专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPS56134430A ELECTRODE FOR VACUUM BREAKER 失效
公开(公告)号：JPS56134430A
公开(公告)日：1981-10-21
申请号：JP3702180
申请日：1980-03-24
申请人： MEIDENSHA ELECTRIC MFG CO LTD , ZEMUBATSUKU KK
发明人： YANAGISAWA HIFUMI , SAKUMA SHINZOU , KASHIMOTO YUTAKA , KOBARI YUKIO , ISHIZUKA SEIJI , KAWAGUCHI HIDEMI
IPC分类号： H01H33/66

2. 发明专利

JPS55155264A METHOD OF DETECTING DETERIORATION OF VACCUM VALVE TYPE CIRCUIT BREAKER 失效
公开(公告)号：JPS55155264A
公开(公告)日：1980-12-03
申请号：JP6359379
申请日：1979-05-23
申请人： MEIDENSHA ELECTRIC MFG CO LTD , ZEMUBATSUKU KK
发明人： HIMI HITOSHI , YANAGISAWA HIFUMI , KOBARI YUKIO
IPC分类号： G01R31/327 , G01R31/333
摘要： PURPOSE:To easily detect the detrioration of a vacuum valve type circuit breaker through a simple construction, by optically detecting the degree of contamination of the inside surface of the insulating glass cylinder of a vacuum vessel due to the deposition of metal particles. CONSTITUTION:Flux of light emitted from a light source 11 permeates the insulating glass cylinder 5 of a vacuum valve circuit breaker and is reflected by a main shield 8. The reflected flux of light permeates the insulating cylinder 5 again and is received by a photosensitive element 12. The detection output of the element 12 is compared with a reference value to determine the degree of contamination of the inside surface of the insulating cylinder 5 due to the deposition of metal particles corresponding to the deterioration of the vacuum valve circuit breaker. The deterioration can thus be easily detected through a simple construction.

3. 发明专利

JPS56167222A VACUUM BREAKER 失效
公开(公告)号：JPS56167222A
公开(公告)日：1981-12-22
申请号：JP7103180
申请日：1980-05-28
申请人： MEIDENSHA ELECTRIC MFG CO LTD , ZEMUBATSUKU KK
发明人： MIYAGAWA HIROSHI , SAKUMA SHINZOU , KOBARI YUKIO
IPC分类号： H01H33/66

4. 发明专利

JPS56102025A VACUUM BREAKER 失效
公开(公告)号：JPS56102025A
公开(公告)日：1981-08-15
申请号：JP428580
申请日：1980-01-17
申请人： MEIDENSHA ELECTRIC MFG CO LTD , ZEMUBATSUKU KK
发明人： NODA TAIJI , WARABI JIYUNICHI , KOBARI YUKIO
IPC分类号： H01H33/66

5. 发明专利

JPS55143729A VACUUM BREAKER 失效
公开(公告)号：JPS55143729A
公开(公告)日：1980-11-10
申请号：JP5053379
申请日：1979-04-24
申请人： MEIDENSHA ELECTRIC MFG CO LTD , ZEMUBATSUKU KK
发明人： NODA TAIJI , KOBARI YUKIO , ISHIZUKA SEIJI , KAWAGUCHI HIDEMI
IPC分类号： H01H33/66

6. 发明专利

JPS55141022A VACUUM BREAKER 失效
公开(公告)号：JPS55141022A
公开(公告)日：1980-11-04
申请号：JP4858279
申请日：1979-04-19
申请人： MEIDENSHA ELECTRIC MFG CO LTD , ZEMUBATSUKU KK
发明人： NODA TAIJI , KOBARI YUKIO , ISHIZUKA SEIJI , KAWAGUCHI HIDEMI
IPC分类号： H01H33/66

7. 发明专利

JPH0113620B2 失效
公开(公告)号：JPH0113620B2
公开(公告)日：1989-03-07
申请号：JP9036780
申请日：1980-07-01
申请人： MEIDENSHA ELECTRIC MFG CO LTD
发明人： KASHIWAGI YOSHUKI , KASHIMOTO YUTAKA , SAKUMA SHINZO , WARABI JUNICHI , KOBARI YUKIO , KAWAGUCHI HIDEMI
IPC分类号： H01H33/66 , H01H33/662

8. 发明专利

JPS5717139A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5717139A
公开(公告)日：1982-01-28
申请号：JP9156880
申请日：1980-07-04
申请人： MEIDENSHA ELECTRIC MFG CO LTD
发明人： KOBARI YUKIO , KAWAGUCHI HIDEMI
IPC分类号： H01L21/52 , H01L21/58 , H01L23/04
摘要： PURPOSE:To reduce the hermetically fixed section of the subject semiconductor device by a method wherein an airtight fixing is performed using a material which will be softened by the high temperature heat load generated when soldering and a plastic deformation can be performed easily in the cooling process after soldering irrespective of a thermal expansion coefficient for ceramic. CONSTITUTION:A mounting section 35, having a concaved section 34, is formed on the side of the outer circumferential end of a current applying material 3, the mounting section 35 and the lower end of an insulated cylinder 1 are soldered, a sealing member 21 having L-shaped section is soldered on the upper section of said insulated cylinder and the sealing member 21 is fixed to the current applying material 4 through the intermediary of an auxiliary member 42. Thus, the airtight container is formed with the insulated cylinder 1, a pair of current applying materials 3 and 4, the covering fitting 21 and the auxiliary member, the movement of a semiconductor element 5 between current applying materials 3 and 4 is controlled by a retaining member 61 and the deaeration from and gas filling into the lead pipe provided in the insulated cylinder are performed and the above is sealed, thereby enabling to obtain a semiconductor having an excellent thermal and electrical characteristics with the least area of fixing section.

9. 发明专利

JPS6041462B2 失效
公开(公告)号：JPS6041462B2
公开(公告)日：1985-09-17
申请号：JP9789880
申请日：1980-07-17
申请人： MEIDENSHA ELECTRIC MFG CO LTD
发明人： KOBARI YUKIO , KAWAGUCHI HIDEMI
IPC分类号： H01L23/04 , H01L23/051

10. 发明专利

JPS5723249A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：JPS5723249A
公开(公告)日：1982-02-06
申请号：JP9789780
申请日：1980-07-17
申请人： Meidensha Electric Mfg Co Ltd
发明人： KOBARI YUKIO , KAWAGUCHI HIDEMI
IPC分类号： H01L23/04 , H01L23/051 , H01L23/48
CPC分类号： H01L23/051 , H01L24/01 , H01L2924/0002 , H01L2924/00
摘要： PURPOSE:To facilitate assembly of a package for high power elements with low cost, by a method wherein a conductor is attached to each of the outer ends of two insulating tubes to whose inner ends plastically deformable sealing fittments have been brazed, and the sealing fittments are made to hermetically seal, with an element placed between said conductors. CONSTITUTION:A conductor 3 and a lead tube 62 made of e.g., copper and a sealing fittment 21 of copper or iron are brazed to one insulating tube 11 of, for instance, ceramics at a high temperature, and are cooled gradually. Similarly, a sealing fittment 22 and a conductor 4 are brazed to the other insulating tube 12 and are cooled gradually. An element 51 is mounted and fixed on a conductor 3 through an auxiliary member 52 made of, for instance, tungsten after positioning with an insulative holding member 61. An electrode (e.g., gate) terminal is connected to a lead tube 62 if necessary. Next, the fittments 21 and 22 are made to seal hermetically by pinching off or the like. The lead tube 62 is sealed for airtight assembly after introducing nitrogen gas from the lead tube 62. Thus, a hermetic package with easy assembly can be made without expensive material.
摘要翻译：目的：为了便于以低成本组装大功率元件的封装，通过一种方法，其中导体连接到两个绝缘管的每个外端，其内部可塑性可变形的密封配件已钎焊，并且密封配件被制成密封，放置在所述导体之间的元件。构成：由例如铜制的导体3和引线管62以及铜或铁的密封装置21在高温下钎焊到例如陶瓷的一个绝缘管11上，并逐渐冷却。类似地，密封配件22和导体4钎焊到另一个绝缘管12上并逐渐冷却。元件51在通过绝缘保持构件61定位之后，通过例如钨制成的辅助构件52安装并固定在导体3上。如果需要，电极（例如，栅极）端子连接到引线管62。接下来，使配件21和22通过夹紧等密封密封。在从导管62引入氮气之后，引线管62被密封用于气密组装。因此，可以在没有昂贵的材料的情况下制造易于组装的密封包装。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式