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    • 2. 发明专利
    • METHOD FOR CONTROLLING PLATING LIQUID BATH VOLUME OF CONTINUOUS ELECTROPLATING EQUIPMENT
    • JPH1060692A
    • 1998-03-03
    • JP21960196
    • 1996-08-21
    • KAWASAKI STEEL CO
    • IKENAGA YUJI
    • C25D21/14
    • PROBLEM TO BE SOLVED: To control the total bath volume of a plating liquid with the least possible loss of the plating liquid and with high accuracy. SOLUTION: Liquid discharge equipment 18 to be used when the plating liquid is made excessive by the deficiency of the water evaporation capacity of an evaporator 16 and a mixing device 20 which replenishes the plating liquid with water when the plating liquid decreases are arranged in the continuous electroplating equipment. At least one of three operation terminals consisting of the evaporator, the liquid discharge equipment and pure water supplying equipment is determined and operated in such a manner the total bath volume of the plating liquid is maintained at the target value of the bath volume with the least possible loss of the plating liquid by using at least one element of ZFF, ZFB and ΔV from the predicted controlled variable ZFF which is the total sum of the inflow rate of the water obtd. by measuring the volume of the water flowing into the plating equipment from the outside of the system, the deviation ΔV between the measured value of the total bath volume over the entire part of the plating equipment and the predetermined target value of the bath volume and the feedback controlled variable ZFB determined in accordance with the deviation ΔV.
    • 5. 发明专利
    • ELECTROPLATING EQUIPMENT
    • JPH0913199A
    • 1997-01-14
    • JP16523095
    • 1995-06-30
    • KAWASAKI STEEL CO
    • OHARA KENICHIIKENAGA YUJIIMAMURA MASATOKAMETANI TAKEFUMISAKAI NAOKIKATOU JIYUNYA
    • C25D21/02
    • PURPOSE: To provide an electroplating equipment not causing the drastic change in layout or increase in cost even when applied to an existing electroplating equipment in the technique to enhance the energy efficiency of an electroplating equipment and whereby the temp. of a plating soln. is precisely controlled. CONSTITUTION: A heat exchanger 6 is provided to a plating soln. feed pipeline 4 between an electroplating tank 1 and a circulating tank 3, and an upstream pipline 4a and a downstream pipeline 4b are connected to the high-temp. liq. side. The upstream pipeline 4a and the downstream pipeline 4b are communicated with a bypass pipeline 4c, and a flow control valve 41 is furnished in the middle of the bypass pipeline 4c. The flow control valve 41 is connected to the electrode 11 of the tank 1 through a controller 22. The water feed pipes 10a and 10b between the washing water storage tank 7 for a washing tank 2 and a pure water feeder 9 are connected to the low-temp. liq. side of the heat exchanger 6. The amt. of plating soln. to be heat-exchanged in accordance with a current strength I is controlled by the controller 22.