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1. 发明专利

JP2008227232A Semiconductor device and manufacturing method thereof, and optical pickup module 审中-公开
标题翻译：半导体器件及其制造方法和光学拾取模块
公开(公告)号：JP2008227232A
公开(公告)日：2008-09-25
申请号：JP2007064806
申请日：2007-03-14
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KOYASHIKI JUNYA , MORIBE SHOZO , UDATSU HIROKI , YOSHIKAWA NORIYUKI , FUKUDA TOSHIYUKI , NANO MASANORI , ISHIDA HIROYUKI
IPC分类号： H01L23/12 , G11B7/13 , H01L31/10
CPC分类号： H01L31/0203 , G11B7/123 , G11B7/1275 , G11B7/13 , H01L21/4803 , H01L23/055 , H01L23/24 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L27/14618 , H01L27/14632 , H01L27/14683 , H01L27/14687 , H01L2224/05553 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/10161 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To provide a method of efficiently manufacturing a semiconductor device capable of miniaturizing an entire size and especially capable of reducing the length of a pair of opposing sides in four sides of a nearly rectangular package. SOLUTION: A flat original plate 130 for substrates is prepared, where a connection electrode 75, inner wiring 76, and an external connection section 77 are provided. An area between the adjacent connection electrodes 75 in the original plate 130 for substrates is cut to form a groove 55. A plurality of semiconductor elements 10 are mounted in the groove 55, an electrode pad 20 and the connection electrodes 75 are connected by a metal small-gauge wire 22, and further a transparent lid body 90 is mounted on a spacer 80' so that the upper part of each semiconductor element 10 is covered for adhesion. An area between two rows of connection electrodes 75 between the adjacent grooves 55 is cut for separation. Further, an area between the adjacent semiconductor elements 10 is separated. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种有效地制造半导体器件的方法，该半导体器件能够使整体尺寸小型化，特别是能够减小近似矩形封装的四边中的一对相对侧的长度。
解决方案：制备用于基板的平板原版130，其中设置有连接电极75，内布线76和外部连接部77。切割用于基板的原版130中的相邻连接电极75之间的区域以形成凹槽55.多个半导体元件10安装在凹槽55中，电极焊盘20和连接电极75通过金属小规格导线22，另外，透明盖体90安装在间隔件80'上，使得每个半导体元件10的上部被覆盖用于粘合。在相邻的槽55之间的两行连接电极75之间的区域被切割以进行分离。此外，相邻的半导体元件10之间的区域被分离。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2004335944A Connection method of semiconductor element and semiconductor device 审中-公开
公开(公告)号：JP2004335944A
公开(公告)日：2004-11-25
申请号：JP2003133101
申请日：2003-05-12
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KOYASHIKI JUNYA
IPC分类号： H01L21/52 , H01L33/22 , H01L33/62 , H01L33/00
CPC分类号： H01L24/29 , H01L24/32 , H01L2924/351 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a connection method for preventing peeling of a conductive adhesive due to thermal stress while maintaining satisfactory conductivity in a semiconductor device, wherein a semiconductor element which is subjected to surface roughening is fixed to a substrate or a lead frame by using the conductive adhesive.
SOLUTION: In the connection method of the semiconductor element, the surface of a light emitting element 2 is subjected to surface roughening, the size of an opening part 8 of a recessed part of the surface is made 1 to 5 μm, and the light emitting element 2 is fixed to the substrate or a lead frame (a plate 3 to be connected) by using a conductive adhesive 4 whose average grain diameter of a filler 7 is 0.7 to 1 μm.
COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明专利

JP2008227231A Semiconductor device and manufacturing method thereof, and optical pickup module 有权
标题翻译：半导体器件及其制造方法和光学拾取模块
公开(公告)号：JP2008227231A
公开(公告)日：2008-09-25
申请号：JP2007064795
申请日：2007-03-14
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KOYASHIKI JUNYA , MORIBE SHOZO , UDATSU HIROKI , YOSHIKAWA NORIYUKI , FUKUDA TOSHIYUKI , NANO MASANORI , ISHIDA HIROYUKI
IPC分类号： H01L23/02 , G11B7/13 , G11B7/135 , G11B7/22 , H01L31/10 , H01S5/022
CPC分类号： H01L27/14683 , G11B7/1275 , G11B7/13 , H01L23/055 , H01L23/10 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L2224/92247 , H01L2224/97 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/1461 , H01L2224/85 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of miniaturizing an entire size and especially capable of reducing the length of a pair of opposing sides in four sides of a nearly rectangular package. SOLUTION: In the semiconductor device 1, a semiconductor element 10 is mounted on the nearly rectangular package 50. First ribs 70, 70 are provided at a pair of opposing edges on a mount surface 62 so that the first ribs 70, 70 project, and the edge of a lid body 90 is placed on an upper surface 70b and is fixed by an adhesive 85. A dam 80 is provided at the edge of the first rib upper surface 70b, and the adhesive 85 continues from the side of the lid body 90 to the dam 80. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供能够使整体尺寸小型化并且特别能够减小近似矩形封装的四边中的一对相对侧的长度的半导体器件。解决方案：在半导体器件1中，半导体元件10安装在近似矩形的封装50上。第一肋70,70设置在安装表面62上的一对相对边缘处，使得第一肋70,70 并且盖体90的边缘被放置在上表面70b上并且通过粘合剂85固定。坝80设置在第一肋上表面70b的边缘处，并且粘合剂85从盖体90到达坝80.版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2008227233A Semiconductor device and manufacturing method thereof, and optical pickup module 审中-公开
标题翻译：半导体器件及其制造方法和光学拾取模块
公开(公告)号：JP2008227233A
公开(公告)日：2008-09-25
申请号：JP2007064827
申请日：2007-03-14
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KOYASHIKI JUNYA , MORIBE SHOZO , UDATSU HIROKI , YOSHIKAWA NORIYUKI , FUKUDA TOSHIYUKI , NANO MASANORI , ISHIDA HIROYUKI
IPC分类号： H01L23/12 , G11B7/13 , G11B7/135 , G11B7/22 , H01L31/02 , H01S5/022
CPC分类号： G11B7/1275 , H01L21/4803 , H01L23/055 , H01L23/24 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L27/14618 , H01L27/14687 , H01L2224/05553 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/10161 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/32245 , H01L2224/48247
摘要： PROBLEM TO BE SOLVED: To provide a method of efficiently manufacturing a semiconductor device capable of miniaturizing an entire size and especially capable of reducing the length of a pair of opposing sides in four sides of a nearly rectangular package. SOLUTION: A plurality of rib precursors 80 are installed in parallel on a flat baseplate 61. A plurality of semiconductor elements 10 are mounted in a groove 55 between the adjacent rib precursors 80, and a transparent member 94 is laminated on the semiconductor elements 10. An electrode pad 20 and a connection electrode 75 in the semiconductor elements 10 are bonded by a wire and a sealing resin 96 is filled into the groove 55. Then, the center in the longitudinal direction of the rib precursors 80 is cut by a dicing saw 40, and further an area between the adjacent semiconductor elements 10 is cut, thus completing the semiconductor device 1. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种有效地制造半导体器件的方法，该半导体器件能够使整体尺寸小型化，特别是能够减小近似矩形封装的四边中的一对相对侧的长度。解决方案：多个肋前体80平行安装在平坦的基板61上。多个半导体元件10安装在相邻肋前体80之间的凹槽55中，并且透明构件94层压在半导体半导体元件10中的电极焊盘20和连接电极75通过导线接合，密封树脂96填充到槽55中。然后，肋前体80的纵向方向上的中心被切割锯40，并且进一步切割相邻半导体元件10之间的区域，从而完成半导体器件1.版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2006253281A Manufacturing method of resin package 有权
标题翻译：树脂包装的制造方法
公开(公告)号：JP2006253281A
公开(公告)日：2006-09-21
申请号：JP2005065291
申请日：2005-03-09
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KOYASHIKI JUNYA
IPC分类号： H01L23/08
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of resin package for preventing break of a wiring pattern formed to an aperture of a through-hole by preventing the generation of resin burrs at the aperture of the through-hole on the occasion of forming the resin package provided with a through hole.
SOLUTION: The manufacturing method of resin package is provided with a through-hole conductor for connecting under conductive state a wiring pattern formed in the side of mounting surface to mount a photoelectric converting element, and a wiring pattern formed on the surface opposing to the mounting surface. Further the resin package comprises steps of tightening an upper metal die 6 provided with a first projected region 6a at the position corresponding to the through-hole conductor, and a lower metal die 7 provided with a second projected region 7a including, at the top area thereof, an engaging hole 7a-3 to which the front end of the first projected region 6a is inserted; and molding a package body by inserting with pressure the resin into a cavity 8 formed by the upper metal die 6 and the lower metal die 7.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种树脂封装的制造方法，用于防止在通孔的孔径处产生树脂毛刺，从而防止形成在通孔的孔上的布线图案的断裂形成设置有通孔的树脂封装。解决方案：树脂封装的制造方法设置有用于在导电状态下连接形成在安装表面侧的布线图案以安装光电转换元件的通孔导体，以及形成在表面相对的表面上的布线图案到安装表面。此外，树脂封装包括在与通孔导体相对应的位置处紧固设置有第一突出区域6a的上金属模具6以及设置有第二突出区域7a的下金属模具7的步骤，该第二突出区域7a包括在顶部区域第一突出区域6a的前端插入其中的接合孔7a-3; 以及通过将树脂压力插入由上金属模6和下金属模7形成的空腔8中来成型封装体。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2008226378A Semiconductor device, manufacturing method thereof and optical pickup module 审中-公开
标题翻译：半导体器件及其制造方法和光学拾取模块
公开(公告)号：JP2008226378A
公开(公告)日：2008-09-25
申请号：JP2007064777
申请日：2007-03-14
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KOYASHIKI JUNYA , MORIBE SHOZO , UDATSU HIROKI , YOSHIKAWA NORIYUKI , FUKUDA TOSHIYUKI , NANO MASANORI , ISHIDA HIROYUKI
IPC分类号： G11B7/135 , G11B7/13 , G11B7/22 , H01L31/10
CPC分类号： H01L27/14618 , G11B7/12 , H01L23/055 , H01L23/3185 , H01L24/97 , H01L27/14683 , H01L31/0203 , H01L2224/97 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/1461 , H01L2224/85 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device in which a cover and a transparent member for protecting a semiconductor element can be stably fixed and the entire size thereof can be reduced. SOLUTION: The semiconductor element 10 is mounted on a board part 60 of a package 50 having a rectangular board part 60 and ribs 70, 70 provided on a pair of opposed outer edges of the board part 60, and electrode pads 20 of the semiconductor element 10 are connected to connection electrodes 75 provided on the top faces 70b of the ribs by thin metallic wires 22. Spacers 80, 80 are provided on the top faces 70b of the ribs outside the connection electrodes 75, and a transparent cover 90 covering the entire surface of the package 50 is attached to the top faces of the spacers 80, 80. The height of the spacers 80, 80 is larger than the diameter of the thin metallic wire 22. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种半导体装置，其中可以稳定地固定用于保护半导体元件的盖和透明构件，并且可以减小其整体尺寸。解决方案：将半导体元件10安装在具有矩形板部分60的封装件50的板部分60上，以及设置在板部分60的一对相对的外边缘上的肋70,70，以及设置在板部分60的一对相对的外边缘上的肋70,70 半导体元件10通过细金属线22连接到设置在肋的顶面70b上的连接电极75上。隔板80,80设置在连接电极75外侧的肋的顶面70b上，透明盖90 覆盖包装体50的整个表面的部分被附接到间隔件80,80的顶面。间隔件80,80的高度大于细金属丝22的直径。版权所有（C）2008 ，JPO＆INPIT

7. 发明专利

JP2008028216A Photoelectric conversion device 审中-公开
标题翻译：光电转换器件
公开(公告)号：JP2008028216A
公开(公告)日：2008-02-07
申请号：JP2006200326
申请日：2006-07-24
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KOYASHIKI JUNYA , KAMIMURA SHINICHI
IPC分类号： H01L31/02 , H01L31/10
CPC分类号： H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49175 , H01L2224/8592 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a photoelectric conversion device capable of ensuring a reliability by certainly sticking a light transmission member to a photoelectric conversion element without blocking any light receiving of a light receiver with adhesive. SOLUTION: The photoelectric conversion device is equipped with: a photoelectric conversion element 11 which receives a light from a light source and outputs an electric signal; a cover glass 13 which is formed so as to cover a light-receiving section 11a of the photoelectric conversion element 11, and is bonded to a front surface of the photoelectric conversion element 11 with adhesive 14; and a polyimide layer 15 which is formed on the front surface of the photoelectric conversion element 11, and is formed along peripheries of the cover glass 13 so as to surround the peripheries thereof in order to intercept the adhesive 14 swept outside from an adhesion side of the cover glass 13, when the cover glass 13 is bonded to the front surface of the photoelectric conversion element 11 by applying the adhesive 14 to the adhesion side. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过将光传输构件固定在光电转换元件上而确保可靠性，而不会阻挡光接收器的粘合剂的光接收的光电转换装置。光电转换元件配备有：光电转换元件11，其接收来自光源的光并输出电信号; 盖玻璃13，其形成为覆盖光电转换元件11的受光部11a，并且用粘合剂14接合到光电转换元件11的前表面; 以及形成在光电转换元件11的前表面上的聚酰亚胺层15，并且围绕其周围沿着玻璃罩13的周边形成，以便将从外部剥离的粘合剂14从粘合侧盖玻璃13通过将粘合剂14施加到粘合侧而将盖玻璃13接合到光电转换元件11的前表面时。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2006229108A Photoelectric conversion device and manufacturing method therefor 审中-公开
标题翻译：光电转换装置及其制造方法
公开(公告)号：JP2006229108A
公开(公告)日：2006-08-31
申请号：JP2005043723
申请日：2005-02-21
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KOYASHIKI JUNYA , TSURU SHIZUO
IPC分类号： H01L31/02
CPC分类号： H01L2224/48091 , H01L2224/49175 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a photoelectric conversion device manufacturing method which can control the manufacturing cost by preventing the dirt of a light transparent plate material to protect a photoelectric conversion element, and by allowing the light transparent plate material to be easily prepared.
SOLUTION: The photoelectric conversion device manufacturing method includes a adhering process to adhere a cover glass plate 4 on a light receiving side of a photoelectric element 3 with an adhesive 7; a mold clamping process to locate the photoelectric conversion element 3 and the cover glass plate 4 adhered on the light receiving side of the photoelectric conversion element 3, in a cavity 12 of an upper mold 10 and lower mold 11 to clamp them; and a resin sealing process to resin-seal the clamped upper mold 10 and lower mold 11. The mold clamping process is to clamp the upper mold 10 which has an abutting surface 10a abutted to the upper surface of the cover glass plate 4 and a space 10c. An opening 10b narrower than the circumference of upper surface of the cover glass plate 4 and wider than the light receiving portion of the photoelectric conversion element 3, is located on the abutting surface 10a on the lower mold 11 fitting the space 10c to the light receiving of the photoelectric conversion element 3.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种通过防止光透射板材料的污物来保护光电转换元件并且通过允许轻透明板材料容易地控制制造成本的光电转换装置制造方法准备。光电转换元件的制造方法包括利用粘合剂7将盖玻璃板4粘接在光电元件3的受光面上的粘接工序; 在上模具10和下模具11的空腔12中定位附着在光电转换元件3的光接收侧的光电转换元件3和盖玻璃板4的夹紧工艺，以夹紧它们; 以及对夹持的上模具10和下模具进行树脂密封的树脂密封方法。合模过程是夹紧具有邻接盖玻璃板4的上表面的邻接表面10a的上模具10， 10C。比盖玻璃板4的上表面的圆周窄且比光电转换元件3的光接收部分宽的开口10b位于将空间10c配合到光接收部的下模11上的抵接面10a上光电转换元件3。（C）2006，JPO＆NCIPI

9. 发明专利

JP2002270758A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002270758A
公开(公告)日：2002-09-20
申请号：JP2001072224
申请日：2001-03-14
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KOYASHIKI JUNYA , SAKASHITA SHIGEYUKI
IPC分类号： H01L25/18 , H01L21/52 , H01L25/04 , H01L31/02 , H01L33/62 , H01L33/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device realizing stable wire bonding by preventing the shaking of a lead frame, in the case of wire bonding. SOLUTION: A die bond part 3 of a conductive lead frame for die-bonding a semiconductor chip 1 of an n-type substrate and a semiconductor chip 2 of a p-type substrate is integrated. In the case of die-bonding the semiconductor chips 1 and 2 of the n-type substrate and the p-type substrate on the part 3, either or both of the semiconductor chips 1 and 2 of the n-type substrate and the p-type substrate are die-bonded via an insulation paste.

10. 发明专利

JP2003174135A ELECTRONIC COMPONENT WITH LEADS 审中-公开
公开(公告)号：JP2003174135A
公开(公告)日：2003-06-20
申请号：JP2001373699
申请日：2001-12-07
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KOYASHIKI JUNYA
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide an electronic component with leads which can improve holding force of the leads after a resin package has been hardened and does not easily generate break of wires and peeling of the leads. SOLUTION: The electronic component with leads comprises mounting sections 5, 6 to mount elements 2 to 4, a resin package 7 covering the mounting sections 5, 6, and lead sections 8 to 14 where the base end section thereof is embedded within the resin package 7 and connected to the mounting sections 5, 6 in direct or via a bonding wire 15, while the end section thereof is projected to the external side from the resin package 7. In the electronic component with leads 1, a different shape section 16 including a hole or a cutout portion is provided to the base sections of the lead sections 8 to 14 where the end sections are mechanically processed among the lead sections 8 to 14. Since the different shape section 16 is provided, the holding force of the lead sections 8 to 14 formed of resin can be increased. COPYRIGHT: (C)2003,JPO

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