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    • 2. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPH0245963A
    • 1990-02-15
    • JP19687488
    • 1988-08-06
    • MITSUBISHI ELECTRIC CORP
    • WATABE KIYOTAKA
    • H01L23/20
    • PURPOSE:To keep a dangling bond from being formed and prevent the deterioration of electric characteristics by sealing a hydrogen gas into a closed space in which a semiconductor element is installed. CONSTITUTION:A semiconductor element 1 is sealed in such a way that it is surrounded to an airtight state by means of an enclosure 4 as a sealing member. A recessed part in the enclosure 4 functions as a hermetically sealed space which is sealed by the enclosure and a hydrogen gas is sealed into the recessed part in order to protect the element 1 from corrosion. Even if a dangling bond is formed at the interface of an insulating film in the element 1 by irradiating X-rays, hydrogen atoms are supplied from the sealed space and then, the hydrogen atoms extinguish the dangling bond after terminating it. The supply of the hydrogen gas thus keeps the dangling bond from being formed and the deterioration of electric characteristics are prevented.
    • 4. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR DEVICE
    • JPH0281439A
    • 1990-03-22
    • JP23321888
    • 1988-09-16
    • MITSUBISHI ELECTRIC CORP
    • WATABE KIYOTAKA
    • H01L21/336H01L29/78
    • PURPOSE:To avoid the degradation of a transconductance by a method wherein polycrystalline silicon, high melting point metal or its silicide is used as the material of a member on the side wall of a gate electrode which is a part of an ion implantation mask for obtaining an LDD structure and, further, the material is left on the side wall of the gate electrode. CONSTITUTION:After a field oxide film 2 is selectively formed on the main surface of a p-type silicon substrate 1, a gate electrode 3 is formed. After an insulating film 5 is formed on the surfaces of the gate electrode 3 and the substrate 1, a polycrystalline silicon film 6 is formed on it so as to cover the whole surface of the substrate 1. The polycrystalline silicon film 6 is so removed as to be left on the side wall of the gate electrode 3 by anisotropic etching. Arsenic or phosphorus ions are implanted with a relatively high concentration by using the gate electrode 3 and the remaining part of the polycrystalline silicon film as a mask. Even if hot carriers are injected into the gate side wall part on the drain side, they can be drained out of a drain electrode.