发明专利
JP2008120922A Prepreg, prepreg production method, printed circuit board using the prepreg, and method for production of printed board
审中-公开
基本信息:
- 专利标题： Prepreg, prepreg production method, printed circuit board using the prepreg, and method for production of printed board
- 专利标题（中）：PREPREG，PREPREG生产方法，使用PREPREG的印刷电路板和印刷板的生产方法
- 申请号：JP2006306333 申请日：2006-11-13
- 公开(公告)号：JP2008120922A 公开(公告)日：2008-05-29
- 发明人： ASAHI TOSHIYUKI , SHIMAZAKI YUKIHIRO , NAKAO KEIICHI
- 申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
- 专利权人： Matsushita Electric Ind Co Ltd,松下電器産業株式会社
- 当前专利权人： Matsushita Electric Ind Co Ltd,松下電器産業株式会社
- 优先权： JP2006306333 2006-11-13
- 主分类号： C08J5/24
- IPC分类号： C08J5/24 ; H05K1/03 ; H05K3/46
摘要：
PROBLEM TO BE SOLVED: To solve the problem that it is difficult to use a prepreg using a conventional crystalline resin for making e.g., a circuit board required to have specified strength because of hardness and brittleness inherent in the crystalline resin used to enhance the thermal conductivity of a circuit board.
SOLUTION: A crystalline epoxy resin 20 is mixed with a phenyl group 31 (or mesogen)-containing thermoplastic resin such as an amorphous, high-Tg (Tg is a glass transition temperature), and high-strength PPE resin 21, whereupon the phenyl groups 31 of the respective resins are oriented to effect crystallization. After the addition of an inorganic filler 23 to the mixture, the resultant mixture is used to form a prepreg 26. Such prepregs can give a printed wiring board having an improved proof stress (or cracking resistance) and an improved Tg as well as high thermal conductivity.
COPYRIGHT: (C)2008,JPO&INPIT
摘要（中）：
SOLUTION: A crystalline epoxy resin 20 is mixed with a phenyl group 31 (or mesogen)-containing thermoplastic resin such as an amorphous, high-Tg (Tg is a glass transition temperature), and high-strength PPE resin 21, whereupon the phenyl groups 31 of the respective resins are oriented to effect crystallization. After the addition of an inorganic filler 23 to the mixture, the resultant mixture is used to form a prepreg 26. Such prepregs can give a printed wiring board having an improved proof stress (or cracking resistance) and an improved Tg as well as high thermal conductivity.
COPYRIGHT: (C)2008,JPO&INPIT
要解决的问题：为了解决难以使用常规结晶树脂的预浸料的问题，例如，由于用于提高的结晶树脂中固有的硬度和脆性而需要具有特定强度的电路板 电路板的导热性。 解决方案：将结晶环氧树脂20与无定形，高Tg（Tg为玻璃化转变温度）的苯基31（或含介晶）的热塑性树脂和高强度PPE树脂21混合， 于是，各树脂的苯基31取向成使结晶化。 在将无机填料23加入到混合物中之后，所得混合物用于形成预浸料坯26.这样的预浸料可以得到具有改善的耐应力（或抗裂性）和改进的Tg以及高热的印刷线路板 电导率。 版权所有（C）2008，JPO＆INPIT