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    • 1. 发明专利
    • Flame-retardant composition
    • 阻燃组合物
    • JP2014101503A
    • 2014-06-05
    • JP2013220352
    • 2013-10-23
    • Mitsui Chemicals Inc三井化学株式会社
    • SUZUKI RIHOKOAZEZAKI TAKASHIGOTO KENICHI
    • C08L45/00C08K3/32C08K5/29C08K5/3477
    • PROBLEM TO BE SOLVED: To provide a flame-retardant composition which maintains excellent heat resistance and dielectric characteristics of a cyclic olefin (co)polymer and furthermore whose flame resistance can be improved.SOLUTION: The flame-retardant composition contains a cyclic olefin (co)polymer (P) and a phosphorous-based flame-retardant (N-1) having a decomposition temperature in the range 100°C to 500°C(excluding retardant containing a nitrogen atom in cationic component). The content of the phosphorous-based flame-retardant (N-1) is 30 pts.wt to 300 pts.wt. when the content of the cyclic olefin (co)polymer (P) is 100 pts.wt.
    • 要解决的问题:提供一种保持环烯烃(共)聚合物优异的耐热性和介电特性并且还可以改善其阻燃性的阻燃组合物。解决方案:阻燃组合物含有环烯烃(共 )聚合物(P)和分解温度为100℃〜500℃(不含阳离子成分中的氮原子的阻燃剂)的磷系阻燃剂(N-1)。 磷系阻燃剂(N-1)的含量为30重量%〜300重量份。 当环烯烃(共)聚合物(P)的含量为100重量份时,
    • 3. 发明专利
    • Adhesive olefin polymer composition and laminate obtained by using the same
    • 粘合烯烃聚合物组合物和使用它的层压板
    • JP2011021063A
    • 2011-02-03
    • JP2009165006
    • 2009-07-13
    • Mitsui Chemicals Inc三井化学株式会社
    • MAEDA TOSHIHIROGOTO KENICHIMATSUMOTO HIRONORI
    • C08L23/26B32B7/10B32B15/085C08K5/00
    • PROBLEM TO BE SOLVED: To provide an adhesive olefin polymer composition exhibiting strong adhesive strength to an olefin polymer layer regardless of the kind of metals, and having adhesion durability, and to provide a laminate of a metal layer and an olefin polymer layer obtained by using the adhesive olefin polymer composition. SOLUTION: The adhesive olefin polymer composition includes (B) 0.001-3 pts.wt. of a substituted monocyclic or condensed polycyclic aromatic compound or a metal salt thereof and (A) 100 pts.wt. of an olefin polymer containing 0.05-15 wt.% of a graft group composed of an unsaturated carboxylic acid and/or a derivative thereof. The clad laminate or the laminate is obtained by using the adhesive olefin polymer composition. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种对烯烃聚合物层具有强粘合强度的粘合烯烃聚合物组合物,而不管金属的种类,并具有粘合耐久性,并且提供金属层和烯烃聚合物层的层压体 通过使用粘合烯烃聚合物组合物获得。 解决方案:粘合剂烯烃聚合物组合物包含(B)0.001-3重量份 的取代的单环或稠合多环芳香族化合物或其金属盐,(A)100重量份 的含有0.05-15重量%由不饱和羧酸和/或其衍生物组成的接枝基团的烯烃聚合物。 通过使用粘合烯烃聚合物组合物获得覆盖层压板或层压体。 版权所有(C)2011,JPO&INPIT
    • 5. 发明专利
    • Printed board for optoelectronic circuit
    • 印刷电路板印刷
    • JP2006210482A
    • 2006-08-10
    • JP2005018010
    • 2005-01-26
    • Mitsui Chemicals Inc三井化学株式会社
    • TORIIDA MASAHIROTAKEDA KOJIGOTO KENICHI
    • H05K1/03
    • PROBLEM TO BE SOLVED: To provide a printed board for optoelectronic circuit which can efficiently transmit an optical signal in a direction vertical to a board face where an optoelectronic circuit is formed, which can correspond to a manufacture process using lead-free solder, which is superior in optical transparency of a wavelength in a visible light region and in heat resistance, and which can inexpensively be manufactured.
      SOLUTION: A sheet or a film formed of polyamide having a specified structure shown by a chemical formula (1) superior in optical transparency of the wavelength in the visible light region and in heat resistance is used as an insulating layer of the printed board for optoelectronic circuit.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种用于光电子电路的印刷电路板,其可以在垂直于形成光电子电路的电路板面的方向上有效地传输光信号,这可以对应于使用无铅焊料的制造工艺 其在可见光区域的波长的光学透明性和耐热性方面优异,并且可以廉价地制造。 解决方案:使用具有由可见光区域的波长的光学透明度优异且具有耐热性的化学式(1)所示的具有特定结构的聚酰胺形成的薄片或薄膜作为印刷的绝缘层 光电子电路板。 版权所有(C)2006,JPO&NCIPI
    • 6. 发明专利
    • Laminated plate for high frequency circuit
    • 高频电路层压板
    • JP2006045318A
    • 2006-02-16
    • JP2004227082
    • 2004-08-03
    • Mitsui Chemicals Inc三井化学株式会社
    • KANEKO KAZUYOSHIHIROSE TOSHIYUKIGOTO KENICHIHASEGAWA AKIRA
    • C08F291/00H05K1/03
    • PROBLEM TO BE SOLVED: To provide a new resin composition for forming a laminated plate adaptable for the transmission of a high frequency signal, more particularly a resin composition having low dielectric constant, low dielectric loss tangent, high heat-resistance and low water absorption and a laminated plate for high frequency circuit produced by using the resin composition.
      SOLUTION: The laminated plate for high frequency circuit is composed of a resin composition produced by reacting (A) 5-95 pts.wt. of a cycloolefin copolymer having a glass transition temperature of 60-200°C and (B) 5-95 pts.wt. of a soft copolymer composed of at least two components selected from olefin components, diene components and aromatic vinyl hydrocarbon components and having a glass transition temperature of ≤0°C with (C) 0.01-5 pts.wt. (based on 100 pts.wt. of A+B) of an organic peroxide and (D) 0-5 pts.wt. of a polyfunctional compound having ≥2 radically polymerizable functional groups in one molecule.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了提供适合于传输高频信号的层压板的新型树脂组合物,更具体地说,具有低介电常数,低介电损耗角正切,高耐热性和低介电常数的树脂组合物 吸水性和通过使用树脂组合物制造的高频电路用层压板。 解决方案:高频电路用层叠板由(A)5-95重量份 的玻璃化转变温度为60-200℃的环烯烃共聚物和(B)5-95重量份的环烯烃共聚物。 由选自烯烃组分,二烯组分和芳族乙烯基烃组分中的至少两种组分组成的软质共聚物,玻璃化转变温度为≤0℃,(C)为0.01-5重量份。 (基于100重量份的A + B)有机过氧化物和(D)0-5重量份 的在一个分子中具有≥2个可自由基聚合的官能团的多官能化合物。 版权所有(C)2006,JPO&NCIPI
    • 7. 发明专利
    • Resin composition and laminate for high-frequency circuit using the same
    • 用于高频电路的树脂组合物和层压板
    • JP2005255917A
    • 2005-09-22
    • JP2004071870
    • 2004-03-15
    • Mitsui Chemicals Inc三井化学株式会社
    • GOTO KENICHIHASEGAWA AKIRATAMAI MASAJI
    • B32B15/082B32B15/08C08K5/00C08L23/20C08L45/00C08L51/06H01B3/44H05K1/03
    • PROBLEM TO BE SOLVED: To obtain a resin composition having a low dielectric constant, a low dielectric tangent, heat resistance, and adhesion to conductive materials, and to provide a laminate for high-frequency circuits using the resin composition.
      SOLUTION: The resin composition is composed of 3-72 pts.wt. of (I) a polymer selected from 4-methyl-1-pentene-based polymers and/or cycloolefin-based copolymers containing at least a monomer component expressed by formula (1) which takes a structure expressed by formula (2) in the polymer, 0.5-50 pts.wt. of (II) a modified poly-α-olefinic polymer having 0.01-10 wt.% of a portion graft-modified with an unsaturated carboxylic acid and/or its derivatives, and 25-90 pts.wt. of (III) an inorganic filler with an average particle diameter of 0.1-100 μm, provided that the total of (I), (II), and (III) is 100 pts.wt.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了获得具有低介电常数,低介电切线,耐热性和对导电材料的粘合性的树脂组合物,并提供使用该树脂组合物的高频电路层压体。 解决方案:树脂组合物由3-72重量份 选自(I)选自4-甲基-1-戊烯基聚合物和/或至少含有由式(1)表示的单体组分的环烯烃基共聚物的聚合物,其在聚合物中具有由式(2)表示的结构 ,0.5-50重量份 (II)具有0.01-10重量%的用不饱和羧酸和/或其衍生物接枝改性的部分的改性聚-α-烯烃聚合物和25-90重量份的 (III)的平均粒径为0.1-100μm的无机填料,条件是(I),(II)和(III)的总量为100重量份。 版权所有(C)2005,JPO&NCIPI
    • 8. 发明专利
    • Circuit board for microwave module
    • 电路板微波模块
    • JP2004281713A
    • 2004-10-07
    • JP2003071102
    • 2003-03-17
    • Mitsui Chemicals Inc三井化学株式会社
    • GOTO KENICHIKAMATA JUNTAMAI MASAJI
    • C08G65/40H01L23/14H05K1/03
    • PROBLEM TO BE SOLVED: To provide a circuit board for a microwave module which is provided with an insulation film that has an excellent dielectric characteristic corresponding to high-frequency communication and superior properties such as hygroscopicity resistance, mechanical property or heat resistance, etc. through stable and efficient formation by photo processing.
      SOLUTION: The circuit board for a microwave module is provided with an insulation film made of polyether-based resin with a repetitive unit expressed by a general formula (I). In the formula, A represents a bivalent alkylene group of carbon numbers 1-10, -SO
      2 -, -SO-, -S-, -O-, or -CO-. a and b are independent integers of 0 to 4, m is an integer of 0 or 1, n is an integer of 1 t 3. R
      1 to R
      6 independently represent either of hydrogen atom, alkyl group of carbon numbers 1-8, and halogen atom, and at least one of R
      1 to R
      4 is a group other than hydrogen atom.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 解决的问题:为了提供一种具有绝缘膜的微波模块电路板,所述绝缘膜具有对应于高频连接的优异的介电特性以及诸如吸湿性,机械性能或耐热性等优异的性能, 等等,通过照片处理的稳定和有效的形成。 解决方案:用于微波模块的电路板设置有由聚醚基树脂制成的绝缘膜,其具有由通式(I)表示的重复单元。 在该式中,A表示碳原子数为1-10,-SO - , - S - , - O-或-CO-的二价亚烷基。 a和b是0〜4的独立整数,m为0或1的整数,n为1〜3的整数。R 1 至R SB为独立代表 氢原子,碳原子数为1-8的烷基和卤素原子,R SB 1至R 4中的至少一个为除氢原子以外的基团。 版权所有(C)2005,JPO&NCIPI