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1. 发明专利

JP2004001554A Screen printing method and screen printing machine 审中-公开
公开(公告)号：JP2004001554A
公开(公告)日：2004-01-08
申请号：JP2003273460
申请日：2003-07-11
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKAHASHI MASARU , CHIKAHISA NAOICHI , NAGASAWA YOSUKE , NAITO TAKAO , WACHI AKIHIKO , YANAIKE SEISHIROU , NAGAFUKU NOBUYASU , KAKISHIMA NOBUYUKI
IPC分类号： B41F15/42 , B41F15/08 , B41F15/40 , B41M1/12 , G06T1/00 , H05K3/12 , H05K3/34
CPC分类号： B41F15/0818 , H05K3/1233 , H05K3/3484 , H05K2201/09727 , H05K2203/0139 , H05K2203/0264 , H05K2203/0783 , H05K2203/163
摘要： PROBLEM TO BE SOLVED: To provide a screen printing method capable of efficiently applying good quality printing of cream solder to a substrate wherein regions corresponding to the large and fine apertures of a screen metal mask are mixed, and an apparatus therefor. SOLUTION: The substrate is divided into a first region (121), wherein the value of the aperture dimension of the mask along the moving direction of a squeegee is smaller than a predetermined threshold value, and a second region (120), wherein the value of the aperture dimension is more than the threshold value, along the moving direction of the squeegee. The speed of the squeegee in the first region is made slower than that of the squeegee in the second region. COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2003071562A Exhaust gas control method for reflow device and reflow device 审中-公开
标题翻译：用于反流装置和反流装置的排气控制方法
公开(公告)号：JP2003071562A
公开(公告)日：2003-03-11
申请号：JP2001261476
申请日：2001-08-30
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAFUKU NOBUYASU , IIZUKA AKIRA , NONOMURA MASARU , ABE TOSHIHIRO
IPC分类号： B23K1/008 , B23K1/00 , B23K3/04 , B23K31/02 , B23K101/42 , F27B9/30 , F27B9/40 , F27D19/00 , F27D21/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an exhaust gas control method for a reflow device and a reflow device capable of reducing power consumption by not operating a blower when the exhaustion is not needed, and capable of suppressing the increase in power caused by flowing-in of outside air by controlling the exhaust gas from respective suction ducts.
SOLUTION: In the exhaust gas control method for the reflow device for sucking a hot gas in a furnace body leaking from a base plate taking-in port 11 and a base plate taking-out port 13 from suction ducts 31, 32 provided outside the base plate taking-in port 11 and the base plate taking-out port 13 to exhaust to the outside of the device, the operation of an exhaust blower 35 connected to the suction ducts 31, 32 is controlled by the temperature of a furnace body 17, and the suction of the respective suction ducts 31, 32 is controlled by control valves 41, 42 mounted to the suction ducts 31, 32 intervened in between respectively.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种用于回流装置和回流装置的排气控制方法，该回流装置能够在不需要排气时通过不运行鼓风机来降低功耗，并且能够抑制由流入引起的功率的增加通过控制来自相应抽吸管道的废气来实现。解决方案：在用于从设置在基座外部的吸入管道31,32从基板入口11和基板取出口13泄漏的炉体吸入热气体的回流装置的排气控制方法中，板吸入口11和基板取出口13排出到设备的外部，连接到吸入管道31,32的排气鼓风机35的操作由炉体17的温度控制，并且相应的吸入管道31,32的吸力由安装在分别介于其间的吸入管道31,32的控制阀41,42来控制。

3. 发明专利

JP2007173855A Method of mounting electronic component, and device 审中-公开
标题翻译：安装电子元件的方法和装置
公开(公告)号：JP2007173855A
公开(公告)日：2007-07-05
申请号：JP2007017957
申请日：2007-01-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAFUKU NOBUYASU , NISHIKAWA NOBORU , KURIBAYASHI TAKESHI
IPC分类号： H05K13/04 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method for mounting electronic components and a device which allow a self-alignment effect to be effectively utilized, even when the spacing for mounting the electronic components is narrow. SOLUTION: When cream solders 16a, 16b are printed on a circuit board 12 formed with lands 14a, 14b and an electronic component 18 is mounted, the printing positions of the cream solders 16a, 16b of the circuit board 12 are detected with respect to the printing positions of the cream solders 16a, 16b, based on an amount of position shift length ΔL between land positions corresponding to the electronic component 18 to be mounted and the printing positions of the cream solder 16a, 16b to the lands 14a, 14b, the target mounting positions of the respective electronic components 18 are individually set up, respectively, and the electronic components 18 are mounted. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使当安装电子部件的间隔窄时，提供一种用于安装电子部件的方法和允许有效利用自对准效果的装置。
解决方案：当奶油焊料16a，16b印刷在形成有焊盘14a，14b和电子部件18的电路板12上时，电路板12的奶油焊膏16a，16b的打印位置被检测到相对于奶油焊料16a，16b的打印位置，基于与要安装的电子部件18相对应的焊盘位置与焊膏16a，16b到焊盘14a，16b的打印位置之间的位置移动长度ΔL的量，如图14b所示，分别设置各个电子部件18的目标安装位置，安装电子部件18。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2004001555A Screen printing method and screen printing machine 有权
公开(公告)号：JP2004001555A
公开(公告)日：2004-01-08
申请号：JP2003273467
申请日：2003-07-11
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKAHASHI MASARU , CHIKAHISA NAOICHI , NAGASAWA YOSUKE , NAITO TAKAO , WACHI AKIHIKO , YANAIKE SEISHIROU , NAGAFUKU NOBUYASU , KAKISHIMA NOBUYUKI
IPC分类号： B41F15/42 , B41F15/08 , B41F15/40 , B41M1/12 , G06T1/00 , H05K3/12 , H05K3/34
CPC分类号： B41F15/0818 , H05K3/1233 , H05K3/3484 , H05K2201/09727 , H05K2203/0139 , H05K2203/0264 , H05K2203/0783 , H05K2203/163
摘要： PROBLEM TO BE SOLVED: To provide a screen printing method which yields no flaws such as lack of cream solder, defficiency in the solder, blur and the like when a printing standby state is released to resume printing, and a screen printing machine therefor. SOLUTION: When a printing standby time is generated during printing work, it is measured. When printing is resumed by releasing the printing standby state, a squeegee is moved at an adjusted printing speed less than a reference printing speed on the basis of the relation with the printing standby time and the printing time due to the adjusted printing speed after printing is resumed to apply screen printing to a screen mask by cream solder provided during the standby time. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2007110170A Method of mounting electronic components and apparatus thereof, and method of creating electronic component mounting data 有权
标题翻译：电子元件安装方法及其设备及其制造电子元器件安装数据的方法
公开(公告)号：JP2007110170A
公开(公告)日：2007-04-26
申请号：JP2007017959
申请日：2007-01-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAFUKU NOBUYASU , NISHIKAWA NOBORU , KURIBAYASHI TAKESHI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting electronic components capable of effectively utilizing a self-alignment effect, even if a distance between mounting electronic components is small. SOLUTION: In mounting an electronic component using cream solder printing, this method has a determining process for determining the size of the self-alignment effect based on a state of positional deviation between the positions of lands corresponding to an electronic component to be mounted and the printing position of the cream solder corresponding to the lands. In the determining process, it is determined that the self-alignment effect is large when the cream solder is printed on a position deviated from the center of a land, and it is determined that the self-alignment effect is small if the cream solder is printed so as to overflow from the land. When the self-alignment effect is large, the target mounting position of the electronic component is set using the cream solder printing positions as a reference, and if the self-alignment effect is small, the target mounting position is set using the land positions as a reference. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使安装电子部件之间的距离小，提供一种能够有效利用自对准效果的电子部件的安装方法。解决方案：在使用膏状焊料印刷安装电子部件时，该方法具有确定步骤，用于基于与电子部件相对应的焊盘的位置之间的位置偏差的状态来确定自对准效果的大小并且奶油焊料的对应于焊盘的打印位置。在确定过程中，当将奶油焊料印刷在离开焊盘的中心的位置上时，确定自对准效果大，并且如果膏状焊料是如此，则确定自对准效果小打印，以便从土地溢出。当自对准效果大时，使用膏状焊料印刷位置作为基准来设定电子部件的目标安装位置，如果自对准效果小，则使用焊盘位置设定目标安装位置参考。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2007110169A Method of mounting electronic components and apparatus thereof 有权
标题翻译：电子元件安装方法及其设备
公开(公告)号：JP2007110169A
公开(公告)日：2007-04-26
申请号：JP2007017958
申请日：2007-01-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAFUKU NOBUYASU , NISHIKAWA NOBORU , KURIBAYASHI TAKESHI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting electronic components capable of effectively utilizing a self-alignment effect, even if a distance between mounting electronic components is small. SOLUTION: When a cream solder is printed on a circuit board having lands formed thereon to mount electronic components, the printing position of the cream solder on the circuit board is detected, the circuit board is divided into a plurality of blocks in mounting the electronic components using the cream solder printing position as a reference, positional deviation quantity between the positions of lands corresponding to an electronic component to be mounted in each block and the cream solder printing position for the lands is obtained in each block, and a target mounting position of each electronic component is set for each block based on each of obtained positional deviation quantities. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使安装电子部件之间的距离小，提供一种能够有效利用自对准效果的电子部件的安装方法。
解决方案：当在其上形成有焊盘的电路板上印刷膏状焊料以安装电子部件时，检测到焊膏在电路板上的打印位置，电路板被分成多个安装块使用膏状焊料印刷位置的电子部件作为基准，在每个块中获得在每个块中对应于要安装在每个块中的电子部件的焊盘的位置与焊盘的焊膏印刷位置之间的位置偏差量，基于获得的每个位置偏差量，为每个块设置每个电子部件的安装位置。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2007110172A Method of mounting electronic components and apparatus thereof 有权
标题翻译：电子元件安装方法及其设备
公开(公告)号：JP2007110172A
公开(公告)日：2007-04-26
申请号：JP2007017961
申请日：2007-01-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAFUKU NOBUYASU , NISHIKAWA NOBORU , KURIBAYASHI TAKESHI
IPC分类号： H05K13/04 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting electronic components capable of effectively utilizing a self-alignment effect, even if a distance between mounting electronic components is small. SOLUTION: When cream solder is printed on a circuit board having lands formed thereon to mount an electronic component, this method has a printing position detecting process of detecting printing positions of the cream solder of the circuit board, and a mounting process of mounting electronic component while using the printing positions of the cream solder as a reference. When the quantity of positional deviation between the land positions corresponding to the electronic component to be mounted and the printing position of cream solder exceeds a predetermined quantity of deviation, the quantity of deviation of a rotational direction is obtained in addition to the quantity of deviation of a horizontal direction, and the target mounting position of the electronic component and the target rotation angle thereof is obtained from the quantities of deviation of the horizontal and rotational directions. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使安装电子部件之间的距离小，提供一种能够有效利用自对准效果的电子部件的安装方法。
解决方案：当将膏状焊料印刷在具有形成在其上的焊盘的电路板上以安装电子部件时，该方法具有检测电路板的膏状焊料的印刷位置的印刷位置检测处理和安装工艺在使用奶油焊料的打印位置作为参考的同时安装电子部件。当对应于要安装的电子部件的焊盘位置与膏状焊料的打印位置之间的位置偏移量超过预定的偏差量时，除了偏移量之外还获得旋转方向的偏差量水平方向和电子部件的目标安装位置及其目标旋转角度从水平方向和旋转方向的偏差量获得。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2007110171A Method of mounting electronic components and apparatus thereof 审中-公开
标题翻译：电子元件安装方法及其设备
公开(公告)号：JP2007110171A
公开(公告)日：2007-04-26
申请号：JP2007017960
申请日：2007-01-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAGAFUKU NOBUYASU , NISHIKAWA NOBORU , KURIBAYASHI TAKESHI
IPC分类号： H05K13/04 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting electronic components capable of effectively utilizing a self-alignment effect, even if a distance between mounting electronic components is small. SOLUTION: When cream solder is printed on a circuit board having lands formed thereon to mount an electronic component, this method has a printing position detecting process of detecting printing positions of the cream solder of the circuit board, and a mounting process of mounting the electronic component while using the printing positions of the cream solder as a reference. In this method, if the electronic component interferes another electronic component adjacent thereto on the circuit board in mounting the electronic component, the mounting operation of this electronic component is not executed or the target mounting position of the electronic component to be mounted is changed to a position of avoiding interference from the cream solder printing positions to the land positions. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使安装电子部件之间的距离小，提供一种能够有效利用自对准效果的电子部件的安装方法。
解决方案：当将膏状焊料印刷在具有形成在其上的焊盘的电路板上以安装电子部件时，该方法具有检测电路板的膏状焊料的印刷位置的印刷位置检测处理和安装工艺在使用奶油焊料的打印位置作为参考的情况下安装电子部件。在该方法中，如果在安装电子部件时电子部件与电路基板相邻的电子部件干涉，则不执行该电子部件的安装动作，或者将要安装的电子部件的目标安装位置变更为避免从奶油焊锡印刷位置到地面位置的干扰的位置。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2001358453A REFLOW SOLDERING DEVICE AND METHOD 失效
公开(公告)号：JP2001358453A
公开(公告)日：2001-12-26
申请号：JP2000181750
申请日：2000-06-16
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAGAFUKU NOBUYASU , NONOMURA MASARU , IIZUKA AKIRA , KURIBAYASHI TAKESHI
IPC分类号： B23K1/00 , B23K1/008 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To reliably detect the clogging of a filter and an exhaust blower without imposing a burden on a working manager, at the same time, to eliminate the need for stopping a device to check the clogging, to improve productivity in high-quality soldering treatment, and to achieve more complete automation. SOLUTION: A reflow soldering device 21 has an exhaust monitor sensor 35 that outputs a signal corresponding to the flow state of exhaust in an exhaust dust 25, an abnormality notice means 37 that informs abnormality caused by the clogging of a filter 29 and an exhaust blower 27, and a control device 39 in the case of failure that discriminates and detects the abnormality caused by the clogging of the filter 29 and exhaust blower 27 based on the output signal of the exhaust monitoring sensor 35 for controlling the operation of the abnormality notice means 37, upper-side facilities 31, and an operation management computer system 33. Also, the reflow soldering device 21 detects the clogging of the exhaust blower 27, and eliminates the need for working for checking the clogging of the exhaust blower 27 by the working manager.

10. 发明专利

JP2001203495A METHOD AND FACILITY FOR MOUNTING 失效
公开(公告)号：JP2001203495A
公开(公告)日：2001-07-27
申请号：JP2000009578
申请日：2000-01-19
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAGAFUKU NOBUYASU , KOYAMA TOSHIYUKI , KURIBAYASHI TAKESHI , SARASHINA EIGO
IPC分类号： H05K13/02
摘要： PROBLEM TO BE SOLVED: To provide a mounting facility and mounting method, where it is judged in advance whether a means for transferring a substrate interferes with a means for supporting the substrate, to prevent interference between them, related to a mounting facility which comprises a means for transferring a substrate comprising a pair of rails, so provided as to be an interval is adjusted according to the width of the substrate to be transferred and a means for transferring the substrate held by the means for transferring substrate. SOLUTION: A mounting facility comprises a means 1 for transferring a substrate comprising a pair of rails provided adjustable to an interval in matching with the width of a substrate to be transferred, and a means 2 for supporting the substrate held by the means for transferring the substrate. Here, a sensor 11 is provided for detecting in advance a positional relationship between a rail position, after the interval of rails of the means 1 is adjusted and the position of means 2 at supporting of the substrate, when a rail is moved so that the interval of rails of the means 1 is adjusted in order to hold the substrate to be transferred. Furthermore, a facility control device 4 is provided which determines whether the means 1 interferes with the means 2 based on the detecting result of the sensor 11.

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