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    • 8. 发明专利
    • PROGRAMMABLE LOGIC DEVICE
    • JPH03231515A
    • 1991-10-15
    • JP2660390
    • 1990-02-06
    • MITSUBISHI ELECTRIC CORP
    • SHINOHARA HIROSHI
    • H03K19/177
    • PURPOSE:To attain high speed operation by generating a 2nd clock signal in response to a clock signal from a clock signal generating means and the output of a dummy input line driving means and precharging a 2nd output line to a 1st reference level in response to the 2nd clock signal. CONSTITUTION:Output signal lines on an AND plane 2b and an OR plane 4b are grouped by selecting two lines as a pair and reference potential signal lines CD1, CD2 are disposed in common to the two output signal lines in pairs. Moreover, a clock signal CLKOR for OR plane precharge control is generated in response to the signal potential of input signal lines ADB1, ADB2 of a dummy OR circuit 10 and a clock signal from an AND plane precharge control clock generating circuit 3b. Thus, the precharge/evaluation operation of the OR plane 4b is controlled in the optimum timing at all times and high speed operation is attained without generating a DC through-current in an output buffer without generating a malfunction.
    • 9. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT
    • JPH0377324A
    • 1991-04-02
    • JP21364389
    • 1989-08-19
    • MITSUBISHI ELECTRIC CORP
    • SHINOHARA HIROSHIKISHI YOSHIYUKI
    • H01L21/3205H01L23/52
    • PURPOSE:To increase resistance to electromigration, to make wiring region small and to realize a high integration by a method wherein a semiconductor integrated circuit is provided with a plurality of metal wirings layers and a plurality of wiring lines and the metal wiring are piled up in parallel on the same wiring lines over a plurality of layers and connected to each other via through-holes. CONSTITUTION:Al metal wiring such as power-supply lines 7a, 8a, signal conductors 7b, 8b, grounding conductors 7c, 8c, and the like are piled up in parallel on the same wirings lines over two layers in a semiconductor integrated circuit substrate which is provided with a plurality of metal wiring layers and a plurality of wiring lines; they are connected to each other via through-holes 6. Widths of the Al wirings 7a, 7b, 7c, 8a, 8b, 8c are narrow as compared with those of conventional metal wirings. The widths of the metal wirings are not made wider but are composed of a plurality of layers. Thereby, an electric current is distributed and a current density is suppressed. Since the widths of the wirings are narrow, the area of the semiconductor integrated circuit becomes small, compared with that of conventional circuits.