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1. 发明专利

JP2003332725A Reflow heating method and device 有权
标题翻译： REFLOW加热方法和装置
公开(公告)号：JP2003332725A
公开(公告)日：2003-11-21
申请号：JP2002138256
申请日：2002-05-14
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TANIGUCHI MASAHIRO , NONOMURA MASARU , ABE TOSHIHIRO , MIURA KOJI
IPC分类号： B23K1/00 , B23K1/008 , B23K3/04 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a reflow heating method and device, which are capable of surely blowing a flow of hot air controlled to be kept at a prescribed temperature at a printed circuit board in transit so as to heat it up uniformly with high efficiency.
SOLUTION: When the printed circuit board 3 temporarily mounted with an electronic component 13 through cream solder is heated so as to solder the electronic component 13 to the printed circuit board 3 with the molten cream solder, a hot air blowing nozzle 18 is made to blow a flow of hot air H heated at a prescribed temperature against the printed circuit board 3, which is transferred along a substrate transfer path 14, at a right angle, and a flow of hot air C that drops in temperature as giving its heat to the printed circuit board 3 is recovered as flowing opposite to and parallel with the direction in which the hot air H blows.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种回流加热方法和装置，其能够确保在运输过程中将被控制的热空气流保持在印刷电路板处，以便将其均匀地加热效率高。解决方案：当通过膏状焊膏临时安装电子部件13的印刷电路板3被加热以便用熔融的膏状焊剂将电子部件13焊接到印刷电路板3时，热空气吹制喷嘴18是使得以规定温度加热的热空气流H以直接沿着基板传送路径14传送的印刷电路板3和温度下降的热空气C流动回流到印刷电路板3的热量与热空气H吹过的方向相反并平行。版权所有（C）2004，JPO

2. 发明专利

JP2000351142A INJECTION MOLDING MACHINE AND METHOD FOR INJECTION MOLDING 失效
公开(公告)号：JP2000351142A
公开(公告)日：2000-12-19
申请号：JP16586799
申请日：1999-06-11
申请人： MATSUSHITA ELECTRIC IND CO LTD , SUMITOMO HEAVY INDUSTRIES
发明人： MIZONE SHINYA , IKEDA KIYOSHI , YAMAZAKI HIROKO , SATO HITOSHI , MIURA KOJI
IPC分类号： H04R7/02 , B29C45/56 , B29C45/68 , B29C45/70 , B29C45/80 , B29K105/04 , B29L31/38
摘要： PROBLEM TO BE SOLVED: To achieve light wt. and to improve quality of a molded article by enough thinning the molded article. SOLUTION: A fixed mold 31, a movable mold 32, a first driving means for forwarding and retreating the movable mold 32, a pressing member arranged by passing it through at least one of the fixed mold 31 and the movable mold 32, a second driving means for forwarding and retreating the pressing member, an injection means for filling a resin into a cavity space C and a mold opening means which forwards the pressing member at a specified timing after filling is started and opens the parting face PL of the mold apparatus by a specified opening stroke are provided. As the speed for opening the parting face PL is made high, there exists no possibility of that cells are elongated and insides of the cells become vacuum accompanied with foaming.

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