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1. 发明专利

JP2005019504A Method and device for sealing electronic component with resin 有权
标题翻译：用树脂密封电子元件的方法和装置
公开(公告)号：JP2005019504A
公开(公告)日：2005-01-20
申请号：JP2003179113
申请日：2003-06-24
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKUMOTO NARIYUKI , MURAKAMI KAZUHIRO , TSUMURA TETSUYA
IPC分类号： H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for sealing an electronic component with a resin by which the connection reliability between active and passive components and a circuit board and the mounted density and strengths of the components can be improved, by surely and accurately infiltrating and packing a sealing resin having a high viscosity and low fluidity into and in the spaces between the components and circuit board.
SOLUTION: After a circuit board 1 with the sealing resin 4 mounted thereon, active components 2, and passive components 3 is inserted into a vacuum-pressing chamber 14, the atmosphere in the chamber 14 is changed from the atmospheric pressure to a vacuum pressure by operating a vacuum pump 7, a compressor 17, and a leak valve 19. Then the peripheries of the electronic components 2 and 3 and the sealing resin 4 are deaerated and the resin 4 is injected into and packed in the spaces between the components 2 and 3 and circuit boards 1. After the sealing resin 4 is left as it is in the vacuum pressure atmosphere for a prescribed period of time, the resin 4 is infiltrated into and packed in the spaces by utilizing a pressure difference in a pressurized atmosphere formed in the vacuum-pressing chamber 14 by supplying air into the chamber 14.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：为了提供一种用树脂密封电子部件的方法和装置，通过该方法和装置可以提高主动和被动部件与电路板之间的连接可靠性以及组件的安装密度和强度，通过将组件和电路板之间的空间中的高粘度和低流动性的密封树脂可靠地和准确地渗透和包装。解决方案：在其上安装有密封树脂4的电路板1之后，将有源部件2和无源部件3插入真空按压室14中，将室14中的气氛从大气压变为通过操作真空泵7，压缩机17和泄漏阀19来实现真空压力。然后将电子部件2和3的周边和密封树脂4脱气，并将树脂4注入并包装在部件2和3以及电路板1.密封树脂4在真空压力气氛中保持规定的时间后，通过利用加压的压力差将树脂4渗透并包装在空间中通过向室14内供给空气而在真空按压室14内形成气氛。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2004087779A Through hole forming method 审中-公开
标题翻译：通孔形成方法
公开(公告)号：JP2004087779A
公开(公告)日：2004-03-18
申请号：JP2002246535
申请日：2002-08-27
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TSUMURA TETSUYA , MIYAOKA TSUNEAKI , HIRAI KYUZO , OKUMOTO NARIYUKI
IPC分类号： B26D7/18 , B26F1/00 , B26F1/14 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a stable method for forming a through hole in such semi-cured conditions as only a pre-gelling agent is cured, related to a substrate using a composite material comprising a kneaded material of inorganic filler, a thermo-setting resin, and pre-gelling agent. SOLUTION: A punch 3 which forms a through hole on a substrate 1 is pulled back up to the upper surface level of the substrate 1 after penetrating the substrate 1, and then the punch 3 is pushed out again. Thus, a chip is removed from the punch 3 when the punch 3 is pulled back. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种稳定的形成通孔的方法，该方法在仅使胶凝剂固化的半固化条件下与使用包含无机填料的捏合材料的复合材料的基材相关，热固性树脂和预胶化剂。解决方案：在基板1上形成通孔的冲头3在穿透基板1之后被拉回到基板1的上表面水平面，然后再次将冲头3推出。因此，当冲头3被拉回时，将芯片从冲头3移除。版权所有（C）2004，JPO

3. 发明专利

JP2006004986A Resin sealing method of electronic component and apparatus thereof 审中-公开
标题翻译：电子元件的树脂密封方法及其设备
公开(公告)号：JP2006004986A
公开(公告)日：2006-01-05
申请号：JP2004176820
申请日：2004-06-15
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKUMOTO NARIYUKI , MURAKAMI KAZUHIRO , TSUMURA TETSUYA
IPC分类号： H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a resin sealing method of electronic component which can improve connection reliability and close contact strength by accurately and tightly diffusing and supplying a low fluid sealing resin having higher viscosity into a gap between active-component/passive-component and a circuit board, and also to provide an apparatus for resin sealing.
SOLUTION: The sealing resin 4 and the circuit board 1 mounting active component 2 and passive component 3 are inserted into a vacuum evacuation chamber 14. The internal side of the vacuum evacuation chamber 14 is set to the atmosphere under the evacuated state from the atmospheric condition with manipulation of a vacuum pump 7, a compressor 17, and a leak valve 19. Periphery of electronic component and internal side of the sealing resin 4 are evacuated, the sealing resin 4 is injected thereto, and these are left under the evacuated atmosphere for the predetermined period. Thereafter, the sealing resin 4 is diffused and supplied in accordance with pressure difference under the pressure applying atmosphere in which the air is supplied into the internal side of the vacuum evacuation chamber 14.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电子部件的树脂密封方法，其可以通过精确且紧密地扩散和提供具有较高粘度的低流体密封树脂到有源部件/被动部件之间的间隙来提高连接可靠性和紧密的接触强度 - 组件和电路板，并且还提供用于树脂密封的装置。解决方案：将密封树脂4和安装有源部件2和无源部件3的电路板1插入真空排气室14.真空排气室14的内侧被设置在真空状态下的大气中通过真空泵7，压缩机17和泄漏阀19的操作的大气条件。密封树脂4的电子部件和内侧的周边被抽真空，将密封树脂4注入其中，并将其留在抽空气氛预定的时间。此后，密封树脂4根据在供给空气的加压气氛下的压力差在真空排气室14的内侧进行扩散和供给。（C）2006，JPO＆NCIPI

4. 发明专利

JP2007253312A Device and method for inserting component into palette 审中-公开
标题翻译：将组件插入PALETTE的设备和方法
公开(公告)号：JP2007253312A
公开(公告)日：2007-10-04
申请号：JP2006084581
申请日：2006-03-27
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKUMOTO NARIYUKI , FUJII TAKEYUKI , FURUISHI MAKOTO
IPC分类号： B23P19/02
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing device having a mechanism wherein a permissible range for the misalignment amount of insertion groove of a cutting punch and a palette insertion groove is wide, and wherein the durability of the cutting punch and the pallet is high, and capable of precisely inserting a component into the palette; and a method thereof.
SOLUTION: The device and method of inserting a component into palette, is equipped with the cutting punch 1 and the palette 6. By using vacuum holes 12, 13 respectively machined on the cutting punch and the palette 6, the component 2 is sucked to deliver. The component 2 is corrected in position so as to be inserted in a groove of the palette 6 by vacuum suction from the vacuum hole 13 of the palette, thereby arranging the component at the same precision as machining precision of a palette groove.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有机构的制造装置，其中切割冲头和调色板插入槽的插入槽的不对准量的允许范围宽，并且其中切割冲头和托盘的耐久性高，能够精确地将组件插入调色板; 及其方法。
解决方案：将组件插入调色板的装置和方法配备有切割冲头1和调色板6.通过使用分别在切割冲头和调色板6上加工的真空孔12,13，部件2是吸吮交付通过从调色板的真空孔13进行真空抽吸将部件2修正为位于调色板6的槽中，从而以与调色板凹槽的加工精度相同的精度布置该部件。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007283430A Assembly device of switch 审中-公开
标题翻译：装配装置
公开(公告)号：JP2007283430A
公开(公告)日：2007-11-01
申请号：JP2006113155
申请日：2006-04-17
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKUMOTO NARIYUKI , TAKADA NORIAKI
IPC分类号： B23P19/00 , H01H11/00
摘要： PROBLEM TO BE SOLVED: To provide a device for assembling a switch with a high speed operation at a low defective fraction by suppressing scattering of a case part or metal contact, or the occurrence of assembly failure such as a displacement or the like. SOLUTION: The assembly device of the switch is composed of a turntable 2 for intermittently performing a rotational operation by a predetermined angle, a pallet 1 which is installed on the turntable 2 and has a vacuum suction hole 10 and an embedded magnet 9 on the bottom surface, a unit for supplying the case part 8 to the pallet 1, a unit for supplying a metal contact 21 of a magnetic body and fitting to a desired mounting position of the case part 8, and a unit for assembling a cover on the upper surface of the case part 8 in which the metal contact 21 is fitted. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过抑制壳体部件或金属接触件的散射或发生诸如位移等的组装故障来组装具有低缺陷部分的高速操作的开关的装置。解决方案：开关的组装装置由用于间歇地进行预定角度的旋转操作的转台2，安装在转台2上的托盘1和具有真空吸入孔10和嵌入式磁体9的组件在底面上设置用于将壳体部分8供给到托盘1的单元，用于供应磁体的金属接触件21并与壳体部分8的期望安装位置配合的单元，以及用于组装盖在其中安装有金属接触件21的壳体部分8的上表面上。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2006165086A Method and device for resin sealing of electronic component module 有权
标题翻译：电子元件模块树脂密封的方法和装置
公开(公告)号：JP2006165086A
公开(公告)日：2006-06-22
申请号：JP2004350909
申请日：2004-12-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKUMOTO NARIYUKI
IPC分类号： H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for resin sealing electronic component module, by which an electronic component module can be sealed with a resin through a simple resin-sealing process, the resin-sealed surface can be planarized, and the variation in the thickness after the resin is cured can be suppressed, even when the resin-sealed thickness is large.
SOLUTION: After a sealing resin 4 is injected into the opening 24 of a stencil-printing plate 12 having a groove by driving a squeegee 13, the resin 4 is packed in the opening 24 with a differential pressure, by actuating a vacuum pump 7 and compressor 17. Then the surface layer of the resin 4 is smoothed to adjust the sealing resin size to a prescribed value, by dipping the projection of the lower front end of a finishing squeegee 21 in the sealing resin 4 to a depth which is ≤30% of the thickness of the stencil-printing plate 12, other than the groove and moving the squeegee 21 along the groove.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决问题：为了提供一种用于树脂密封电子部件模块的方法和装置，通过其可以通过简单的树脂密封工艺用树脂密封电子部件模块，树脂密封表面可以被平坦化并且即使树脂密封厚度大，也可以抑制树脂固化后的厚度变化。解决方案：通过驱动刮板13将密封树脂4注入具有凹槽的模板印版12的开口24中后，通过致动真空将树脂4以不同的压力包装在开口24中泵7和压缩机17.然后，通过将精整刮板21的下前端的突出部浸渍在密封树脂4中，使树脂4的表面层平滑以将密封树脂尺寸调节到规定值，是除了凹槽之外的模版印刷版12的厚度的≤30％，并且沿着凹槽移动刮板21。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005193348A Method for forming through-hole 审中-公开
标题翻译：形成通孔的方法
公开(公告)号：JP2005193348A
公开(公告)日：2005-07-21
申请号：JP2004003859
申请日：2004-01-09
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： HIRAI KYUZO , TSUMURA TETSUYA , OKUMOTO NARIYUKI
IPC分类号： B26F1/02 , B28B11/12 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To prevent the occurrence of hit mark flaws on the upper face of a substrate due to the occurrence of a lump of resin fine powder of the substrate as a result of accumulation of the resin fine powder on a stripper face by being stuck to a punch and lifted when a through-hole is formed to the substrate in a semi-cured state with the punch.
SOLUTION: The substrate, which is composed of a kneaded material of an inorganic filler, a thermosetting resin, and a pre-gelling agent, is heated to a curing temperature of the pre-gelling agent and made into a semi-cured state. When the through-hole is formed on the substrate in a semi-cured state with the punch, air is jetted out from a groove hole 6 provided between the stripper 7 and the punch 3, and the resin fine powder stuck to the punch 3 is knocked off.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了防止由于树脂细粉在剥离器上的积聚而导致基板的树脂细粉的发生而导致基板的上表面上的撞击痕迹的发生当通过冲头在半固化状态下向基板形成通孔时，通过卡住冲头并提升表面。解决方案：将由无机填料的捏合材料，热固性树脂和预胶凝剂组成的基材加热至预胶凝剂的固化温度并制成半固化州。当通过冲头在半固化状态下在基板上形成通孔时，从设置在剥离器7和冲头3之间的槽孔6喷出空气，粘贴在冲头3上的树脂细粉末为撞倒了版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2005019503A Device and method for sealing circuit board 有权
标题翻译：密封电路板的装置和方法
公开(公告)号：JP2005019503A
公开(公告)日：2005-01-20
申请号：JP2003179112
申请日：2003-06-24
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MURAKAMI KAZUHIRO , OKUMOTO NARIYUKI , TSUMURA TETSUYA
IPC分类号： H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a device and a method for sealing circuit board by which the reliability and mountability of a circuit board with an electronic component mounted thereon can be improved by securing flatness by surely sealing the electronic component by uniformly packing sealing paste.
SOLUTION: The device has a reference form plate 8 attached to supporting bodies 27 and having an opening, a vertically movable substrate supporting base 9 disposed below the plate 8, and a substrate holding plate 7 which is mounted on the base 9 and pinches the circuit board 1 mounted with the electronic component in its recessed section 25 together with a printing stencil 5 disposed on the top surface of the plate 7 by holding the circuit board 1. The device also comprises a squeegee 6 disposed above the reference form plate 8 and packs the sealing paste 4 into the surface of the circuit board 1 by sliding along the top surface of the plate 8 and a vacuum chamber 14 which evacuates at least the portions of the surface of the circuit board 1 in which the sealing paste 4 is packed.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于密封电路板的装置和方法，通过该装置和方法，通过均匀包装可靠地密封电子部件来确保平坦度，可以提高其上安装有电子部件的电路板的可靠性和安装性密封膏解决方案：该装置具有附接到支撑体27并具有开口的参考模板8，设置在板8下方的可垂直移动的基板支撑底座9和安装在基座9上的基板保持板7，以及通过保持电路板1，将安装有电子部件的电路板1与设置在板7的顶表面上的印刷模版5一起夹在其凹部25中。该装置还包括设置在参考表格板上方的刮板6 8，并且通过沿着板8的顶面滑动而将密封膏4包装到电路板1的表面中，以及真空室14，其至少抽吸电路板1的表面的部分，其中密封膏4 被包装版权所有（C）2005，JPO＆NCIPI

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