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    • 1. 发明专利
    • Part mounter
    • PART MOUNTER
    • JP2006303032A
    • 2006-11-02
    • JP2005120114
    • 2005-04-18
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • KAWAZOE MASARUMASAKI SHIGEOFURUTA NOBORU
    • H05K13/04
    • PROBLEM TO BE SOLVED: To provide a part mounter which can efficiently reduce residual vibration generting during stopping of the movement of a part holding means and prevent tact loss. SOLUTION: The part mounter 100 is provided with an allowed value setting part 402 to set the allowed value of residual vibration generating during stopping of the movement of a part holding means 123, a moving time calculator 403 to calculate the movement time of the part holding means 123, a movement time changer 404 to change the movement time of the part holding means 123 in case when the residual vibration value during the movement time exceeds the allowed value, a speed calculator 405 to calculate the movement speed of the part holding means 123 according to the movement time, a database 406 to accumulate data such as the allowed value of the residual vibration, and a mounting head mover 407 to give an operation instruction to the mounting head. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种能够有效地减少在停止部件保持装置的运动期间产生的残余振动并防止嘟嘟声损失的部件安装机。 < P>解决方案:零件安装器100设置有允许值设定部402,以设定在部件保持装置123的移动停止期间产生的残余振动的允许值,移动时间计算器403,以计算移动时间 部件保持装置123,在移动时间内的剩余振动值超过允许值的情况下改变部件保持装置123的移动时间的移动时间改变器404,计算部件的移动速度的速度计算器405 根据移动时间的保持装置123,用于累积诸如剩余振动的允许值的数据的数据库406以及安装头动子407给予安装头的操作指示。 版权所有(C)2007,JPO&INPIT
    • 3. 发明专利
    • Device mounter and substrate positioning method
    • 器件安装和基板定位方法
    • JP2006270050A
    • 2006-10-05
    • JP2006010337
    • 2006-01-18
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • KAWAZOE MASARUTANI NORIYUKIMIMURA YOSHIHIROMASAKI SHIGEO
    • H05K13/04
    • PROBLEM TO BE SOLVED: To provide a device mounter capable of not only mounting devices in the entire lengthly substrate exceeding a mountable area but also flexibly coping with factory layout or NC data creation. SOLUTION: This device mounter has at least two mounting stages for mounting devices on a substrate carried in from the upstream in a substrate transportation direction and then carrying it out to the downstream. It has a first stop means 135 for controlling the downstream edge of the substrate to be positioned at a first predetermined downstream after a first mountable area A where devices can be mounted in the first mount stage of the upstream, and a second stop means 136 for controlling the upstream edge of the substrate to be positioned at a second predetermined upstream location before a second mountable area A where devices can be mounted in the second mount stage of the downstream. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种装置安装机,其不仅可以将整个长度基板上的装置安装在超过可安装区域的位置上,而且可以灵活应对工厂布局或NC数据创建。 解决方案:该装置安装器具有至少两个安装阶段,用于将装置安装在从基板输送方向的上游承载的基板上,然后将其运送到下游。 它具有第一停止装置135,用于控制在第一可安装区域A之后的第一预定下游位置处的基板的下游边缘,其中装置可以安装在上游的第一安装级中,第二停止装置136用于 控制所述基板的上游边缘位于第二可安装区域A的第二预定上游位置处,其中装置可以安装在所述下游的第二安装级中。 版权所有(C)2007,JPO&INPIT
    • 4. 发明专利
    • Substrate acceptability evaluation method and apparatus therefor
    • 基板接受性评估方法及其设备
    • JP2004127993A
    • 2004-04-22
    • JP2002286180
    • 2002-09-30
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • KAWAZOE MASARUKAWASHIMA JUNICHI
    • H05K13/02H05K13/08
    • PROBLEM TO BE SOLVED: To provide a substrate acceptability evaluation method wherein acceptability of a substrate is determined without providing a mark or a region on the substrate exclusively for acceptability evaluation, and wherein the substrate is reduced in size for saving the space. SOLUTION: In this substrate acceptability evaluation method, acceptability of a substrate 1 is determined by sensing the object item on the substrate 1 and by checking it for its shape, presence/absence, or the like. Not a mark on the substrate 1 provided exclusively for evaluation is the object of evaluation, but an IC device 2, an electronic component 3, or the like, is the object of evaluation, which is mounted on the substrate 1 only when the object is acceptable in quality. The substrate 1 is determined to be acceptable when the evaluation object is in place on the substrate 1. COPYRIGHT: (C)2004,JPO
    • 要解决的问题:提供一种基板可接受性评价方法,其中在不对基板进行可靠性评估的情况下仅在基板上设置标记或区域的情况下确定基板的可接受性,并且其中基板尺寸减小以节省空间。 解决方案:在该基板可接受性评估方法中,通过感测基板1上的物体项目并通过检查其形状,存在/不存在等来确定基板1的可接受性。 提供专用于评价的基板1上的标记是评价的对象,但是IC器件2,电子部件3等是评估对象,只有当物体是 质量可以接受 当评估对象在基板1上就位时,确定基板1是可接受的。版权所有(C)2004,JPO