专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2008153707A Part mounting device and method of same 有权
标题翻译：部件安装装置及其方法
公开(公告)号：JP2008153707A
公开(公告)日：2008-07-03
申请号：JP2008066258
申请日：2008-03-14
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKEUMA TORU , MIYAZAKI HIROTO , KAWASHIMA JUNICHI , TANAKA YOICHI , YOSHIDA NORIAKI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To improve controllability of operations control for each component such as a head section and parts supply unit in parts mounting and to reduce a development period to control such parts mounting. SOLUTION: In a parts mounting method having parts supply process and parts hold retrieve process, a recipe for parts hold retrieve process is received in a head section, which is an operation program capable of performing the parts hold retrieve process. Based on the recipe, the parts hold retrieve process are performed. A resultant timing signal is transmitted to the parts supply unit. In the parts supply unit, the recipe for the parts supply process capable of performing the parts supply process is received. Based on the recipe and the timing signal transmitted from the head section, the parts supply process are completed. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提高部件安装中诸如头部和零件供应单元之类的每个部件的操作控制的可控性，并且减少用于控制这些部件安装的开发周期。解决方案：在具有零件供应过程和零件保持检索过程的零件安装方法中，在头部中接收到零件保持检索处理的配方，该头部是能够执行零件保持检索处理的操作程序。根据配方，执行零件保持检索过程。合成的定时信号被发送到零件供应单元。在零件供给单元中，接收能够进行零件供给处理的零件供给处理的配方。根据从头部传送的配方和定时信号，零件供应过程完成。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2004265946A Component mounting equipment and method therefor 有权
公开(公告)号：JP2004265946A
公开(公告)日：2004-09-24
申请号：JP2003045452
申请日：2003-02-24
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TAKEUMA TORU , MIYAZAKI HIROTO , KAWASHIMA JUNICHI , TANAKA YOICHI , YOSHIDA NORIAKI
IPC分类号： H05K13/04 , H05K13/08
CPC分类号： H05K13/08 , Y10T29/53174 , Y10T29/53178
摘要： PROBLEM TO BE SOLVED: To improve controlability of operation control of each constitution such as a head and a component supply in component mounting, and reduce the development period for the control of such a component mounting. SOLUTION: The component mounting method is provided with a component supply process and a component hold and supply process. In a head, recipe for a component hold and supply process is received which is an operation program capable of executing the component hold and supply process, the component hold and supply process is executed based on the recipe, and a timing signal based on the execution is transmitted to the component supply. Therein, a recipe for a component supply process capable of executing the component supply process is received, and the component supply process is made to complete based on the recipe and the timing signal transmitted from the head. COPYRIGHT: (C)2004,JPO&NCIPI

3. 发明专利

JP2004235540A Method and device for detecting acceptance mark 审中-公开
公开(公告)号：JP2004235540A
公开(公告)日：2004-08-19
申请号：JP2003024147
申请日：2003-01-31
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KAWAZOE MASARU , KAWASHIMA JUNICHI
IPC分类号： G06T1/00 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for detecting an acceptance mark capable of detecting the acceptance mark given to an object to be inspected even when the precision of the mark position is wrong. SOLUTION: The method for detecting the acceptance mark comprises the steps of picking up the image of a circuit board 2 as the object to be inspected by a recognizing camera 1, varying a judging area set on the picked up image according to the precision of the mark position and shape of the acceptance mark 5 given to the circuit board 2 by a judging part 3, and detecting the acceptance mark by a change in brightness within the judging area. Detecting changes in brightness by widening a range of sight of the camera 1 to maximum for the acceptance mark having the wrong precision of the position, such as handwritten, can detect the acceptance mark in spite of the precision of the position. COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2004127993A Substrate acceptability evaluation method and apparatus therefor 审中-公开
标题翻译：基板接受性评估方法及其设备
公开(公告)号：JP2004127993A
公开(公告)日：2004-04-22
申请号：JP2002286180
申请日：2002-09-30
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KAWAZOE MASARU , KAWASHIMA JUNICHI
IPC分类号： H05K13/02 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a substrate acceptability evaluation method wherein acceptability of a substrate is determined without providing a mark or a region on the substrate exclusively for acceptability evaluation, and wherein the substrate is reduced in size for saving the space. SOLUTION: In this substrate acceptability evaluation method, acceptability of a substrate 1 is determined by sensing the object item on the substrate 1 and by checking it for its shape, presence/absence, or the like. Not a mark on the substrate 1 provided exclusively for evaluation is the object of evaluation, but an IC device 2, an electronic component 3, or the like, is the object of evaluation, which is mounted on the substrate 1 only when the object is acceptable in quality. The substrate 1 is determined to be acceptable when the evaluation object is in place on the substrate 1. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种基板可接受性评价方法，其中在不对基板进行可靠性评估的情况下仅在基板上设置标记或区域的情况下确定基板的可接受性，并且其中基板尺寸减小以节省空间。解决方案：在该基板可接受性评估方法中，通过感测基板1上的物体项目并通过检查其形状，存在/不存在等来确定基板1的可接受性。提供专用于评价的基板1上的标记是评价的对象，但是IC器件2，电子部件3等是评估对象，只有当物体是质量可以接受当评估对象在基板1上就位时，确定基板1是可接受的。版权所有（C）2004，JPO

5. 发明专利

JPH09275299A ELECTRONIC COMPONENT MOUNTING DEVICE 失效
公开(公告)号：JPH09275299A
公开(公告)日：1997-10-21
申请号：JP8367996
申请日：1996-04-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KAWASHIMA JUNICHI
IPC分类号： B23P21/00 , B25J15/06 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting device, which mounts surface mounting correspondence chip-type electronic components, which are used for multiple types of electronic circuits, on a printed board and can mount simultaneously a plurality of types of the chip-type electronic components in the individually decided directions. SOLUTION: An electronic component mounting device is formed into a constitution, wherein each of first and second mounting head parts 10 and 11, which are respectively provided with a plurality of pieces of suction nozzles 18 for sucking electronic components, is provided with suction nozzle rotating motor 51 and upper and lower suction nozzle motor 54 of the same number as that of the nozzles 18, and the vertical motion of the plurality of the nozzles 18 and the amount of rotation of the nozzles 18 can be individually controlled simultaneously, whereby a plurality of types of the electronic components can be simultaneously mounted on a printed board and the speedup of an electronic component mounting device is contrived.

6. 发明专利

JPH0927699A ELECTRONIC COMPONENT MOUNTING DEVICE 失效
公开(公告)号：JPH0927699A
公开(公告)日：1997-01-28
申请号：JP17469295
申请日：1995-07-11
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KAWASHIMA JUNICHI , SAKATSUGI TOSHIYA , FUJIWARA HIROYUKI , KINOSHITA YOICHI , TODA YOSHIHIRO
IPC分类号： B23P21/00 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting device which is capable of stably mounting an electronic component on a board solving such a problem that a mounting head misses vacuum-chucking an electronic component due to air leakage caused by the improper position of the component, where the electronic component mounting device is used for mounting electronic components on a board. SOLUTION: A vacuum-chuck angle selection station 26 previously turns a vacuum-chuck nozzle 103 provided in a head 102 conforming to the feed direction of an electronic component fed from a feed section 12. The vacuum- chuck angle selection station 26 is provided between the feed section 12 which feeds electronic components and a board positioning section 14 which moves a board 2 mounted with electronic parts to a component mounting station, whereby the vacuum-chuck nozzle 103 is capable of surely vacuum-chucking an electronic component independently of its position without changing the tip of the vacuum-chuck nozzle 103 in shape.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式