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1. 发明专利

JP2007194312A Multilayer ceramic capacitor 审中-公开
标题翻译：多层陶瓷电容器
公开(公告)号：JP2007194312A
公开(公告)日：2007-08-02
申请号：JP2006009555
申请日：2006-01-18
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OOMI SATOSHI , KAWAMURA TOSHIYA , TANII SUSUMU
IPC分类号： H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To reduce vibration noises due to the vibration of a multilayer ceramic capacitor which is generated by superposition of an AC voltage on a DC voltage.
SOLUTION: In order to realize the purpose, the multilayer ceramic capacitor is provided with a base in which dielectric layers and internal electrodes are alternately laminated, and a pair of external electrodes to which the internal electrodes are alternately connected. The pair of external electrodes are provided on at least both end surfaces and a rear surface of a widthwise direction of the base, and has an operation effect that the reduction of an absolute value of displacement quantity of vibration can reduce the vibration noises, while utilizing the fact that the widthwise direction has the displacement quantity of vibration in a piezoelectric phenomenon smaller than that of its longitudinal direction.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：减少由于交流电压叠加在直流电压上而产生的多层陶瓷电容器的振动引起的振动噪声。解决方案：为了实现目的，多层陶瓷电容器设置有交替层叠电介质层和内部电极的基底和内部电极交替连接的一对外部电极。一对外部电极设置在基座的至少两个端面和宽度方向的后表面上，并且具有使振动位移量的绝对值的减小可以减少振动噪声的操作效果，同时利用宽度方向具有压电现象中的振动位移量小于其纵向的偏移量的事实。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2004311493A Method of manufacturing laminated ceramic electronic component 审中-公开
公开(公告)号：JP2004311493A
公开(公告)日：2004-11-04
申请号：JP2003099072
申请日：2003-04-02
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KOIKE TAKAFUMI , TANII SUSUMU , MIURA KATSUYUKI
IPC分类号： H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated ceramic electronic component that is excellent in mountability by reducing projecting and recessed parts caused by the presence/absence of internal electrodes.
SOLUTION: The method of manufacturing the laminated ceramic electronic component includes a first step of producing a laminate block by alternately laminating green ceramic sheets 15 and internal electrode paste 16 upon another, a second step of dividing the laminate block into a plurality of laminates 12, and a third step of inserting elastic bodies 13 among the laminates 12. The method also includes a fourth step of heating and pressurizing the laminates 12 and a fifth step of separating the laminates 12 from each other and calcining the separated laminates 12.
COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明专利

JP2004273905A Method for manufacturing laminated ceramic electronic component 审中-公开
公开(公告)号：JP2004273905A
公开(公告)日：2004-09-30
申请号：JP2003064883
申请日：2003-03-11
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TANII SUSUMU
IPC分类号： H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a laminated ceramic electronic component which has an excellent planar surface regardless of presence or absence of an internal electrode.
SOLUTION: First, the internal electrode 11 is formed on a ceramic sheet 10 containing polyethylene. The ceramic sheet 10 and the internal electrode 11 are then alternately laminated to form a laminate 14. The laminate 14 is held at a temperature at which the ceramic sheet 10 thermally shrinks, to shrink only part of the laminate 14 where the internal electrode is not formed, thus forming projections 15. Thereafter, the laminate is subjected to hydrostatic pressing operation to accommodate the projections 15 in the internal-electrode non-formation part and to increase the density of the electrode non-formation part. The laminate 14 is then cut and sintered to obtain a sintered body having an excellent surface smoothness. Next, an external electrode is formed to obtain a laminated ceramic capacitor.
COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2003045738A Method of manufacturing ceramic electronic component 审中-公开
标题翻译：制造陶瓷电子元件的方法
公开(公告)号：JP2003045738A
公开(公告)日：2003-02-14
申请号：JP2001234544
申请日：2001-08-02
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAI ATSUO , TANII SUSUMU , SAKAGUCHI YOSHIYA , MIURA KATSUYUKI
IPC分类号： H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To obtain laminated ceramic electronic components, having superior shape accuracy with high productivity by improving linear progressing property, at cutting of a blade to the lower surface from the upper surface of a laminated body block.
SOLUTION: A laminate is obtained, by fixing on a base 10, a laminate block 11 on which a ceramic sheet and a conductive layer are laminated and then cutting the laminated body block 1, while the blade 12 is moved vertically to the other side from one side of the cutting position with respect to the upper surface of the laminate block 11. Thereafter, the laminate is burned, and then external electrodes are formed thereon.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了获得具有优异形状精度的层叠陶瓷电子部件，通过提高线性进行性能，从层压体块的上表面向下表面切割刀片，具有优异的形状精度。解决方案：通过将基板10固定在其上层叠有陶瓷片和导电层的层压块11，然后切割层叠体块1而获得层压体，同时叶片12垂直于另一侧移动相对于层叠块11的上表面的切割位置的一侧。此后，层压体被燃烧，然后在其上形成外部电极。

5. 发明专利

JP2004266122A Manufacturing method of ceramic electronic component 有权
公开(公告)号：JP2004266122A
公开(公告)日：2004-09-24
申请号：JP2003055535
申请日：2003-03-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TANII SUSUMU , YAMAZAKI MITSUHIRO , KITAMACHI TOORU
IPC分类号： H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic electronic component capable of suppressing a structural defect caused by exfoliation of a ceramic sheet.
SOLUTION: The ceramic sheet 13 with a conductor layer 14 is formed on a carrier film 15. Then the ceramic sheet 13 with the conductor layer 14 is stacked on other ceramic sheet 13 of a support plate 11 together with the carrier film 15, and the upper side is entirely pressed. Then corners of the ceramic sheet 13 acting like separating points between the carrier film 15 and the ceramic sheet 13 are pressed and heated again by a press machine 17 via the carrier film 15, and thereafter the carrier film 15 is exfoliated. Similarly, the ceramic sheets 13 with the conductor layer 14 are stacked to produce a laminated body block 19. Then the block 19 is cut and sintered to form an external electrode.
COPYRIGHT: (C)2004,JPO&NCIPI

6. 发明专利

JP2003039418A Method for manufacturing ceramic electronic component 审中-公开
标题翻译：制造陶瓷电子元件的方法
公开(公告)号：JP2003039418A
公开(公告)日：2003-02-13
申请号：JP2001234543
申请日：2001-08-02
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAI ATSUO , TANII SUSUMU , SAKAGUCHI YOSHIYA , MIURA KATSUYUKI
IPC分类号： B28B11/14 , H01G4/30 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic electronic component having a high yield by suppressing a structural defect caused by a cutting step.
SOLUTION: The method for manufacturing the ceramic electronic component comprises the steps of fixing a laminated block 11 obtained by alternatively laminating a ceramic sheet and a conductor layer, onto a pedestal 10, push cutting the block 22 by a cutter 12 made of a metal, then moving the cutter 12 in parallel, cutting plural times the block 11 while confirming a cutting position, thereby obtaining a laminate, cutting at this time while removing the block component adhered to the cutter 12, then baking the laminate and forming an external electrode.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供通过抑制由切割步骤引起的结构缺陷来制造具有高产率的陶瓷电子部件的方法。解决方案：陶瓷电子部件的制造方法包括以下步骤：将通过交替层叠陶瓷片和导体层获得的层叠块11固定在基座10上，通过由金属制成的切割器12推动切割块22，然后平行移动切割器12，同时确认切割位置多次切割块11，从而获得层压体，此时切割，同时移除粘附到切割器12的块状部件，然后烘烤层压体并形成外部电极。

7. 发明专利

JP2007194313A Multilayer ceramic capacitor 审中-公开
标题翻译：多层陶瓷电容器
公开(公告)号：JP2007194313A
公开(公告)日：2007-08-02
申请号：JP2006009556
申请日：2006-01-18
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OOMI SATOSHI , KAWAMURA TOSHIYA , TANII SUSUMU
IPC分类号： H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To reduce vibration noises due to the vibration of a multilayer ceramic capacitor which is generated by superposition of an AC voltage on a DC voltage.
SOLUTION: In order to realize the purpose, the multilayer ceramic capacitor is provided with a base in which dielectric layers and internal electrodes are alternately laminated, and a pair of external electrodes to which the internal electrodes are alternately connected on at least both end surfaces and the rear surface of the base. The internal electrode connected to one external electrode is provided with a first notch on at least a portion opposite to the other external electrode provided on the rear surface of the base, and the internal electrode connected to the other external electrode is provided with a second notch on at least a portion opposite to the one external electrode provided on the rear surface of the base.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：减少由于交流电压叠加在直流电压上而产生的多层陶瓷电容器的振动引起的振动噪声。解决方案：为了实现目的，多层陶瓷电容器设置有电介质层和内部电极交替层叠的基底和至少两个内部电极交替连接的一对外部电极端面和底座的后表面。连接到一个外部电极的内部电极在与设置在基座的后表面上的另一外部电极相对的至少一部分上设置有第一凹口，并且连接到另一个外部电极的内部电极设置有第二凹口至少与设置在基座的后表面上的一个外部电极相对的部分。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2005303028A Method of manufacturing laminated ceramic electronic part 有权
标题翻译：层压陶瓷电子零件的制造方法
公开(公告)号：JP2005303028A
公开(公告)日：2005-10-27
申请号：JP2004117598
申请日：2004-04-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TANII SUSUMU , OSAWA JUNICHI , YAMAZAKI MITSUHIRO
IPC分类号： H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To solve the problem that, since the lower part of a laminate has more number of times of pressurizing than the upper part, the lower part becomes higher density than the upper part, and when this laminate is baked, since the contraction degrees of the high density and the low density are different, a structural defect, such as a crack, peeling, etc. occurs in a laminated ceramic capacitor.
SOLUTION: A method of manufacturing a laminated ceramic electronic part includes a first process of manufacturing a ceramic sheet made of a ceramic powder and an organic material, a second process of obtaining the laminate by alternately laminating predetermined number of times the ceramic sheet and a conductor layer, a third process of pressurizing the laminate, a fourth process of obtaining a laminated green chip of individual pieces by cutting the laminate after the pressurizing, and a fifth process of forming the outer electrode after the laminated green chip. The pressurizing in the third process pressurizes the laminate from a vertical direction by using an upper pressurizing die and a lower pressurizing die, and pressurizes in the state that the upper pressurizing die is heated and the lower pressurizing die is not heated.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题为了解决由于层叠体的下部比上部更多的加压次数，下部变得比上部更高的密度，并且当该层压体被烘烤时由于高密度和低密度的收缩度不同，所以在层叠陶瓷电容器中产生裂纹，剥离等结构缺陷。＆lt; P＆gt;解决方案：层压陶瓷电子部件的制造方法包括：制造陶瓷粉末和有机材料的陶瓷片的第一工序，通过交替层叠预定次数的陶瓷片导体层，加压层叠体的第3工序，加压后通过切断层叠体得到各片的层叠绿色芯片的第4工序，以及在层叠的绿色芯片之后形成外部电极的第5工序。第三工序中的加压通过使用上加压模和下加压模从垂直方向加压层叠体，并且在加压上加压模和加压下加压模的状态下进行加压。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2002184646A METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT 失效
公开(公告)号：JP2002184646A
公开(公告)日：2002-06-28
申请号：JP2000376986
申请日：2000-12-12
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAGAI ATSUO , SAKAGUCHI YOSHIYA , TANII SUSUMU , MIURA KATSUYUKI , YAMAZAKI MITSUHIRO
IPC分类号： H01G4/12 , H01G4/30 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide a method, with which ceramic electronic components that can be cut surely at a desired position, can be manufactured. SOLUTION: This method includes a first step of fixing a laminate 14 of ceramic sheets 20 containing organic matters and internal electrodes 31 on a pedestal 11, a second step of cutting the laminate 14 into a desired shape, and a third step of baking the cut laminate 14. The internal electrodes 21 are exposed on both end faces of the laminate 14 prior to cutting and the second step is carried out, while watching both end faces of the laminate 14, on which the electrodes 21 are exposed.

10. 发明专利

JPH09136158A SOLDERING METHOD 失效
公开(公告)号：JPH09136158A
公开(公告)日：1997-05-27
申请号：JP29100095
申请日：1995-11-09
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： WAKAHATA YASUO , KATSUMATA MASAAKI , TANII SUSUMU , GOTO MASAFUMI , IGARASHI TAKASHI
IPC分类号： B23K1/20 , B23K35/363 , H01R4/02
摘要： PROBLEM TO BE SOLVED: To provide a soldering method which leaves no residue of the soldering assistant, is friendly to the working environment, and is capable of dispensing with the cleaning after soldering in the soldering operation of a material to be soldered. SOLUTION: The soldering assistant consists of the organic compound which has the bond group whose bond dissociation energy is

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