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    • 4. 发明专利
    • Film formation liquid and film formation method using the same
    • 膜形成液体和薄膜形成方法
    • JP2012224895A
    • 2012-11-15
    • JP2011092055
    • 2011-04-18
    • Mec Kkメック株式会社
    • SENGOKU YOICHITSUTAE MASAMITAI KIYOTOKAMIKO KEISUKEAMAYA TAKESHI
    • C23C22/52C23C22/07
    • C23C22/52C23C18/1689C23C22/68H05K3/0079H05K3/108H05K2203/124
    • PROBLEM TO BE SOLVED: To provide a film formation liquid which can stably form the film which improves the adhesion of copper and a photosensitive resin even when being used continuously or repeatedly, and to provide a film formation method using the same.SOLUTION: The film formation liquid which forms the film for bonding copper to a photosensitive resin, comprises an aqueous solution including: an azole having only a nitrogen atom as a ring hetero atom; an acid having a logarithm of the reciprocal of an acid dissociation constant of 3 to 8 at 25°C; and a salt thereof, and has a pH of more than 4 and at most 7 at 25°C. Moreover, the film formation method is a film formation method for forming the film for bonding copper to a photosensitive resin, and is characterized in that the film formation liquid is made to contact the surface of the copper to form the film.
    • 要解决的问题:为了提供即使连续使用或重复使用也可以稳定地形成膜的提高铜和感光性树脂的粘合性的成膜液,并且提供使用该成膜液的成膜方法。 解决方案:将形成用于将铜结合到感光性树脂上的膜的成膜液包含水溶液,其包含仅具有氮原子作为环杂原子的唑类; 在25℃下酸解离常数为3〜8的倒数对数的酸; 和其盐,并且在25℃下具有大于4且至多7的pH。 此外,成膜方法是用于形成用于将铜结合到感光性树脂上的膜的成膜方法,其特征在于使成膜液体与铜的表面接触以形成膜。 版权所有(C)2013,JPO&INPIT