUTION: Disclosed is the surface treatment method for the copper or the copper alloy, with which a surface treatment agent comprising an imidazole compound is brought into contact with the surface of the copper or the copper alloy, thus the rust preventive film is formed on the copper or the copper alloy. The method comprises: a stage where a resin layer having an opening part is formed on the surface of the copper or the copper alloy; and a stage where the surface treatment agent is brought into contact with the surface of the copper or the copper alloy at the inside of the opening part as misty particles with particle diameters of ≤100 μm.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供铜或铜合金的表面处理方法，甚至可以形成均匀的防锈膜到细小部分，不需要管理液体，处理量药剂小，可以低成本进行治疗。解决方案：公开了包含咪唑化合物的表面处理剂与铜或铜合金的表面接触的铜或铜合金的表面处理方法，防锈膜为形成在铜或铜合金上。该方法包括：在铜或铜合金的表面上形成具有开口部的树脂层的阶段; 以及表面处理剂与开口部内侧的铜或铜合金的表面接触的阶段，作为粒径≤100μm的雾状粒子。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2013022761A Method of manufacturing copper-resin complex 审中-公开
标题翻译：制备铜树脂复合物的方法
公开(公告)号：JP2013022761A
公开(公告)日：2013-02-04
申请号：JP2011156949
申请日：2011-07-15
申请人： Mec Kk , メック株式会社
发明人： TAKAHASHI MASARU , HAYASHI TOMOKI , NAITO YUTA , YAGUMA NORIKO
IPC分类号： B29C45/14 , C23F1/18
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a copper-resin complex that can improve adhesion between copper and a resin composition without using any adhesive, and has an excellent work environment.SOLUTION: The method of manufacturing the copper-resin complex includes a roughening step of roughening a surface of a copper-made product using an etchant, and a sticking step of sticking the resin composition on the roughened surface. The etchant is a solution containing a sulfuric acid, a hydrogen peroxide, phenyltetrazoles, nitrobenzotriazoles, benzenesulfonic acids, and chloride ions.
摘要翻译：解决的问题：提供一种铜树脂配合物的制造方法，其可以在不使用任何粘合剂的情况下提高铜和树脂组合物之间的粘附性，并且具有优异的工作环境。解决方案：铜树脂复合物的制造方法包括使用蚀刻剂使铜制品表面粗糙化的粗糙化工序，以及将树脂组合物粘在粗糙面上的粘贴工序。蚀刻剂是含有硫酸，过氧化氢，苯基四唑，硝基苯并三唑，苯磺酸和氯离子的溶液。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2002371370A Agent and method for surface treating copper or copper alloy, and method for manufacturing printed circuit board 有权
标题翻译：用于表面处理铜或铜合金的代理和方法以及制造印刷电路板的方法
公开(公告)号：JP2002371370A
公开(公告)日：2002-12-26
申请号：JP2001182155
申请日：2001-06-15
申请人： Mec Kk , メック株式会社
发明人： OTANI MINORU , FURUKAWA YOSHIAKI , YAGUMA NORIKO
IPC分类号： C23C22/05 , C23C22/52 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an agent and a method for surface treating copper or copper alloy, which increases and further stabilizes a coating weight of a coated azole compound for a rust preventive film on the surface by a simple method, and to provide a method for manufacturing a printed circuit board therewith.
SOLUTION: The agent for surface treating copper or copper alloy is comprised of an aqueous solution containing a copper (II) compound of 0.005-15 wt.%.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种用于表面处理铜或铜合金的试剂和方法，其通过简单的方法增加并进一步稳定表面上的防锈膜的涂覆的唑类化合物的涂布重量，并且提供印刷电路板的制造方法。解决方案：用于表面处理铜或铜合金的试剂由含有0.005-15重量％的铜（II）化合物的水溶液组成。

4. 发明专利

JP2009256763A Method for controlling copper surface treatment agent 审中-公开
标题翻译：铜表面处理剂的控制方法
公开(公告)号：JP2009256763A
公开(公告)日：2009-11-05
申请号：JP2008133400
申请日：2008-05-21
申请人： Mec Kk , メック株式会社
发明人： FURUKAWA YOSHIAKI , YAGUMA NORIKO , NISHIE KENJI , TOJIMA TOYOE
IPC分类号： C23F11/00
摘要： PROBLEM TO BE SOLVED: To provide a method for controlling a copper surface treatment agent so that the concentration of an imidazole compound can be kept stable.
SOLUTION: In the method for controlling the copper surface treatment agent for forming a rust preventive film on the surface of copper, this controlling method includes: employing the copper surface treatment agent which includes the imidazole compound, a solvent mixture of an acid and water, and a concentration index component that dissolves in the solvent more easily than the imidazole compound; and controlling the concentration of the imidazole compound so as to be approximately constant, by measuring the concentration of the concentration index component, and when the measured value exceeds a predetermined threshold value, adding the solvent until the concentration of the concentration index component comes into a predetermined range.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种控制铜表面处理剂的方法，使得咪唑化合物的浓度可以保持稳定。解决方案：在铜表面上形成防锈膜的铜表面处理剂的控制方法中，该控制方法包括：使用包含咪唑化合物的铜表面处理剂，酸的溶剂混合物和水，以及比咪唑化合物更容易溶解在溶剂中的浓度指数成分; 并通过测定浓度指数成分的浓度来控制咪唑化合物的浓度近似恒定，当测定值超过规定的阈值时，加入溶剂直到浓度指数成分浓度达到预定范围。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2007262394A Surface-treating agent 有权
标题翻译：表面处理剂
公开(公告)号：JP2007262394A
公开(公告)日：2007-10-11
申请号：JP2007047642
申请日：2007-02-27
申请人： Mec Kk , メック株式会社
发明人： FURUKAWA YOSHIAKI , YAGUMA NORIKO , NISHIE KENJI
IPC分类号： C09K3/00 , C23C26/00
CPC分类号： C23F11/149 , C23C22/06 , C23C22/52 , C23F11/122 , C23F11/173 , H05K3/282
摘要： PROBLEM TO BE SOLVED: To provide a surface-treating agent which can inhibit the formation of coating films on a different kind of metal and can reduce environmental loads. SOLUTION: This surface-treating agent for treating the surface of copper or a copper alloy is characterized by comprising an imidazole compound and a sugar alcohol. The surface-treating agent can inhibit the formation of coating films on a different kind of metal, because copper ion eluted in the surface-treating agent is bound to the sugar alcohol. Furthermore, waste liquids can easily be treated, and environmental loads can be reduced, because the sugar alcohol is used. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够抑制在不同种类的金属上形成涂膜的表面处理剂，并且可以减少环境负荷。解决方案：用于处理铜或铜合金表面的表面处理剂的特征在于包含咪唑化合物和糖醇。表面处理剂可以抑制在不同种类的金属上形成涂膜，因为在表面处理剂中洗脱的铜离子与糖醇结合。此外，废液可以容易地被处理，并且由于使用糖醇可以降低环境负荷。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2009046761A Surface treatment agent 审中-公开
标题翻译：表面处理剂
公开(公告)号：JP2009046761A
公开(公告)日：2009-03-05
申请号：JP2008177891
申请日：2008-07-08
申请人： Mec Kk , メック株式会社
发明人： NISHIE KENJI , YAGUMA NORIKO , FURUKAWA YOSHIAKI
IPC分类号： C23C22/52
CPC分类号： H05K3/282 , B23K35/262 , C23C18/31 , H05K2203/124
摘要： PROBLEM TO BE SOLVED: To provide a surface treatment agent usable when soldering is performed using lead-free solder as well as the conventional eutectic solder, and capable of forming a film having excellent heat resistance.
SOLUTION: Disclosed is a surface treatment agent for treating the surface of a base material composed of copper or the alloy thereof. The agent is composed of a solution of an imidazole compound and sugar alcohol and contains zinc ions.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供当使用无铅焊料进行焊接以及常规的共晶焊料时可用的表面处理剂，并且能够形成具有优异的耐热性的膜。解决方案：公开了一种用于处理由铜构成的基材表面的表面处理剂或其合金。该试剂由咪唑化合物和糖醇的溶液组成并含有锌离子。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2009019270A Surface roughening agent 有权
标题翻译：表面粗化剂
公开(公告)号：JP2009019270A
公开(公告)日：2009-01-29
申请号：JP2008153066
申请日：2008-06-11
申请人： Mec Kk , メック株式会社
发明人： HAYASHI TOMOKO , YAGUMA NORIKO , MARUISHI SHOHEI
IPC分类号： C23F1/18 , H05K3/38
CPC分类号： C23F1/18 , H05K3/383 , H05K2203/0789
摘要： PROBLEM TO BE SOLVED: To provide a surface roughening agent which is excellent in adhesion of the surface of Cu or a Cu alloy and a resin and can prevent an oxidation of the surface of Cu after roughened. SOLUTION: The surface roughening agent is used for roughening the surface of Cu or Cu alloy, and includes H 2 SO 4 , H 2 O 2 , 5-aminotetrazol, a tetrazol compound excluding 5-aminotetrazol and a phosphonic-acid based chelate agent. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种表面粗糙化剂，其在Cu或Cu合金和树脂的表面的附着性优异，并且可以防止粗糙化后的Cu表面的氧化。解决方案：将表面粗糙剂用于粗糙化Cu或Cu合金的表面，包括H 2 SO 4 H 2

8. 发明专利

JP2009019268A Copper-surface treatment agent and surface treatment method 有权
标题翻译：铜表面处理剂和表面处理方法
公开(公告)号：JP2009019268A
公开(公告)日：2009-01-29
申请号：JP2008133388
申请日：2008-05-21
申请人： Mec Kk , メック株式会社
发明人： YAGUMA NORIKO , FURUKAWA YOSHIAKI , TOUJIMA TOYOE
IPC分类号： C23F11/00
CPC分类号： C23C22/52 , B23K1/20 , B23K2203/12 , C23F11/149 , H05K3/282 , H05K2203/124
摘要： PROBLEM TO BE SOLVED: To provide a Cu-surface treatment agent capable of satisfying both of heat resistant property and soldering property, and to provide a surface treatment method.
SOLUTION: The Cu-surface treatment agent contains an acid, a benzimidazol compound and water, wherein the benzimidazol compound includes at least a first benzimidazol compound and a second benzimidazol compound having the lower melting point by 70°C or more than the first benzimidazol compound.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够满足耐热性和焊接性两者的Cu表面处理剂，并提供表面处理方法。解决方案：Cu表面处理剂含有酸，苯并咪唑化合物和水，其中苯并咪唑化合物包括至少第一苯并咪唑化合物和第二苯并咪唑化合物，其熔点低于70℃或更高第一苯并咪唑化合物。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2013134948A Method for manufacturing negative electrode collector for nonaqueous electrolyte secondary battery and method for manufacturing negative electrode for nonaqueous electrolyte secondary battery 审中-公开
标题翻译：用于制造用于非电解电解质二次电池的负极收集器的方法和用于制造用于非电解电解质二次电池的负极的方法
公开(公告)号：JP2013134948A
公开(公告)日：2013-07-08
申请号：JP2011285959
申请日：2011-12-27
申请人： Mec Co Ltd , メック株式会社
发明人： YAGUMA NORIKO , DEGUCHI YUKARI , TAKAHASHI MASARU
IPC分类号： H01M4/66 , H01M4/1391
CPC分类号： Y02P70/54
摘要： PROBLEM TO BE SOLVED: To provide: a method for manufacturing a negative electrode collector for a nonaqueous electrolyte secondary battery, capable of improving electron conductivity between a metal oxide-containing active material layer and the collector; and a method for manufacturing a negative electrode for a nonaqueous electrolyte secondary battery.SOLUTION: In a method for manufacturing a negative electrode collector for a nonaqueous electrolyte secondary battery of the present invention, a surface of a collector base material made of aluminum is subjected to roughening treatment using an etchant. The etchant is one or more selected from an alkaline aqueous solution-based etchant including an alkali source and amphoteric metal ions and a ferric ion aqueous solution-based etchant including a ferric ion source, a cupric ion source, a manganese ion source and an inorganic acid.
摘要翻译：要解决的问题：提供一种能够提高含金属氧化物的活性物质层与集电体之间的电子传导性的非水电解质二次电池用负极集电体的制造方法。以及非水电解质二次电池用负极的制造方法。本发明的非水电解质二次电池用负极集电体的制造方法中，将由铝制成的集电体基材的表面进行使用蚀刻剂进行粗化处理。蚀刻剂是选自包括碱源和两性金属离子的碱性水溶液型蚀刻剂中的一种或多种，以及包含铁离子源，铜离子源，锰离子源和无机离子源的三价铁离子水溶液型蚀刻剂酸。

10. 发明专利

JPH1072682A PEELING LIQUID FOR TIN AND TIN ALLOY 失效
公开(公告)号：JPH1072682A
公开(公告)日：1998-03-17
申请号：JP23046396
申请日：1996-08-30
申请人： MEC KK
发明人： AKIYAMA DAISAKU , YAGUMA NORIKO
IPC分类号： C23F1/00 , C23F1/30 , C23F1/44 , H05K3/06
摘要： PROBLEM TO BE SOLVED: To suppress the degradation in a solder peeling speed by limiting the compsn. of a peeling liquid. SOLUTION: This peeling liquid is used to peel tin and tin alloy from a copper base material and is an aq. soln. contg. 150 to 300g/l nitric acid, 5 to 25g/l iron ions, 2 to 20g/l chlorine ions and 10 to 500ppm iodine compd. as an iodine concn. If the nitric acid, iron ions and chlorine ions are respectively below the concn. ranges described above, the solubility power to the tin and tin alloy is too small. If the ranges are exceeded, the dissolution effect is so intensive that the smooth copper surfaces are not obtainable. The iodine compd. which liberates iodine or iodine ion in the peeling liquid suffices and includes sodium iodide, etc. The iodine in the concn. range described above is effectual in suppressing the degradation in the solder peeling speed and in suppressing the erosion of the copper base material.

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