会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明专利
    • SOLID-STATE IMAGE PICKUP DEVICE AND MANUFACTURE THEREOF
    • JPS60140753A
    • 1985-07-25
    • JP25062683
    • 1983-12-27
    • MATSUSHITA ELECTRIC IND CO LTD
    • YONEDA TADANAKAISHIKAWA OONORIYOSHINO MASARU
    • H01L27/146H01L27/148H04N5/335H04N5/359H04N5/365H04N5/369H04N5/372
    • PURPOSE:To obtain a device, in which a blooming and a smear are not generated, by depleting a region just under a photodiode region by applying bias voltage and flowing out only excess charges in photoelectric conversion signal charges in the region just under the photodiode region in the direction of a semiconductor substrate in a solid- state image pickup device having a second conduction type region as a charge tansfer region for a CCD and a first conduction type region as the photodiode region on the semiconductor substrate. CONSTITUTION:A P type layer 34 is formed on an N type semiconductor substrate 30, mutually isolated P type regions 35 are diffused and shaped to the layer 34, and an N type layer 36 is grown on the whole surface containing the regions 35 in an epitaxial manner. The layer 36 is formed to an insular shape by thick field oxide films 41 using P type channel stop regions 42 as underlays, an N type region 37 as a charge transfer region for a CCD and an N type region 44 as a photodiode region are shaped to the insular layer 36, and these regions 37 and 44 are connected by a lead region 38 for transferring sigal charges. The whole surface is coated with a gate oxide film 39 and an opening is bored, an Mo electrode 45 is formed in the region 44 while being surrounded by a PSG film 43, and a gate electrode 40 is applied on the region 37 through the film 39 and coated similarly with the film 43.
    • 3. 发明专利
    • Solid state image pickup device
    • 固态图像拾取器件
    • JPS5732183A
    • 1982-02-20
    • JP10746580
    • 1980-08-04
    • Matsushita Electric Ind Co Ltd
    • YOSHINO MASARU
    • H01L27/146H04N5/335H04N5/341H04N5/361H04N5/369H04N5/3728
    • H01L27/14665
    • PURPOSE:To prevent deterioration of dark-current characteristic of a photoconductor film by bringing the 1st conductive electrode into ohmic contact with the reverse side of the photoconductor film, and by further bringing the 2nd conductive electrode into ohmic contact with the 1st conductive electrode and a photoelectric converting cell. CONSTITUTION:Here, a photoelectric converting cell 2 and a photoconductor film 10 are not coupled together electrically and directly by a conductive electrode 9'. Namely, after a contact hole C2' is made over the photoelectric converting cell 2, a conductive electrode 12 is formed and after a contact hole C2' is made, a conductive electrode 9' is formed across a melt-flow layer 8 of low-fusion-point glass. Then, a conductive electrode 12 for electric coupling between the conductive electrode 9' and photoelectric converting cell 2 is formed while just filling a surface step part formed between gate electrodes 5 and 5' for the application of a driving clock.
    • 目的:通过使第一导电电极与光电导体膜的反面欧姆接触,并且进一步使第二导电电极与第一导电电极欧姆接触,防止光电导体膜的暗电流特性的劣化,以及 光电转换电池 构成:这里,光电转换单元2和感光体膜10不通过导电电极9'电连接并直接耦合在一起。 也就是说,在光电转换单元2上形成接触孔C2'之后,形成导电电极12,并且在形成接触孔C2'之后,在低通滤波器2的熔体流动层8上形成导电电极9' 熔点玻璃。 然后,形成用于导电电极9'和光电转换单元2之间的电耦合的导电电极12,同时仅填充形成在栅电极5和5'之间的表面台阶部分,以用于驱动时钟。
    • 4. 发明专利
    • FINE WORKING METHOD
    • JPS5577139A
    • 1980-06-10
    • JP15151378
    • 1978-12-06
    • MATSUSHITA ELECTRIC IND CO LTD
    • YOSHINO MASARUYONEDA TADANAKA
    • H01L21/66H01L21/306
    • PURPOSE:To imorove the yield of the semiconductor device by mending pattern deficiency before etching obtaining proper information thereon when the film provided on a semiconductor substrate is etched to yield a fine pattern. CONSTITUTION:A Si3N4 film 2 applied on a Si substrate 1 is etched to yield a fine pattern. A conductive material 3 such as Al is provided entirely thereon and a resist film 4 having a given pattern is formed thereon as mask. Then, under the mask, the Al material 3 undergoes an etching by a mixing liquid of phosphric acid, nitric acid and acetic acid at 60 deg.C and the film 4 is removed. Thereafter, a common electorde 6 and a separate needle-shaped electrode 7 are brought into contact with the material split and the electric resistance is measured with an oscilloscope on the film 2 positioned between the materials. In this process, when an abnormal resistance value is indicated due to the shortcircuiting of the material, a mask of the resist film 4 is arranged again and the shortcircuited part is removed by an etching. In this manner, the etching of the film 2 is performed after the split material is restored to the normal shape.