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1. 发明专利

JP2008117828A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2008117828A
公开(公告)日：2008-05-22
申请号：JP2006297385
申请日：2006-11-01
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MATSUDA YOSHIKO , SAKURAI DAISUKE
IPC分类号： H01L21/60
CPC分类号： H01L2224/11554 , H01L2224/16 , H01L2224/81193 , H01L2224/81385 , H01L2924/01019 , H01L2924/01046 , H01L2924/09701
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device to realize stable connection with a lower applied pressure and also realize connection with a narrow pitch in the connecting structure between a circuit board and a semiconductor element.
SOLUTION: The semiconductor device includes a semiconductor element 1 provided with a flexible protruded electrode 2 and a circuit board 5 provided with a concave electrode 3 opposed to the protruded electrode 2 at least in one surface. The semiconductor device can realize connection of narrower pitch in a structure that the protruded electrode 2 is hardened after the protruded electrode 2 is engaged with the concave electrode 3 and then connected to the concave electrode 3.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体器件，以在较低的施加压力下实现稳定的连接，并且还实现电路板和半导体元件之间的连接结构中的窄间距的连接。解决方案：半导体器件包括设置有柔性突出电极2的半导体元件1和至少在一个表面上设置有与突出电极2相对的凹电极3的电路板5。在突出电极2与凹电极3接合之后，半导体器件可以实现突出电极2硬化的结构中较窄的间距连接，然后连接到凹电极3.版权所有（C）2008， JPO＆INPIT

2. 发明专利

JP2007250618A Electronic component packaging structure and manufacturing method thereof 有权
标题翻译：电子元件包装结构及其制造方法
公开(公告)号：JP2007250618A
公开(公告)日：2007-09-27
申请号：JP2006068801
申请日：2006-03-14
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAGI TAKAHIKO , SAKURAI DAISUKE
IPC分类号： H05K1/18 , H01L21/60 , H05K3/32
CPC分类号： H01L2224/0401 , H01L2224/06102 , H01L2224/11 , H01L2224/11554 , H01L2224/13099 , H01L2224/1403 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an electronic component packaging structure that prevents packaging fail from occurring easily, can reduce press in packaging, and has improved connection reliability even in a semiconductor device having a narrow pitch and a multiple-pin electrode terminal. SOLUTION: The electronic component packaging structure comprises: an electronic component 2 having a plurality of electrode terminals 3, a packaging substrate 5 in which a connection terminal 6 is provided at a position corresponding to the electrode terminals 3, and a salient electrode 7 for connecting the electrode terminal 3 to the connection terminal 6. The electrode terminal 3 of the electronic component 2 is connected to the connection terminal 6 of the packaging substrate 5 by the salient electrode 7, and the salient electrode 7 is made of a conductive resin containing a photosensitive resin exposed to visible light and a conductive filler. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种防止封装不易发生的电子部件封装结构，可以减少封装中的冲压，并且即使在具有窄间距的半导体器件和多引脚电极端子中也能够提高连接可靠性。电子部件封装结构包括：具有多个电极端子3的电子部件2，在与电极端子3对应的位置处设置有连接端子6的封装基板5，以及突出电极用于将电极端子3连接到连接端子6.电子部件2的电极端子3通过突出电极7连接到包装基板5的连接端子6，并且突出电极7由导电含有暴露于可见光的感光树脂的树脂和导电填料。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007134473A Flexible wiring board and its manufacturing method 审中-公开
标题翻译：柔性接线板及其制造方法
公开(公告)号：JP2007134473A
公开(公告)日：2007-05-31
申请号：JP2005325673
申请日：2005-11-10
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SAKATANI SHIGEAKI , UCHIDA OSAMU , KINOSHITA TOSHIO , SAKURAI DAISUKE
IPC分类号： H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a flexible wiring board which has a conductive pattern made of a conductive resin which improves a workability upon assembling and a reliability of a flexure, and also to provide its manufacturing method. SOLUTION: The flexible wiring board 1 comprises: an insulating substrate 10 which has flexibility and is formed with a conductive pattern 20 made of a conductive resin on at least one face; a protection layer 30 which exposes the conductive pattern 20 at least at one end of the insulating substrate 10 to form a terminal 40, and coats parts except the terminal 40; and a shape retaining member 50 provided at least on one face of a surface of the protection layer 30, and the other face of the insulating substrate 10. The flexible wiring board 1 is constituted by retaining a predetermined shape by a shape retaining member 50. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种柔性布线板，其具有由导电树脂制成的导电图案，其提高了组装时的可加工性和柔性的可靠性，并且还提供了其制造方法。解决方案：柔性布线板1包括：绝缘基板10，其具有柔性并且在至少一个面上形成有由导电树脂制成的导电图案20; 保护层30，其至少在绝缘基板10的一端露出导电图案20以形成端子40，并且涂覆除了端子40之外的部件; 以及设置在保护层30的表面的至少一个面上的形状保持部件50以及绝缘基板10的另一面。柔性布线基板1通过形状保持部件50保持规定的形状而构成。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2007042830A Multilayer wiring board and its manufacturing method 有权
标题翻译：多层接线板及其制造方法
公开(公告)号：JP2007042830A
公开(公告)日：2007-02-15
申请号：JP2005224866
申请日：2005-08-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SAKURAI DAISUKE , UCHIDA OSAMU , IWAMOTO USEI , OCHI SHOZO , TSUKAHARA NORITO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board and its manufacturing method capable of making a wiring board multilayer via fine through-holes, while excelling in adhesiveness to a substrate.
SOLUTION: The multilayer wiring board comprises an insulating board 1 having a first wiring pattern 2 in at least one surface, an interlayer dielectric 4 which contains a distributed conductive filler 3 having a through-hole 5 connected to the first wiring pattern 2, and a second wiring pattern 6 connected to the through-hole 5 on the surface of the interlayer dielectric 4. Further, it is constituted so that an interface of the first wiring pattern 2 and the through-hole 5 may be connected by the conductive filler 3.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过精细通孔使布线板多层化的多层布线板及其制造方法，同时对基板的粘合性优异。解决方案：多层布线板包括在至少一个表面中具有第一布线图案2的绝缘板1，层间电介质4，其包含具有连接到第一布线图案2的通孔5的分布导电填料3 以及与层间电介质4的表面上的通孔5连接的第二布线图案6.此外，其构造使得第一布线图案2和通孔5的界面可以通过导电填充物3.版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006140082A Conductive paste, wiring board using it, its manufacturing method, and electronic equipment using them 有权
标题翻译：导电膏，使用它的接线板，其制造方法和使用它们的电子设备
公开(公告)号：JP2006140082A
公开(公告)日：2006-06-01
申请号：JP2004330210
申请日：2004-11-15
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： UCHIDA OSAMU , TSUKAHARA NORITO , SUZUKI NAOKI , SAKURAI DAISUKE , HIRAYAMA KUMIKO
IPC分类号： H01B1/22 , H05K1/09 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a conductive paste superior in conductivity, a wiring board using it, its manufacturing method, and an electronic equipment using them.
SOLUTION: When a wiring pattern 120 is formed on an insulating substrate 110 using a conductive paste having a conductive filler 130 and a binder 140 containing a thermoset resin, a biodegradable material, and microorganism, the biodegradable material in the binder 140 is made to be degraded by microorganisms, and the denseness between the conductive fillers 130 is made to be improved, thereby a wiring board 100 having a wiring pattern 120 superior in conductivity can be realized.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供导电性优异的导电性糊剂，使用它的布线板，其制造方法和使用它们的电子设备。解决方案：当使用具有导电填料130的导电膏和含有热固树脂，生物可降解材料和微生物的粘合剂140在绝缘基板110上形成布线图案120时，粘合剂140中的可生物降解材料为使其被微生物降解，并且使导电填料130的密度提高，从而可以实现导电性优良的布线图案120的布线基板100。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005303031A Electronic circuit module, multilayer electronic circuit module and their manufacturing methods 有权
标题翻译：电子电路模块，多层电子电路模块及其制造方法
公开(公告)号：JP2005303031A
公开(公告)日：2005-10-27
申请号：JP2004117618
申请日：2004-04-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： GOTO IKUHISA , TSUKAHARA NORITO , SAKURAI DAISUKE , ONO MASAHIRO , NISHIKAWA KAZUHIRO
IPC分类号： H01L25/18 , H01L21/56 , H01L25/065 , H01L25/07
CPC分类号： H01L2224/24 , H01L2224/2518 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To reduce damages received by an electronic component by a pressing force to be applied, when pressing and embedding the electronic component into a resin sheet, even if the electronic component mounted in the resin sheet is thinned.
SOLUTION: A bonding electronic part 23, in which the other surfaces of electronic parts 26, 27 having electrode terminals 24, 25 on at least one surfaces are stuck and aligned, is embedded in the resin sheet 22, to expose the electrode terminals 24, 25. In this way, the electronic components 26, 27 are stuck to improve a packaging density, and rigidity is improved. Accordingly, damages to the bonding electronic part 23 can be reduced by the pressing force to be applied, when the bonding electronic component 23 is embedded.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使将电子部件压入并嵌入到树脂片中时，即使将安装在树脂片中的电子部件变薄，也可以通过施加按压力来减少电子部件的损伤。解决方案：粘合电子部件23，其中在至少一个表面上具有电极端子24,25的电子部件26,27的其它表面被粘合并排列在其中，以将该电极露出端子24,25。以这种方式，电子部件26,27被粘合以提高包装密度，并且提高刚性。因此，当接合电子部件23嵌入时，可以通过施加的按压力来减小接合电子部件23的损坏。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005223183A Electronic component mounted board and method for manufacturing the same 有权
标题翻译：电子元件安装板及其制造方法
公开(公告)号：JP2005223183A
公开(公告)日：2005-08-18
申请号：JP2004030346
申请日：2004-02-06
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SAKURAI DAISUKE , TSUKAHARA NORITO , NISHIKAWA KAZUHIRO , ONO MASAHIRO , GOTO IKUHISA
IPC分类号： H05K3/32 , H05K1/18 , H05K3/46
CPC分类号： H01L24/96 , H01L21/568 , H01L23/3135 , H01L24/82 , H01L2224/04105 , H01L2224/16 , H01L2224/16227 , H01L2224/18 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/18162 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a small and thin electronic component mounted board wherein, when a plurality of electronic components are mounted to be buried in a resin layer at high density, the components can be mounted while connection positions with a conductor circuit pattern are not deviated, and to provide a method for manufacturing the board. SOLUTION: In the method, a plurality of electronic components 100 are pressed into a thin first resin substrate 110 smaller than the height of the component 100 to be thereby arranged at predetermined positions without being deviated therefrom. Thereafter, the electronic components 100 are buried with a second resin substrate 120, or the components 100 are fitted in recesses formed in a support jig and buried into the resin substrate. Consequently, the plurality of electronic components 100 are mounted at high density in the form of a small-size and a thin dimension without deviations in their connection positions with a predetermined conductor circuit pattern 104. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种小型和薄型的电子元件安装板，其中当多个电子部件以高密度安装在埋设在树脂层中时，可以在与导体的连接位置安装部件电路图案不偏离，并且提供用于制造板的方法。解决方案：在该方法中，将多个电子部件100压入小于部件100的高度的薄的第一树脂基板110中，从而被布置在预定位置而不会偏离其。此后，电子部件100被埋设有第二树脂基板120，或者部件100嵌合在形成于支撑夹具中的凹部中，并埋入树脂基板中。因此，多个电子部件100以小尺寸和薄尺寸的形式安装在高度上，而与预定的导体电路图案104的连接位置没有偏差。（C）2005，JPO＆NCIPI

8. 发明专利

JP2005101436A Wiring board and manufacturing method thereof 有权
标题翻译：接线板及其制造方法
公开(公告)号：JP2005101436A
公开(公告)日：2005-04-14
申请号：JP2003335268
申请日：2003-09-26
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TSUKAHARA NORITO , NISHIKAWA KAZUHIRO , SAKURAI DAISUKE
IPC分类号： H05K1/09 , H01B5/14 , H05K3/12 , H05K3/24
CPC分类号： H05K3/247 , H01L2924/0002 , H05K1/095 , H05K2201/0266 , H05K2201/035 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a wiring board for realizing a low resistance of wiring resistance without imposing a high load on the environment and to provide a manufacturing method thereof. SOLUTION: A first conductor layer 16 containing first conductive particles 16A and a binding member 16B and a second conductor layer 18 containing second conductive particles 18A are vertically layered. The average particle diameter of the second conductive particles 18A is selected smaller than the average particle diameter of the first conductive particles 16A. Since no electric plating is employed, the resistance of the required wiring part can be decreased without imposing a large load on the environment. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于实现低电阻的布线电阻而不对环境施加高负载并且提供其制造方法的布线板。解决方案：包含第一导电颗粒16A和结合构件16B的第一导体层16和包含第二导电颗粒18A的第二导体层18垂直层叠。选择第二导电粒子18A的平均粒径小于第一导电粒子16A的平均粒径。由于不使用电镀，因此可以降低所需布线部的电阻，而不会对环境施加大的负荷。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2005026577A Mounting method of electronic component 审中-公开
标题翻译：电子元件的安装方法
公开(公告)号：JP2005026577A
公开(公告)日：2005-01-27
申请号：JP2003192266
申请日：2003-07-04
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SAWADA TATSUHIRO , YOSHINO MICHIO , SAKURAI DAISUKE , HIRAMOTO MASAYOSHI , AONO MOTOHIKO
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a mounting method of a highly reliable electronic component which can shorten a mounting time while maintaining a mounting position of the electronic component highly precisely and well restrain the generation of a void.
SOLUTION: (S2) A reactive setting resin is disposed in a region corresponding to a prescribed conductive land on a printed wiring substrate. (S3) The printed wiring substrate and the reactive setting resin are preheated. (S4) The reactive setting resin is reacted and set for connecting and fixing the electronic component while mounting the electronic component by pressure on a prescribed position on the printed wiring substrate wherein the reactive setting resin is disposed while keeping a temperature of pre-heating.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种高可靠性电子部件的安装方法，其能够在保持电子部件的安装位置的同时高精度地缩短安装时间并且良好地抑制空隙的产生。解决方案：（S2）反应性固化树脂设置在与印刷布线基板上的规定导电焊盘相对应的区域中。（S3）对印刷布线基板和反应性固化树脂进行预热。（S4）在保持预热温度的同时将电子部件通过压力安装在印刷布线基板上的规定位置上并配置反应性固化树脂的同时，使反应性固化树脂反应并固化。版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2002368044A Method for assembling electronic component with solder ball and electronic component 有权
标题翻译：用于组装电子元件与焊枪和电子元件的方法
公开(公告)号：JP2002368044A
公开(公告)日：2002-12-20
申请号：JP2001178071
申请日：2001-06-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SAKURAI DAISUKE , AZUMA KAZUJI , OTANI HIROYUKI
IPC分类号： B23K1/00 , B23K3/06 , B23K31/02 , B23K101/42 , H01L21/60 , H05K3/34
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To form solder balls of uniform height in a ball forming process without increasing steps. SOLUTION: Height of solder balls is made uniform by mounting solder balls 1 on the electrodes (2a, 2b) of an electronic component and reducing or eliminating oxidation of solder balls at the time of thermally fusing the solder balls for bonding.
摘要翻译：要解决的问题：在不增加步骤的情况下，在球形成过程中形成均匀高度的焊球。解决方案：通过将焊球1安装在电子部件的电极（2a，2b）上，并且在热熔接焊球用于接合时减少或消除焊球的氧化，使焊球的高度均匀。

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