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1. 发明专利

JP2004068092A Hard carbon film coated member and film deposition method 有权
公开(公告)号：JP2004068092A
公开(公告)日：2004-03-04
申请号：JP2002229781
申请日：2002-08-07
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TANIDA TAKAHIKO , YAMADA OSAMU , OKUDA EIJI , IMOTO HIDEO , HATAYAMA TAKESHI , YAMASHITA HIROSHI
IPC分类号： C23C14/06 , C23C28/00
摘要： PROBLEM TO BE SOLVED: To provide a member having a hard carbon film of excellent adhesiveness to a base material formed thereon, and a method for forming the member.
SOLUTION: An intermediate layer is provided between a base material 2 and a hard carbon film layer 5 as an adhesive layer to the hard carbon film layer 5 on the base material 2. The intermediate layer comprises a substrate layer 2 formed of a thin film of metal selected from a group of IVa, Va, VIa, VIIa, VIIIa and IVb group elements, and a mixed layer 4 formed of carbide of metal elements selected from a group of IVa, Va, VIa, VIIa, VIIIa and IVb group elements. Adhesiveness of the base material to the hard carbon film is improved thereby.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2008203114A Optical measuring device 审中-公开
标题翻译：光学测量装置
公开(公告)号：JP2008203114A
公开(公告)日：2008-09-04
申请号：JP2007040226
申请日：2007-02-21
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TANIDA TAKAHIKO
IPC分类号： G01N21/78 , G01N21/27
摘要： PROBLEM TO BE SOLVED: To provide an optical measuring device capable of detecting a moving speed of a test piece 3 to change a data sampling interval for a reflected light or a scattered light generated by irradiating the test piece 3 with a measuring light in response to the moving speed of the test piece 3.
SOLUTION: The optical measuring device includes a rack 13 and a rotary gear 14 rotated meshed with the rack 13, in an under side of a stage 4, and an encoder is installed coaxially with the rotary gear 14. An attachment 2 set with the test piece 3 is installed in the stage, and the moving speed when the test piece 3 is scanned is found by counting the number of pulses of encoder output waveforms 18 during a prescribed time. A sampling interval for an ADC 11 is changed in response to the moving speed, by calculating the data sampling interval based on the moving speed of the test piece 3.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种光学测量装置，其能够检测测试片3的移动速度，以改变通过用测量光照射测试片3产生的反射光或散射光的数据采样间隔响应于测试件3的移动速度。解决方案：光学测量装置包括在台架4的下侧的齿条13和与齿条13旋转的旋转齿轮14，编码器是与旋转齿轮14同轴地安装。设置有测试片3的附件2安装在舞台中，并且通过在规定的时间内对编码器输出波形18的脉冲数进行计数来发现扫描测试片3的移动速度时间。通过根据测试件3的移动速度计算数据采样间隔，响应于移动速度改变ADC11的采样间隔。（C）2008，JPO＆INPIT

3. 发明专利

JP2004277800A Method and apparatus for depositing carbon thin film 审中-公开
公开(公告)号：JP2004277800A
公开(公告)日：2004-10-07
申请号：JP2003069986
申请日：2003-03-14
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAMADA OSAMU , OKUDA EIJI , IMOTO HIDEO , HATAYAMA TAKESHI , TANIDA TAKAHIKO , YAMASHITA HIROSHI
IPC分类号： C23C16/26 , C23C16/27 , C23C16/505
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for depositing a carbon thin film in which the carbon thin film is deposited by using a plasma CVD method at a high speed to enhance productivity while ensuring the film quality of excellent hardness and wear resistance.
SOLUTION: Plasma is generated by supplying the power between an electrode 2 and an opposing electrode 4, and a carbon thin film is deposited on a base material 3 by the bias voltage at optimum temperature by controlling heat generation in the base material 3 by a cooling unit 19. In particular, the ion collision energy is increased and heat generation is increased thereby when the film of high hardness is deposited at high bias voltage or when the power density of the base material is increased to increase the film deposition speed. Temperature rise is controlled by providing a cooling means, and the film is deposited with excellent productivity while maintaining excellent characteristics of the carbon thin film.
COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2004277798A Film deposition system and film deposition method 审中-公开
公开(公告)号：JP2004277798A
公开(公告)日：2004-10-07
申请号：JP2003069984
申请日：2003-03-14
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKUDA EIJI , YAMADA OSAMU , IMOTO HIDEO , HATAYAMA TAKESHI , TANIDA TAKAHIKO , YAMASHITA HIROSHI
IPC分类号： C23C14/56 , C23C16/44
摘要： PROBLEM TO BE SOLVED: To solve problems that it is difficult in the matter of dusting and a load-locking structure caused by using a movable mechanism when the surface of a three-dimensional substrate is subjected to a film deposition in a rotation-revolution system heretofore, it is difficult in the matter of power supply, temperature control, and automation of mounting the substrate, and much time are necessary to mounting cannot be easily and automatically fitted, and a large amount of film deposition samples and much time are necessary for a process condition and a sample film deposition. SOLUTION: The film deposition system has a film deposition chamber group consisting of at least two film deposition chambers arranged on substantially the same surfaces and capable of simultaneously performing film deposition of a plurality of substrates to be trated, and comprises a substrae conveying means slidable at least on the surface and in the vertical direction, and a substrate supporting stand mounted on the substrate conveying means. The substrate placed on the substrate supporting stand can be conveyed in or out to/from the film deposition chamber by the straight movement action of the substrate conveying means. COPYRIGHT: (C)2005,JPO&NCIPI

5. 发明专利

JP2004068091A Apparatus and method for film-forming treatment 审中-公开
标题翻译：用于成膜处理的装置和方法
公开(公告)号：JP2004068091A
公开(公告)日：2004-03-04
申请号：JP2002229780
申请日：2002-08-07
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKUDA EIJI , YAMADA OSAMU , IMOTO HIDEO , HATAYAMA TAKESHI , TANIDA TAKAHIKO , YAMASHITA HIROSHI
IPC分类号： C23C16/50 , C23C16/26 , H01L21/285
摘要： PROBLEM TO BE SOLVED: To solve a problem that the prior arts compose an entire apparatus while including peripheral functions other than a film-forming function such as a load lock chamber or a substrate transfer chamber, and consequently that the whole apparatus becomes large, a facility cost increases, maintenance, model change and new model launching take much time, and flexibility to the production quantity is poor. SOLUTION: An apparatus for film-forming treatment has at least two groups of film-forming chambers 1 which can perform film-forming treatment simultaneously for several substrates 2 to be film-formed, wherein components in the film-forming chamber 1 are substantially similarly configured and arranged with respect to the substrates 2 to be film-formed; and further has at least one or more preliminary vacuum chambers 10 provided in an exhaust path leading to an exhaust means 11 for exhausting the air from the film-forming chamber 1. A small apparatus which can complete all processes of import, export, vacuum drawing and film-forming treatment in one unit, is realized by using the above apparatus for film-forming treatment. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题为了解决现有技术构成整个装置同时包括诸如装载锁定室或基板传送室之类的成膜功能的外围功能的问题，并且因此整个装置变成设备成本增加，维护，型号变更和新型发布需要很多时间，生产量的灵活性差。解决方案：一种用于成膜处理的设备具有至少两组成膜室1，它们可以对要成膜的几个基板2同时进行成膜处理，其中成膜室1中的成分基本上类似地构造并相对于待成膜的基板2布置; 并且还具有至少一个或多个设置在通向排出装置11的排气路径中的初级真空室10，用于从成膜室1排出空气。可以完成进口，出口，真空吸附的所有过程的小型装置并且通过使用上述成膜处理装置来实现一个单位的成膜处理。版权所有（C）2004，JPO

6. 发明专利

JP2004300464A Film-forming apparatus 审中-公开
标题翻译：电影制作装置
公开(公告)号：JP2004300464A
公开(公告)日：2004-10-28
申请号：JP2003091893
申请日：2003-03-28
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAMASHITA HIROSHI , YAMADA OSAMU , OKUDA EIJI , IMOTO HIDEO , HATAYAMA TAKESHI , TANIDA TAKAHIKO
IPC分类号： C23C14/50 , C23C16/44 , H01L21/31
摘要： PROBLEM TO BE SOLVED: To improve a throughput of an apparatus, by shortening a period required for exhausting air from a load lock chamber capable of arranging several substrates therein.
SOLUTION: The film-forming apparatus provided with the load lock chamber for reducing the pressure from ambient pressure, an exhausting means for depressurization, a film-forming chamber which can be depressurized into a predetermined pressure, a gas supply means for the film-forming chamber, an exhausting means for depressurization, and a power supply means for generating plasma, comprises at least one load lock chamber which can arrange a plurality of substrates therein, installs a first openable and closable pressure partition capable of blocking out the pressure from the atmospheric air side, and a second pressure partition capable of protecting a vacuum side from the pressure, and has a decompression space installed inside for the purpose of decreasing the size of a space formed between an inner wall and the substrate, or between the substrates. Then, the apparatus can shorten the period required for exhausting air from the load lock chamber.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过缩短从能够在其中布置多个基板的负载锁定室排出空气所需的时间段来提高装置的生产量。解决方案：设置有用于降低环境压力的负载锁定室的成膜设备，用于减压的排气装置，可以减压到预定压力的成膜室，用于成膜室，用于减压的排气装置和用于产生等离子体的供电装置，包括至少一个能够在其中布置多个基板的装载锁定室，安装能够阻挡压力的第一可开启和关闭的压力分隔件以及能够保护真空侧免受压力的第二压力分隔壁，并且为了减小形成在内壁和基板之间的空间的尺寸，或者在基板。然后，该装置可以缩短从负载锁定室排出空气所需的时间。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2003025610A Inkjet head 审中-公开
标题翻译： INKJET HEAD
公开(公告)号：JP2003025610A
公开(公告)日：2003-01-29
申请号：JP2001216050
申请日：2001-07-17
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SUGIMOTO HIROBUMI , SONE KOJI , YAMADA OSAMU , OKUDA EIJI , KINOSHITA YUTAKA , TANIDA TAKAHIKO
IPC分类号： B41J2/18 , B41J2/175 , B41J2/185
摘要： PROBLEM TO BE SOLVED: To provide an inkjet head capable of discharging ink drops ejected by idling without allowing the ink drops to be stuck to an ejection face again, of preventing defective ejection such as bending of ejection, and of performing stable ejection.
SOLUTION: An arrival target material 7 which makes an atomized ink drop 5 ejected by idling to be a liquid drop by allowing the ink drop to be collided therewith is provided on a position where a predetermined gap is formed between the material 7 and an ejection face 3 having nozzles 4 arranged thereon. It is possible to prevent scattering of the ink drops by making the atomized ink drop 5 to be a liquid drop.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种能够排出通过空转喷射的墨滴而不允许墨滴再次粘附到喷射面上的喷墨头，以防止诸如喷射弯曲之类的不良喷射和进行稳定喷射。解决方案：通过允许墨滴与其相撞而使通过怠速喷射成液滴的雾化墨滴5的到达目标材料7设置在材料7和喷射面之间形成预定间隙的位置 3具有布置在其上的喷嘴4。通过使雾化的墨滴5成为液滴，可以防止墨滴的散射。

8. 发明专利

JP2004300465A Sputtering apparatus 审中-公开
公开(公告)号：JP2004300465A
公开(公告)日：2004-10-28
申请号：JP2003091894
申请日：2003-03-28
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： HATAYAMA TAKESHI , YAMADA OSAMU , OKUDA EIJI , IMOTO HIDEO , TANIDA TAKAHIKO , YAMASHITA HIROSHI
IPC分类号： C23C14/34 , C23C16/26
摘要： PROBLEM TO BE SOLVED: To solve a problem that a conventional film-forming apparatus is upsized and becomes expensive, because when a three-dimensional substrate is to be film-formed, in order to realize a uniform film thickness, the apparatus uses a table with a rotation and revolution mechanism for rotating a substrate to be film-formed, in a film-forming chamber.
SOLUTION: The sputtering apparatus is provided with a film-forming chamber 1 capable of being depressurized, a sample support 3 for arranging the substrate 2 to be film-formed in the film-forming chamber, a target 5 containing film-forming elements, a gas supply means 4, an exhausting means 11 for depressurization, and a power supply means 6a for applying voltage onto the target for generating plasma of a sputtering gas in a space between the substrate 2 to be film-formed and the target 5, wherein the target 5 is arranged so as to face the outer peripheral surface of the substrate 2 to be film-formed. Then, the apparatus can form a thin film with high uniformity, and can be miniaturized because of employing no rotation mechanism.
COPYRIGHT: (C)2005,JPO&NCIPI

9. 发明专利

JP2004277799A Film-forming apparatus and cleaning method therefor 审中-公开
公开(公告)号：JP2004277799A
公开(公告)日：2004-10-07
申请号：JP2003069985
申请日：2003-03-14
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TANIDA TAKAHIKO , YAMADA OSAMU , OKUDA EIJI , IMOTO HIDEO , HATAYAMA TAKESHI , YAMASHITA HIROSHI
IPC分类号： C23C14/22 , C23C16/44
摘要： PROBLEM TO BE SOLVED: To reduce the dropping of a deposit on a deposition shield in an apparatus for forming a hard carbon film, and to efficiently plasma-cleaning the deposition shield.
SOLUTION: This film-forming apparatus arranges the deposition shields 11 and 12 with openings held on an insulation glass, inside a vacuum vessel 1 so as to cover two plasma sources, and a shutter 8 on the opening. The material of a sputter target 10 is deposited onto the deposition shield 11, and carbon is deposited onto the deposition shield 12. The film-forming apparatus has a configuration capable of independently electrically plasma-cleaning the deposition shields 11 and 12 which are connected to a pulsed power supply outside a vacuum unit, through a switching means.
COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2002286924A METHOD FOR MANUFACTURING COLOR FILTER 失效
公开(公告)号：JP2002286924A
公开(公告)日：2002-10-03
申请号：JP2001086507
申请日：2001-03-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： IMOTO HIDEO , YAMADA OSAMU , OKUDA EIJI , KINOSHITA YUTAKA , TANIDA TAKAHIKO , SUGIMOTO HIROBUMI
IPC分类号： B41J2/01 , G02B5/20 , G02F1/1335
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a color filter suitable for manufacturing a delta arrayed color filter with an inkjet method. SOLUTION: The method for manufacturing the color filter is characterized by arranging a plurality of head-units 16, 17, 18, comprising inkjet nozzles arranged in series with the same filter color pitch (a) with respect to each filter color, in parallel while respectively staggering their positions by one pixel pitch in the serial arranging direction of the inkjet nozzles, by shooting ink for a filter material from the corresponding inkjet nozzles at filter cells of one row out of an even number row and an odd number row of a black matrix of a substrate 2 in the first relative displacement between the substrate 2 and the head-units 16, 17, 18, by shooting the ink for the filter material at the substrate 2 in the second relative displacement, in which the ink for the filter material is shot at filter cells of the other row of the black matrix, while relatively displacing at least one out of the substrate 2 and the head-units 16, 17, 18 by 1.5 times pixel pitch in a direction intersecting the first relative displacement direction and by switching a shooting condition of the inkjet nozzle on end parts of the head-units on one relative displacement out of the first and the second ones.

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