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1. 发明专利

JP2005005072A Frame positioning device 审中-公开
标题翻译：框架定位装置
公开(公告)号：JP2005005072A
公开(公告)日：2005-01-06
申请号：JP2003165947
申请日：2003-06-11
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SHINANO FUMIO , INAGAKI NORIYUKI , MUNEOKA ATSUSHI
IPC分类号： H01J9/14
摘要： PROBLEM TO BE SOLVED: To automate positioning of a frame when mass-producing a shadow mask.
SOLUTION: The position of the frame 1 in the N S direction is fixed at the rotational center of a rotary actuator 5 by a roller 2, a block 3, a link 4, and the rotary actuator 5. In addition, the position of the frame 1 in the E W direction is fixed at the rotational center of a rotary actuator 10 by a roller 6, an adjusting roller 7, a block 8, a link 9, and the rotary actuator 10. Furthermore, the height of the frame 1 is positioned by the adjusting roller 7 to adjust the height of the frame 1, and is held by a holding mechanism. Thereby, a shadow mask flat plate can be positioned on the frame 1 in a short time, and productivity can be enhanced by reducing positional deviation.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：在批量生产荫罩时自动定位框架。解决方案：框架1在NS方向的位置通过辊2，块3，连杆4和旋转致动器5固定在旋转致动器5的旋转中心。另外，位置在EW方向上的框架1通过辊6，调节辊7，块8，连杆9和旋转致动器10固定在旋转致动器10的旋转中心。此外，框架的高度 1由调节辊7定位以调节框架1的高度，并由保持机构保持。由此，可以在短时间内将荫罩平板放置在框架1上，通过减少位置偏差来提高生产率。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2001205468A LIGHT GUIDING DEVICE, METHOD OF LIGHT GUIDING, LASER RADIATION DEVICE, AND METHOD OF LASER RADIATION 失效
公开(公告)号：JP2001205468A
公开(公告)日：2001-07-31
申请号：JP2000015740
申请日：2000-01-25
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TSUTSUMI HIDETAKA , INAGAKI NORIYUKI
IPC分类号： B23K26/00 , B23K26/064 , B23K26/067 , H01S3/00 , B23K26/06
摘要： PROBLEM TO BE SOLVED: To provide a device and its method which keeps the original function of the device by making use of a remaining light beam generator even when either of the light beam generators gets a trouble resulting in a malfunction in light generation for a device 50 provided with plural light generators (laser oscillators 30 and 32). SOLUTION: Optical path changing parts (56 and 58) which guide each one of light beam (laser beams 100 and 102) generated by each one independent light beam generators (30 and 32), respectively, to optical paths (60 and 62) corresponding to the light generators (30 and 32), and to the optical paths (62 and 60) corresponding to the other light generators (32 and 30), are provided in a light-guiding device which guides each of the light beams (laser beams 100 and 102) generated by plural light generators (laser oscillators 30 and 32) to the optical paths (light-guiding paths 60 and 62) each of which corresponds to the respective light generator.

3. 发明专利

JPH0592851A FILM WINKING DEVICE 失效
公开(公告)号：JPH0592851A
公开(公告)日：1993-04-16
申请号：JP25096291
申请日：1991-09-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAMAMOTO SATOHARU , INAGAKI NORIYUKI
IPC分类号： B26F3/12 , B65H19/26 , H01G13/02
摘要： PURPOSE:To obtain desirable cutting performance at the time of winding the extremely thin resin group film of a laminated film condenser or the like to cut the unnecessary film, thereby improving productivity, automation and reliability. CONSTITUTION:The tension of a film 26 is relaxed by a two-stage stroke cylinder 21 for moving a chuck unit 20, and the film 26 is cut with a sufficiently heated nichrome wire 33. The cracking of the film 26 is thereby suppressed, and cutting can be performed as aimed at.

4. 发明专利

JPH04256591A SUCTION DEVICE FOR CHIP 失效
公开(公告)号：JPH04256591A
公开(公告)日：1992-09-11
申请号：JP1515791
申请日：1991-02-06
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： UCHIDA HARUTO , INAGAKI NORIYUKI , YAMAMOTO SATOHARU
IPC分类号： B25J15/06 , H01G13/00 , H01L21/66
摘要： PURPOSE:To easily decide automatically the presence of the suction of a chip, without the need for a lot of pressure sensors and an expensive picture image recognizing device in deciding as to whether or not a chip is sucked to a suction nozzle, in the chip suction device used in the case of installing the small piece of a capacitor, etc., to a circuit board. CONSTITUTION:A suction nozzle 5 in a low pressure chamber 6 is press-fitted by an elastic body 8 to a nozzle stopper 7 arranged on the low pressure chamber 6. When a chip 4 is sucked to the tip of the suction nozzle 5, the internal pressure of the low pressure chamber 6 is reduced, the elastic body 8 is displaced because the suction force exceeds the elastic force of the elastic body 8, and the suction nozzle 5 lifts just as the chip 4 is sucked, so the presence of suction can be decided with the displacement difference of the suction nozzle being detected by a displacement sensor.

5. 发明专利

JPH0495778A HOLDING APPARATUS FOR CHIP-TYPE ELECTRONIC PART 失效
公开(公告)号：JPH0495778A
公开(公告)日：1992-03-27
申请号：JP20859690
申请日：1990-08-06
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAMAMOTO SATOHARU , INAGAKI NORIYUKI , SAEKI CHIHIRO
IPC分类号： G01R29/22 , G01R31/00 , G01R31/26 , H01G13/00 , H01L21/52 , H01L21/66
摘要： PURPOSE:To avoid influences of the holding state in measuring characteristics by keeping the holding state with a spring once a part is held. CONSTITUTION:Elements 1 are held side by side on an element holding block 20. When a parallel link 21 is opened up a down, the parallel link 21 is con tracted right and left, and right and left sliders 26 are drawn to the center. Therefore, a pressing shaft 29 held by a first spring 28 and an intermediate electrode 30 mounted at an end of the pressing shaft 29 are advanced. According ly, the right and left intermediate electrodes 30 press and hold a terminal part 2 of the element 1 by a force via the first spring 28. In this state, as a table 19 to which a main body 12 of the instrument is fixed is moved downward, a contact probe 5 is brought in touch with the intermediate electrode 30 and is connected indirectly to the terminal part 2 of the element 1. When the mea surement is finished, the table 19 is raised and a table 4 is moved, so that the element holding block 20 having a plurality of the elements 1 mounted thereon in the holding state is moved to the next position.

6. 发明专利

JPH03205215A FIXED ITCH SEPARATING DEVICE OF ELEMENT 失效
公开(公告)号：JPH03205215A
公开(公告)日：1991-09-06
申请号：JP34079989
申请日：1989-12-29
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MATSUMURA KENICHI , INAGAKI NORIYUKI
IPC分类号： B23P19/00 , B23Q7/04 , B65G47/08 , B65G47/78 , B65G47/91 , H01L21/52 , H01L21/677 , H01L21/68 , H05K13/02
摘要： PURPOSE:To separate elements at a high speed in a fixed pitch separating device of the elements which are provided by a feeder, by holding elements to be fed by a holding means, simultaneously sucking them with vacuum adsorbing pincettes arranged at prescribed pitches and preventing rising of elements other than the sucked ones. CONSTITUTION:A prescribed amount of elements 1 which are continuously provided from a part feeder 2 are held in a groove 4 of a holding means 3. When the holding means 3 is filled fully, a separating means 5 lowers to vacuum-suck the elements 1 with pincettes 7 arranged at prescribed intervals. At this time, the elements 1 which are not sucked by a rise preventing means 11 are pressed to be stopped inside the groove 4. Next, the separating means 5 is raised to be transferred to an inspecting part 9. It is thus possible to separate the elements at a high speed.

7. 发明专利

JPH03205214A FIXED PITCH SEPARATING DEVICE OF ELEMENT 失效
公开(公告)号：JPH03205214A
公开(公告)日：1991-09-06
申请号：JP34079789
申请日：1989-12-29
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MATSUMURA KENICHI , INAGAKI NORIYUKI
IPC分类号： B23P19/00 , B23Q7/04 , B65G47/08 , B65G47/14 , B65G47/78 , B65G47/91 , H01L21/52 , H01L21/677 , H01L21/68 , H05K13/02
摘要： PURPOSE:To separate elements at a high speed in a fixed pitch separating device of the elements which are provided by a part feeder, by holding them from the part feeder by a holding means, sucking them by the separating device provided with vacuum pincette so that the pincette may expand and contract at prescribed intervals. CONSTITUTION:Elements 1 which are continuously fed from a part feeder 2 are held in the groove 4 of a holding means 3. When the holding means 3 is filled fully, a separating means 5 lowers to suck the elements 1 with vacuum pincette 7. Next, when the separating means 5 rises and a lever 10 is oscillated to pull the end of the vacuum pincette 7, the respective vacuum pincette 7 chain-travel to make a clearance between them because the respective vacuum pincette 7 are connected with each other by links 8. Therefore, they separate from each other at prescribed intervals according to the oscillating amount of the lever 10. It is thus possible to separate the elements at a high speed.

8. 发明专利

JPS63111633A BONDING METHOD FOR CHIP 失效
公开(公告)号：JPS63111633A
公开(公告)日：1988-05-16
申请号：JP25880786
申请日：1986-10-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INAGAKI NORIYUKI , MAKINO YUTAKA , YAMAMOTO AKIHIRO , MATSUMURA SHINYA
IPC分类号： H01L21/52 , H01L21/60
摘要： PURPOSE:To effectively bond the bump contacts of a chip to the leads of a substrate by depressing the chip against the substrate in the state that the chip is supported through a spherical bearing having a rotating center on the bonding surface. CONSTITUTION:A substrate positioning unit 17 is operated to dispose the position where the chip 1 of a substrate 3 should be mounted directly above the chip 1. Thereafter, an elevator 8 is raised, and the bump contact 2 of the chip 1 is pressed to the leads 4 of the substrate 3 to bond the bump contact to the leads. In this case, since the chip 1 is rotatably supported through a spherical bearing 7 that a point on the bonding surface is disposed at the rotating center to be held by a pressor 5, even if the bonding surface of the substrate 3 to the leads 4 and the bonding surface of the chip 1 to the contact 2 are not parallel, the bonding surface of the contact 2 is so inclined as to copy the bonding surface of the leads 4, all the contacts 2 are uniformly contacted with the leads 4 to be effectively bonded.

9. 发明专利

JPS6259871A INSPECTION METHOD FOR CIRCUIT BOARD 失效
公开(公告)号：JPS6259871A
公开(公告)日：1987-03-16
申请号：JP19977985
申请日：1985-09-10
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INAGAKI NORIYUKI , MAKINO YUTAKA , HAMAUCHI CHIKAICHI , KINOSHITA HIROSHI
IPC分类号： G01R31/02 , G02F1/133 , G02F1/1343
摘要： PURPOSE:To inspect many electrodes which are arrayed at narrow pitch at the same time without flawing by pressing the electrodes to be measured and a flexible measurement substrate such as a film substrate with a presser piece made of an elastic body. CONSTITUTION:The substrate 7 to be measured where many electrodes 18 to be measured are arrayed and an electrode substrate 11 for measurement which has electrodes 12 for measurement arrayed at the same pitch with the electrodes 8 to be measured are pressed against each other across the presser piece 13 from above and below. In this case, the electrodes 12 and 18 are aligned in the pitch direction by using an optical microscope 15. Then, even if strain or warp, etc., is caused between the substrates 7 and 11, the strain or warp by which the substrate 11 is hardly made to the substrate 7 through the elastic presser piece 13 is absorbed to press and connect them together uniformly on the whole. Consequently, none of the electrodes 8 is flawed and even if the substrate 7 has the strain, pressing force applied to the elastic presser piece 13 is adjusted to make a secure connection.

10. 发明专利

JPS6231137A DICE BONDING DEVICE 失效
公开(公告)号：JPS6231137A
公开(公告)日：1987-02-10
申请号：JP17152585
申请日：1985-08-02
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAMAMOTO AKIHIRO , MAKINO YUTAKA , INAGAKI NORIYUKI
IPC分类号： H01L21/677 , H01L21/52 , H01L21/58 , H01L21/67 , H01L21/68
摘要： PURPOSE:To enable the high-speed operation and to improve the productivity exceedingly by a method wherein plural wafers are held in a state of lamination in a stocker which is moved up and down by an elevating device and a carry- out means moves an arbitrary wafer to a wafer supporting part. CONSTITUTION:On an elevating body 9, a stocker 10 which can hold plural wafer tables 12 carrying a wafer 11 in a state of lamination is placed. This stocker 10 is composed of a square frame and on the inside plane of the both side walls 13 of that, plural holding grooves 14 in which the both ends of the wafer table 12 fit are formed. A cylinder device 23 as a carry-out means for the wafer tables 12 is provided, which pushes out the wafer table 12 held in the stocker 10 and sends it to a wafer supporting part 16. At the same time, the device 23 sends the wafer table 12 which has been present in the wafer supporting part 16 out to the stocker 10 on the opposite side to hold it. Consequently, the high-speed operation becomes possible and the productivity is exceedingly improved.

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