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1. 发明专利

JP2008239420A Method for manufacturing ceramic green sheet, ceramic green sheet, and ceramic capacitor using the same 审中-公开
标题翻译：陶瓷绿板，陶瓷绿板，陶瓷电容器的制造方法
公开(公告)号：JP2008239420A
公开(公告)日：2008-10-09
申请号：JP2007083722
申请日：2007-03-28
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKUZAWA TOMOHIRO , SHIMAZAKI YUKIHIRO , NISHIMURA TSUTOMU , OKUDA KAZUHIRO
IPC分类号： C04B35/622 , H01G4/12
摘要： PROBLEM TO BE SOLVED: To improve reliability of a capacitor although a dielectric layer is made thinner. SOLUTION: The method for manufacturing a ceramic green sheet comprises a dispersion step of dispersing slurry containing ceramic particles and a binder to control BET value of the ceramic particles so as to be almost identical before and after the dispersion process. Thus, the ceramic particles are uniform in the particle diameter, and the fluctuation of the dielectric breakdown voltage can be suppressed even when a dielectric layer is made thinner, thereby improving the reliability as the ceramic capacitor. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提高电容器的可靠性，尽管电介质层变薄。＆lt; P＆gt;解决方案：陶瓷生片的制造方法包括：分散含有陶瓷粒子和粘合剂的浆料的分散工序，以控制陶瓷粒子的BET值，使分散处理前后几乎相同。因此，陶瓷颗粒的粒径是均匀的，并且即使当电介质层变薄时也可以抑制介电击穿电压的波动，从而提高作为陶瓷电容器的可靠性。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2008120922A Prepreg, prepreg production method, printed circuit board using the prepreg, and method for production of printed board 审中-公开
标题翻译： PREPREG，PREPREG生产方法，使用PREPREG的印刷电路板和印刷板的生产方法
公开(公告)号：JP2008120922A
公开(公告)日：2008-05-29
申请号：JP2006306333
申请日：2006-11-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ASAHI TOSHIYUKI , SHIMAZAKI YUKIHIRO , NAKAO KEIICHI
IPC分类号： C08J5/24 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To solve the problem that it is difficult to use a prepreg using a conventional crystalline resin for making e.g., a circuit board required to have specified strength because of hardness and brittleness inherent in the crystalline resin used to enhance the thermal conductivity of a circuit board.
SOLUTION: A crystalline epoxy resin 20 is mixed with a phenyl group 31 (or mesogen)-containing thermoplastic resin such as an amorphous, high-Tg (Tg is a glass transition temperature), and high-strength PPE resin 21, whereupon the phenyl groups 31 of the respective resins are oriented to effect crystallization. After the addition of an inorganic filler 23 to the mixture, the resultant mixture is used to form a prepreg 26. Such prepregs can give a printed wiring board having an improved proof stress (or cracking resistance) and an improved Tg as well as high thermal conductivity.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了解决难以使用常规结晶树脂的预浸料的问题，例如，由于用于提高的结晶树脂中固有的硬度和脆性而需要具有特定强度的电路板电路板的导热性。解决方案：将结晶环氧树脂20与无定形，高Tg（Tg为玻璃化转变温度）的苯基31（或含介晶）的热塑性树脂和高强度PPE树脂21混合，于是，各树脂的苯基31取向成使结晶化。在将无机填料23加入到混合物中之后，所得混合物用于形成预浸料坯26.这样的预浸料可以得到具有改善的耐应力（或抗裂性）和改进的Tg以及高热的印刷线路板电导率。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2008066556A Ceramic green sheet, laminated ceramic electronic part using the same, and manufacturing method thereof 有权
标题翻译：陶瓷绿板，使用其的层压陶瓷电子部件及其制造方法
公开(公告)号：JP2008066556A
公开(公告)日：2008-03-21
申请号：JP2006243698
申请日：2006-09-08
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKUZAWA TOMOHIRO , SHIMAZAKI YUKIHIRO
IPC分类号： H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a ceramic green sheet capable of suppressing the lowering of a short rate and an insulating withstand voltage even if a dielectric layer is thinned, a laminated ceramic electronic part using the ceramic green sheet, and a manufacturing method thereof.
SOLUTION: The manufacturing method is characterized by including: a ceramic material; butyral system resin or acryl system resin; and at least one chosen from a group composed of polyester system resin whose Tg is 30°C or lower, EVA (ethylene-vinyl acetate copolymer) system resin, polyamide system resin, and polypropylene system resin.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供即使介电层变薄也能够抑制短速率和绝缘耐压降低的陶瓷生片，使用陶瓷生片的层叠陶瓷电子部件和制造方法。解决方案：制造方法的特征在于包括：陶瓷材料; 丁缩醛树脂或丙烯酸系树脂; 和由Tg为30℃以下的聚酯系树脂组成的组中的至少一种，EVA（乙烯 - 乙酸乙烯酯共聚物）系树脂，聚酰胺系树脂，聚丙烯系树脂等。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2008042068A Multilayer capacitor, and its manufacturing method 审中-公开
标题翻译：多层电容器及其制造方法
公开(公告)号：JP2008042068A
公开(公告)日：2008-02-21
申请号：JP2006216864
申请日：2006-08-09
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： HASHIMOTO AKIRA , SHIMAZAKI YUKIHIRO , OCHI YUKIKAZU
IPC分类号： H01G4/30 , H01G4/33
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a capacitor excellent in adhesion and electric characteristics, using conductive adhesives to be hardened by heating at not more than 300°C, as external electrodes for a multilayer capacitor. SOLUTION: The method includes a process for exposing a metallic leaves 1 in a projected shape from a lamination body by previously removing the surfaces of dielectric bodies on the end surfaces in order to raise electric connection between the metallic leaves 1 being the internal electrodes of a capacitor element and the external electrodes. The external electrodes are divided into two layers. A metallic organic compound is added to metallic powder being a conductive component in order to raise bonding property with metallic leave exposure parts 6 concerning a conductive paste for the first external electrode 3, so as to raise the electric connection in the metallic powder. Simultaneously, the amount of a bonding component in the conductive paste for the second external electrode 4 is adjusted, so as to obtain the conductive paste which is hardened by heating at not more than 300°C with excellent connection with the internal metallic leaves. Thus, the external electrodes are formed. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造具有优异的粘合性和电特性的电容器的方法，使用通过在不高于300℃的加热下硬化的导电粘合剂作为多层电容器的外部电极。解决方案：该方法包括通过预先去除端面上的电介质体的表面，从层压体露出金属叶片1的方法，以便提高作为内部的金属叶片1之间的电连接电容器元件的电极和外部电极。外部电极分为两层。为了提高与用于第一外部电极3的导电浆料的金属假暴露部分6的接合性能，将金属有机化合物加入到作为导电组分的金属粉末中，以提高金属粉末中的电连接。同时，调整用于第二外部电极4的导电性糊料中的结合成分的量，以获得通过与内部金属叶片的良好连接而在不高于300℃下加热而硬化的导电浆料。因此，形成外部电极。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007184333A Ceramic green-sheet with embedded electrode, method for manufacturing the same, and method for manufacturing laminated ceramic electronic component utilizing the same 审中-公开
标题翻译：具有嵌入式电极的陶瓷绿色片，其制造方法以及使用其的层压陶瓷电子元件的制造方法
公开(公告)号：JP2007184333A
公开(公告)日：2007-07-19
申请号：JP2006000341
申请日：2006-01-05
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： FUCHI TETSUO , SHIMAZAKI YUKIHIRO , TOMIOKA SATOSHI , NISHIMURA TSUTOMU
IPC分类号： H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a ceramic green-sheet with embedded electrode having compression property for controlling reduction in a short-circuit rate and an insulation resistance voltage, under the condition that thickness is reduced by utilizing a thinner laminated ceramic green-sheet, and also to provide a method for manufacturing the same ceramic green-sheet, and a method for manufacturing a higher capacity and highly reliable laminated ceramic capacitor utilizing the same ceramic green-sheet. SOLUTION: The ceramic green-sheet used for ceramic electronic components comprises a ceramic green-sheet 15 provided with an embedded electrode having compression property formed by coating a ceramics slurry, over a lower ceramic green-sheet 11 with an electrode pattern 12 formed thereto. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供陶瓷生片，其具有用于控制短路速率降低和绝缘电阻电压的压缩特性的嵌入电极，在通过利用较薄的层叠陶瓷绿并且还提供了制造相同陶瓷生片的方法，以及利用相同的陶瓷生片制造高容量，高可靠性的层叠陶瓷电容器的方法。＆lt; P＆gt;解决方案：用于陶瓷电子部件的陶瓷生片包括陶瓷生片15，其具有通过在陶瓷生片上涂覆陶瓷浆料而形成的具有压缩特性的嵌入电极，并具有电极图案12 形成。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2005277394A Manufacturing method of wiring board 审中-公开
标题翻译：接线板制造方法
公开(公告)号：JP2005277394A
公开(公告)日：2005-10-06
申请号：JP2005038814
申请日：2005-02-16
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： FUWA YASUSHI , SHIMAZAKI YUKIHIRO , HIMORI GOJI
IPC分类号： H05K3/20
摘要： PROBLEM TO BE SOLVED: To solve the problem that the deformation and the peeling of a conductor pattern occur.
SOLUTION: An adhesive layer formation process 101 is a manufacturing method of wiring boards having: a lamination process 106 for performing the thermocompression bonding of a substrate 2 with an adhesive sheet 6 comprising a flexible film 5, a mold-releasing agent 10 formed on the flexible film 5, and an adhesive layer 44 formed on the mold-releasing agent 10 and having a roughly uniform thickness mounted to laminate the adhesive sheet 6 to the substrate 2; and a peeling process 107 for peeling the flexible film 5 from the substrate 2 after the lamination process 106 to form the adhesive layer 44 on the substrate 2 side. Thereby, the adhesive layer with the uniform and stable film thickness can be obtained on the substrate. Thus, the wiring board with the low possibility of the occurrence of the deformation and the peeling of the conductor pattern can be obtained.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了解决导体图案的变形和剥离发生的问题。粘合层形成工序101是布线基板的制造方法，其具有：层压工序106，用于对基片2进行热压接，粘合片6包括柔性膜5，脱模剂10 形成在柔性膜5上的粘合剂层44和形成在脱模剂10上并具有大致均匀厚度的粘合剂层44，以将粘合片6层压到基底2上; 以及剥离处理107，用于在层压处理106之后从基板2剥离柔性膜5，以在基板2侧上形成粘合剂层44。由此，可以在基板上获得具有均匀且稳定的膜厚的粘合剂层。因此，可以获得发生变形和导体图案剥离的可能性低的布线板。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005191409A Method for manufacturing laminated ceramic capacitor 审中-公开
标题翻译：制造层压陶瓷电容器的方法
公开(公告)号：JP2005191409A
公开(公告)日：2005-07-14
申请号：JP2003433145
申请日：2003-12-26
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NISHIMURA TSUTOMU , SHIMAZAKI YUKIHIRO , TOMIOKA SATOSHI , FUCHI TETSUO , AOKI NOBUYUKI
IPC分类号： H01G4/12 , H01G4/30
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated ceramic capacitor of a small size and a large capacity having an excellent dimensional accuracy and having less short-circuiting failure and less internal structure defect even when the capacitor is made to be thin and highly laminated. SOLUTION: The method comprises the steps of preparing a dielectric green sheet having an internal electrode pattern 21 formed therein and a restricting green sheet 32, laminating a predetermined number of the dielectric green sheets and placing the restricting green sheet on each of the upper and lower sides of the laminate, baking the laminate at a temperature not lower than the sintering temperature of the dielectric material and lower than the sintering temperature of the inorganic material of the restricting green sheet, removing the inorganic material from the baked laminate, and dividing the baked laminate into individual pieces. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种具有尺寸精度小且具有较小的短路故障和较少内部结构缺陷的小尺寸和大容量的层叠陶瓷电容器的制造方法，即使将电容器制成薄而高度层压。解决方案：该方法包括制备其中形成有内部电极图案21的电介质生片和限制生片32，层叠预定数量的电介质生片并将限制生片放置在每个层叠体的上侧和下侧，在不低于介电材料的烧结温度的温度下烘烤层压体，并且低于限制性生片的无机材料的烧结温度，从焙烧的层压体中除去无机材料，以及将烘烤的层压体分成单独的部件。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2005056977A Method for manufacturing laminated ceramic substrate and dielectric lamination device 审中-公开
标题翻译：制造层压陶瓷基板和电介质层压装置的方法
公开(公告)号：JP2005056977A
公开(公告)日：2005-03-03
申请号：JP2003284787
申请日：2003-08-01
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SAWADA MUNEYUKI , KATSUMURA HIDENORI , SHIMAZAKI YUKIHIRO , KAGATA HIROSHI
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H01L2224/16225 , H01L2924/15153 , H01L2924/1531
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated ceramic substrate that is provided with a cavity for preventing a crack generating on a boundary surface between the cavity and a bottom surface, as well as a dielectric lamination device.
SOLUTION: The manufacturing method includes a step to manufacture a green sheet laminated body formed of an adhesive layer that is imprinted from a base film and arranged on at least one main surface of a calcinated ceramic substrate, a plurality of first ceramic green sheet layers wherein cavities 21 are formed and a second ceramic green sheet layer that is not sintered at such a temperature that the first ceramic green sheet layer can be sintered, and a step for recalcination at a temperature that the first ceramic green sheet layer can be sintered and the second ceramic green sheet layer cannot be sintered.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制造层压陶瓷基板的方法，该层压陶瓷基板具有用于防止在空腔和底面之间的边界面上产生裂纹的空腔以及介电层压装置。解决方案：制造方法包括制造由粘合剂层形成的生片层叠体的步骤，该粘合剂层从基膜压印并设置在煅烧陶瓷基板的至少一个主表面上，多个第一陶瓷绿在第一陶瓷生片层可以烧结的温度下不形成第二陶瓷生片层的第二陶瓷生片层和在第一陶瓷生片层可以烧成的温度下的第二陶瓷生片层，并且第二陶瓷生片层不能烧结。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2008277671A Metallized film capacitor and pen film used for it 审中-公开
标题翻译：金属化膜电容器和用于其的笔式电影
公开(公告)号：JP2008277671A
公开(公告)日：2008-11-13
申请号：JP2007122067
申请日：2007-05-07
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKEOKA HIROKI , FUJII HIROSHI , OCHI YUKIKAZU , SHIMAZAKI YUKIHIRO
IPC分类号： H01G4/18
摘要： PROBLEM TO BE SOLVED: To achieve high heat resistance and high withstand voltage at the same time regarding a metallized film capacitor used for a motor vehicle or the like.
SOLUTION: The capacitor comprises an element whereon a pair of metallized films are wound so that a metal vapor deposition electrode 2 is disposed opposed via a dielectric film 1 and a metallicon electrode 4 formed in both ends of the element. A PEN film which does not contain a filler is used as the dielectric film 1 and thermal contraction rate of the PEN film in a longitudinal direction at 150°C is 1.5 to 4.0%. According to this constitution, unevenness of a film surface is reduced as filler is not incorporated, and the film does not bite air when the dielectric film 1 is wound in lamination. Furthermore, since thermal contraction rate in a longitudinal direction is large, an element of higher winding fastening force can be obtained by carrying out thermal aging, thus achieving high heat resistance and high withstand voltage at the same time.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了与用于机动车辆等的金属化膜电容器同时实现高耐热性和高耐受电压。电容器包括其上缠绕一对金属化膜的元件，使得金属蒸镀电极2经由电介质膜1和形成在元件两端的金属电极4相对设置。使用不含填料的PEN膜作为电介质膜1，PEN膜在150℃下的长度方向的热收缩率为1.5〜4.0％。根据这种结构，由于不加入填料，所以膜表面的不均匀性降低，当电介质膜1层叠时，膜不会咬住空气。此外，由于长度方向的热收缩率大，因此通过进行热老化，可以获得更高的卷绕紧固力的元件，从而同时实现高耐热性和高耐受电压。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2007250829A Metallized film capacitor 审中-公开
标题翻译：金属膜电容器
公开(公告)号：JP2007250829A
公开(公告)日：2007-09-27
申请号：JP2006072327
申请日：2006-03-16
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OCHI YUKIKAZU , TAKEOKA HIROKI , SHIMAZAKI YUKIHIRO
IPC分类号： H01G4/18
摘要： PROBLEM TO BE SOLVED: To provide a metallized film capacitor capable of stabilizing characteristics at a high temperature by making a dielectric film cross-linked, and capable of improving self-healing ability.
SOLUTION: A metallized film 6 is used as formed by crosslinking the dielectric film 4 made of polypropylene, and forming an internal electrode film 5 on the surface of the cross-linked film 4 by vapor deposition. The cross-linkage of polypropylene inhibits deformation and shrinkage of the film 4 at a high temperature for stabilizing the high-temperature characteristics of the metallized film capacitor 1. Furthermore, wettability of the dielectric film 4 is improved by cross-linked polypropylene molecules to increase the adhesion with the internal electrode film 5. Accordingly, the electrode film 5 can be thinned, thereby improving the self-healing ability of the film capacitor 1.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过使电介质膜交联而在高温下稳定特性并能够提高自愈能力的金属化薄膜电容器。解决方案：通过交联由聚丙烯制成的电介质膜4形成的金属化膜6，并通过气相沉积在交联膜4的表面上形成内部电极膜5。聚丙烯的交联键抑制了高温下的膜4的变形和收缩，以稳定金属化膜电容器1的高温特性。此外，通过交联的聚丙烯分子改善电介质膜4的润湿性，以增加因此，可以使电极膜5变薄，从而提高膜电容器1的自愈能力。版权所有（C）2007，JPO＆INPIT

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