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1. 发明专利

JP2001064799A ELECTROLYTIC WORKING METHOD AND DEVICE 失效
公开(公告)号：JP2001064799A
公开(公告)日：2001-03-13
申请号：JP24186999
申请日：1999-08-27
申请人： MORI YUZO , EBARA CORP
发明人： MORI YUZO , SHIRAKASHI MICHIHIKO , SAITO TAKAYUKI , TAIMA YASUSHI , FUKUNAGA AKIRA , OBATA ITSUKI
IPC分类号： B23H3/08 , C25D11/02 , C25F3/00
摘要： PROBLEM TO BE SOLVED: To provide a working method capable of executing clean working which does not leave impurities on the working face in the object to be worked by using hydroxide ions in ultrapure water. SOLUTION: In ultrapure water, an anode 2 as the object to be worked and a cathode 1 confronted with this at prescribed intervals are arranged, the space between the object to be worked and the cathode is provided with a catalytic member 3b promoting the dissociation of the ultrapure water and having water passability, and the flow of ultrapure water is formed in the catalytic member as voltage is applied on the space between the object to be worked and the cathode, by which water molecules in the ultrapure water are decomposed into hydrogen ions and hydroxide ions, the produced hydroxide ions are fed to the surface of the object to be worked, and, by chemical elution reaction or oxidation reaction by hydroxide ions, removing working or oxidized film forming working is executed to the object to be worked.

2. 发明专利

JP2002292523A ELECTROCHEMICAL MACHINING METHOD AND APPARATUS 失效
公开(公告)号：JP2002292523A
公开(公告)日：2002-10-08
申请号：JP2001179340
申请日：2001-06-13
申请人： EBARA CORP , MORI YUZO
发明人： MORI YUZO , SHIRAKASHI MICHIHIKO , TAIMA YASUSHI , OBATA ITSUKI , SAITO TAKAYUKI
IPC分类号： B23H3/04 , B01J47/12 , B23H3/00 , B23H3/08 , C25D11/02 , C25D11/06 , C25D11/34 , C25D17/00 , C25F3/00 , C25F7/00
摘要： PROBLEM TO BE SOLVED: To provide an electrochemical machining method and an apparatus in which ultra pure water is used, and elimination processings of materials such as aluminum or iron are effectively carried out. SOLUTION: A workpiece 28 which is made to be a positive pole and a negative pole 24 are disposed at a prescribed interval in ultra pure water 12, and catalyst imparted with an exchangability of strong basic anion is disposed between the workpiece 28 and the negative pole 24, and the workpiece 28 and the negative pole 24 are relatively moved while applying voltage between the workpiece 28 and the negative pole 24.

3. 发明专利

JP2011009600A Substrate processing method and substrate processing apparatus 审中-公开
标题翻译：基板加工方法和基板加工装置
公开(公告)号：JP2011009600A
公开(公告)日：2011-01-13
申请号：JP2009153290
申请日：2009-06-29
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAIMA YASUSHI , SUZUKI TSUKURU , O CHIKAAKI , YAMAUCHI KAZUO , KODERA AKIRA , SAITO TAKAYUKI , HIYAMA HIROKUNI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To suppress formation of a watermark on the surface of a substrate having been dried by reducing the used amount of isopropyl alcohol (IPA) or th like as much as possible, and minimizing production of droplets and mist.SOLUTION: A substrate processing method that dries the surface of the substrate W which is at least partially hydrophobic includes: arranging a proximate plate 16 at a position near the surface of the substrate W opposite in parallel with the surface of the substrate W; forming a continuous coating liquid film 28 which comes into contact with the surface of the substrate W and the proximate plate 16 between the surface of the substrate W and the proximate plate 16; and removing the coating liquid film 28, positioned in a region on the surface of the substrate W which is not covered with the proximate plate 16 any more, from the surface of the substrate W by changing the position of the coating liquid film 28 relative to the surface of the substrate W by relatively moving the substrate W and the proximate plate 16 in parallel and in one direction.
摘要翻译：要解决的问题：通过尽可能地减少异丙醇（IPA）或类似物的使用量来抑制已经干燥的基底的表面上的水印的形成，并且最小化液滴和雾的产生。解决方案：A 使至少部分疏水的衬底W的表面干燥的衬底处理方法包括：在邻近衬底W的表面平行于衬底W的表面附近的位置处布置邻近板16; 形成与衬底W的表面和衬底W的表面与邻近板16之间的接近板16接触的连续涂覆液膜28; 并且通过改变涂布液膜28相对于基板W的位置，从基板W的表面移除位于基板W的表面上未被邻近板16的表面的区域中的涂布液膜28 基板W的表面通过相对移动基板W和邻近板16而平行且沿一个方向。

4. 发明专利

JP2005264268A Electrochemical machining device and electrochemical machining method 审中-公开
标题翻译：电化学加工设备和电化学加工方法
公开(公告)号：JP2005264268A
公开(公告)日：2005-09-29
申请号：JP2004081178
申请日：2004-03-19
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NOMICHI IKUTARO , YASUDA HOZUMI , IIIZUMI TAKESHI , OBATA ITSUKI , HIROKAWA KAZUTO , SAITO TAKAYUKI , SUZUKI TSUKURU , TAIMA YASUSHI
IPC分类号： C25F3/00
摘要： PROBLEM TO BE SOLVED: To improve the flattening properties of a machining face by retaining the difference in electric resistance between the recessed part and the projecting part in the surface of the object to be machined. SOLUTION: The electrochemical machining device comprises: a machining electrode 60 capable of freely approaching the object to be machined; a power feeding electrode 62 of feeding power to the object to be machined; a contact member 70 arranged between the object to be machined and the machining electrode, and in which the deformation volume by a contact load to the object to be machined is set to the initial height of the ruggedness in the surface of the object to be machined or lower; a power source 48 of applying voltage between the machining electrode 60 and the power feeding electrode 62; and liquid feeding parts 62a, 62b, 66b, 66c of feeding liquid to at least either the space between the object to be machined and the machining electrode 60 or the power feeding electrode 62. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过保持待加工物体的表面中的凹部与突出部之间的电阻差，来提高加工面的平坦化性能。解决方案：电化学加工装置包括：能够自由接近待加工物体的加工电极60; 向被加工物供给电力的供电电极62; 布置在待加工物体与加工电极之间的接触构件70，其中通过对待加工物体的接触载荷的变形量设定为待加工物体的表面中的粗糙度的初始高度或更低; 在加工电极60和供电电极62之间施加电压的电源48; 以及供液部62a，62b，66b，66c，将液体供给到待加工对象物与加工用电极60或供电电极62之间的空间中的至少任一个。（C）2005，JPO＆NCIPI

5. 发明专利

JP2005153142A Electrochemical machining apparatus 审中-公开
标题翻译：电化学加工设备
公开(公告)号：JP2005153142A
公开(公告)日：2005-06-16
申请号：JP2005063012
申请日：2005-03-07
申请人： Ebara Corp , 株式会社荏原製作所
发明人： OBATA ITSUKI , SHIRAKASHI MICHIHIKO , KUMEGAWA MASAYUKI , SAITO TAKAYUKI , TAIMA YASUSHI , SUZUKI TSUKURU , YAMADA KAORU , MAKITA YUJI
IPC分类号： B23H3/10
摘要： PROBLEM TO BE SOLVED: To realizes advantages such as disuse of CMP processing itself, minimum load of the CMP processing in flattening a conductive material provided on a substrate surface, and removal of deposits adhering to the substrate surface. SOLUTION: This electrochemical machining apparatus includes a retainer 45 for retaining a work W, an electrode section 48 provided so as to face the work W, and a through hole 48a for feeding working fluid opening to a surface facing the work W in the electrode section 48, and is structured so that the working fluid used for electrochemical machining may be fed to the surface of the electrode section 48 from the through hole 48a. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了实现诸如废弃CMP处理本身的优点，在设置在基板表面上的导电材料的平坦化中的CMP处理的最小负载以及附着到基板表面的沉积物的去除。解决方案：该电化学加工装置包括用于保持工件W的保持器45，与工件W相对设置的电极部分48，以及用于将工作流体开口供给到面向工件W的表面的通孔48a 电极部分48，并且被构造成使得用于电化学加工的工作流体可以从通孔48a馈送到电极部分48的表面。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2004216542A Electrochemical machining device and electrochemical machining method 审中-公开
公开(公告)号：JP2004216542A
公开(公告)日：2004-08-05
申请号：JP2003196419
申请日：2003-07-14
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SERIKAWA ROBERUTO MASAHIRO , SAITO TAKAYUKI , SUZUKI TSUKURU , KODERA AKIRA , YASUDA HOZUMI , OBATA ITSUKI , IIIZUMI TAKESHI
IPC分类号： B23H3/02 , B23H9/00 , H01L21/3205
摘要： PROBLEM TO BE SOLVED: To provide an electrochemical machining device capable of carrying out an electrochemical machining without using chemicals, and further capable of effectively preventing the occurrence of a pit by which rejected products of the workpiece is considered to be formed, and an electrochemical machining method. SOLUTION: An electrolytic machining device comprises a machining electrode 3, a power supply electrode 2 for supplying power to a workpiece 10, an ion exchanger 5 arranged at least either of the part between the workpiece 10 and the machining electrode 3, or between the workpiece 10 and the power supply electrode 2, a power source 15 for applying a pulse voltage between the machining electrode 3 and the power supply electrode 2, and a liquid feeding part (liquid vessel) 11 for feeding a liquid 6 to at least either of the part between the workpiece 10 and the machining electrode 3, or between the workpiece 10 and the supplying electrode 2. COPYRIGHT: (C)2004,JPO&NCIPI

7. 发明专利

JP2004055839A Apparatus and method for processing substrate 有权
公开(公告)号：JP2004055839A
公开(公告)日：2004-02-19
申请号：JP2002211524
申请日：2002-07-19
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SAITO TAKAYUKI , SUZUKI TSUKURU , YAMADA KAORU , ITO KENYA , KAMEZAWA MASAYUKI , YAMAGUCHI KENJI
IPC分类号： H01L21/306 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for processing a substrate which can supply a cleaning liquid only to a required region of the substrate, without scattering the liquid, can thereby maintain clean atmosphere in a chamber and can reduce the amount of the cleaning liquid used.
SOLUTION: The apparatus for processing the substrate includes rotation holding mechanisms 21a, 21b, 21c and 21d, each for substantially horizontally holding and rotating the substrate; and a cleaning liquid supply mechanism 23 for supplying the cleaning liquid L toward a region B to be cleaned of the substrate at a flow rate of at least 0.1 m/s or higher, by opening a cleaning liquid discharge port directed toward the radiating direction directed from an inside of the substrate toward the peripheral edge at an elevation angle of 45° or smaller, from the surface of the substrate to at least one of a front surface and a rear surface of the substrate.
COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2003164768A METHOD AND APPARATUS FOR REGENERATING ION EXCHANGER 审中-公开
公开(公告)号：JP2003164768A
公开(公告)日：2003-06-10
申请号：JP2001365147
申请日：2001-11-29
申请人： EBARA CORP
发明人： SAITO TAKAYUKI , SUZUKI TSUKURU , MAKITA YUJI , YAMADA KAORU , SHIRAKASHI MICHIHIKO , TAIMA YASUSHI , OBATA ITSUKI , KUMEGAWA MASAYUKI , YASUDA HOZUMI
IPC分类号： B01J49/00 , C25F7/00
摘要： PROBLEM TO BE SOLVED: To easily and rapidly regenerate an ion exchanger and to extremely reduce the load in the washing of the ion exchanger after regeneration or the treatment of a waste liquid. SOLUTION: In regenerating the ion exchanger used in electrolytic processing, the ion exchanger 30a to be treated which is to be subjected to regeneration is arranged between a pair of electrodes 32 and 34 and voltage is applied across the electrodes while supplying liquid to the region between the electrodes to regenerate the ion exchanger 30a to be treated. COPYRIGHT: (C)2003,JPO

9. 发明专利

JP2003080422A Electrochemical machining device 有权
标题翻译：电化学加工设备
公开(公告)号：JP2003080422A
公开(公告)日：2003-03-18
申请号：JP2001275113
申请日：2001-09-11
申请人： Ebara Corp , 株式会社荏原製作所
发明人： OBATA ITSUKI , SHIRAKASHI MICHIHIKO , KUMEGAWA MASAYUKI , SAITO TAKAYUKI , TAIMA YASUSHI , SUZUKI TSUKURU , YAMADA KAORU , MAKITA YUJI , YASUDA HOZUMI
IPC分类号： B23H3/10 , B23H3/08 , H01L21/28 , H01L21/306 , H01L21/3205 , H01L21/3213
摘要： PROBLEM TO BE SOLVED: To eliminate CMP treatment itself, for example, to machine an electrically conductive material provided on a surface of a substrate flat while reducing a load of CMP treatment to the extent and additionally to remove (clean) an attachment attached on a work such as the substrate, etc.
SOLUTION: This electrochemical machining device has a pair of electrodes 44, 46 arranged above and below by separating them by a specified interval, an ion exchanger 48 arranged between a pair of the electrodes 44, 46 and a liquid supply part to supply liquid to the ion exchanger 48.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了消除CMP处理本身，例如，为了加工设置在基板平面的表面上的导电材料，同时减少CMP处理的负载到一定程度并另外去除（清洁）附接在基板平面上的附件工作如基板等。解决方案：该电化学加工装置具有一对电极44,46，其通过以特定间隔分开布置在其上方和下方，布置在一对电极44,46之间的离子交换器48和液体供应部分供应到离子交换器48的液体。

10. 发明专利

JP2003080421A Electrochemical machining device 审中-公开
标题翻译：电化学加工设备
公开(公告)号：JP2003080421A
公开(公告)日：2003-03-18
申请号：JP2001275112
申请日：2001-09-11
申请人： Ebara Corp , 株式会社荏原製作所
发明人： OBATA ITSUKI , SHIRAKASHI MICHIHIKO , KUMEGAWA MASAYUKI , SAITO TAKAYUKI , TAIMA YASUSHI , SUZUKI TSUKURU , YAMADA KAORU , MAKITA YUJI , YASUDA HOZUMI
IPC分类号： B23H3/10 , B23H3/08 , H01L21/28 , H01L21/3063 , H01L21/3213
摘要： PROBLEM TO BE SOLVED: To remove (clean) an electrically conductive material filmed over or stuck to a bevel part, etc., of a substrate and to machine an outer peripheral part of the substrate by applying electrochemical machining in place of, for example, conventional general etching by electrochemical action.
SOLUTION: This electrochemical machining device is furnished with a plurality of electrodes 36 accumulated with an insulating material 34 between them and has an electrode part 32 having a holding part 38 to face against an outer peripheral part of a work W, an ion exchanger 48 arranged on the holding part 38 of the electrode part 32, a liquid supply part 50 to supply liquid to the holding part 38 of the electrode part 32 and an electric source 40 to apply voltage to the electrodes 36 of the electrode part 32 so that the electrodes 36 become different polarities from each other.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了去除（清洁）通过施加电化学机械加工而覆盖或粘附到基板的斜面部分等上的导电材料并且对基板的外周部分进行加工，代替例如，常规通用蚀刻通过电化学作用。解决方案：该电化学加工装置具有多个积聚有绝缘材料34的电极36，并具有电极部分32，电极部分32具有与工件W的外围部分相对的保持部分38，在电极部32的保持部38上设置液体供给部50，用于向电极部32的保持部38供给液体，电源40向电极部32的电极36施加电压，使得电极 36成为彼此不同的极性。

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