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1. 发明专利

JP2008066752A Method of supplying component and component mounting system 审中-公开
标题翻译：供应组件和组件安装系统的方法
公开(公告)号：JP2008066752A
公开(公告)日：2008-03-21
申请号：JP2007302183
申请日：2007-11-21
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YABUKI KOICHI , MORITA KEITA , OKUMURA KAZUMASA , FUJIWARA MUNEYOSHI
IPC分类号： H05K13/02
摘要： PROBLEM TO BE SOLVED: To accurately perform lot management of mounting components on a circuit board without deteriorating an operating rate of component mounting. SOLUTION: With a method of supplying components, a plurality of component supplying devices 3 having a taping component 15 in which electronic components 12 are stored longitudinally in a row are arranged at a component supplying part 2. When electronic components 12 are successively supplied from each taping component 15 of each component supplying device 3, each component supplying device 3 supplements components by connecting an end part of the taping component 15 which is in the course of supplying components with a leader of the taping component 15. After electronic components 12 are supplied from the taping component 15 in use, a component switching timing is detected which is a switching time when electronic components 12 are supplied from taping components 15 for supplement. After that, each electronic component 12 mounted on a circuit board 11 performs lot management of each electronic component 12 mounted on the circuit board 11 by the unit of taping components 15 according to corresponding information that from which taping components 15 it is supplied as component supplying from taping components 15 for supplement. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：在电路板上精确地进行安装部件的批量管理，而不会降低部件安装的工作速度。解决方案：通过提供部件的方法，在部件供应部分2处布置有多个具有电子部件12纵向存储的带状部件15的部件供应装置3。当电子部件12连续每个部件供应装置3的每个胶带部件15提供的每个部件供应装置3通过连接在供给部件的过程中的胶带部件15的端部与带部件15的引导件来连接部件。在电子部件 12由使用中的胶带组件15提供，检测到组件切换定时，该组件切换定时是电子组件12从用于补充的胶带组件15供应的切换时间。之后，安装在电路板11上的每个电子部件12根据作为部件供给的带状部件15的相应信息，通过带部件15单元，对安装在电路基板11上的各电子部件12执行批量管理从胶带组件15补充。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JPH10256692A METHOD FOR FORMING FILM-FORM RESISTANCE PORTION, AND METHOD AND APPARATUS FOR MANUFACTURING FILM-FORM RESISTOR 失效
公开(公告)号：JPH10256692A
公开(公告)日：1998-09-25
申请号：JP5745097
申请日：1997-03-12
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MORITA KEITA , YAMAGUCHI KAZUYOSHI , YAMAUCHI MASARU , NAKAO YOSHIFUMI
IPC分类号： H05K1/16
摘要： PROBLEM TO BE SOLVED: To trim a film-form resistor so as to obtain a high adjusting accuracy in a circuit characteristic, by opposing to each other on a board a pair of electrode portions with their respective connected wiring portions, and by forming a film-form resistance portion contacted with the pair of electrode portions and at least one of the wiring portions. SOLUTION: On a ceramic board 102 made of an electrically insulating material, a pair of electrode portions 21, 21' are provided to connect electrically wiring portion 22, 22' with the respective electrode portions 21, 21'. Then, as a film-form resistance portion 103, coating by a printing method the region contacted with the respective electrode portions 21, 21' and at least one of the wiring portions 22, 22' with a resistance paste having ruthenium oxide, etc., as its main component, both an inter electrode region 104 including the pair of electrode portions 21, 21' and finely varying regions 105, 105' other than the region 104 are formed respectively. Trimming a film-form resistor 101 by a laser beam to obtain its desired resistance value, slots 106, 107 are formed. As a result, the resistance value of the film-form resistor 101 can be adjusted finely.

3. 发明专利

JP2008252131A Component-mounting machine and method of controlling the same 有权
标题翻译：组件安装机及其控制方法
公开(公告)号：JP2008252131A
公开(公告)日：2008-10-16
申请号：JP2008178435
申请日：2008-07-08
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MORITA KEITA
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a method of controlling a component-mounting machine for making the user efficiently perform maintenance work for the component-mounting machine. SOLUTION: A method of controlling a component-mounting machine having a movable part for mounting components onto a substrate includes a determination step (S1) of determining which side of the component-mounting machine the user is located who gives instructions to the component mounting machine and a position control step (S2), to make the movable part move to a position where maintenance work for the component-mounting machine is possible from the side where it is determined that the user exists, according to a determination result in the determination step. For this purpose, in the position control step (S2), control information is stored in which information, showing the side where the user exists and information that shows the object position to which the movable part should move are to be associated. Based on the determined side where the user exists in the determination step (S1) and control information, the movable part is moved to the object position specified from the control information. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种控制组件安装机的方法，以使用户有效地执行组件安装机的维护工作。解决方案：一种用于控制具有用于将部件安装到基板上的可移动部件的部件安装机器的方法包括：确定步骤（S1），确定用户所在的部件安装机器的哪一侧给出指令部件安装机和位置控制步骤（S2），使得可动部件从确定用户存在的一侧移动到可以进行部件安装机的维护工作的位置，根据确定结果确定步骤。为此，在位置控制步骤（S2）中，控制信息被存储在表示用户所在一侧的信息和可移动部件应该移动的对象位置的信息相关联的信息。基于确定步骤（S1）中的用户存在的确定侧和控制信息，可移动部分被移动到从控制信息指定的对象位置。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2007188994A Packaging device and packaging method of electronic part 有权
标题翻译：电子部件的包装装置和包装方法
公开(公告)号：JP2007188994A
公开(公告)日：2007-07-26
申请号：JP2006004492
申请日：2006-01-12
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MORITA KEITA , YAGI SHUZO , NAGAYA TOSHIHIKO
IPC分类号： H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a packaging device and packaging method of electronic parts, wherein a positional misalignment of electronic parts caused by an offset or the like of a nozzle center is efficiently and economically recognized to ensure the packaging quality. SOLUTION: The packaging device of electronic parts corrects a position and/or attitude of electronic parts stuck by suction to a nozzle attached in a liftable and rotatable manner to a transfer head movable horizontally, and packages the electronic parts at a packaging position on a board. The packaging device comprises a first recognizing means for recognizing electronic parts stuck to the nozzle, a first calculating means for calculating an offset between the position and attitude of the electronic parts stuck to the nozzle recognized by the first recognizing means and a predetermined reference position and reference attitude, a first correcting means for correcting the position and attitude of the electronic parts stuck to the nozzle based on the offset calculated by the first calculating means, a second recognizing means for recognizing the electronic parts stuck to the nozzle corrected by the first correcting means, a second calculating means for calculating an offset between the position and the reference position of the electronic parts stuck to the nozzle recognized by the second recognizing means, and a second correcting means for correcting the position of the electronic parts stuck to the nozzle based on the offset calculated by the second calculating means. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种电子部件的包装装置和包装方法，其中，由喷嘴中心的偏移等引起的电子部件的位置偏移被有效且经济地识别以确保包装质量。解决方案：电子部件的包装装置将吸附卡住的电子部件的位置和/或姿态校正到以可升降和可旋转的方式附接到可水平移动的传送头的喷嘴，并将电子部件封装在包装位置在董事会上。该包装装置包括用于识别卡在喷嘴上的电子部件的第一识别装置，用于计算粘贴到由第一识别装置识别的喷嘴的电子部件的位置和姿势与预定基准位置之间的偏移量的第一计算装置，以及基准姿态，第一校正装置，用于基于由第一计算装置计算的偏移来校正粘附到喷嘴的电子部件的位置和姿态;第二识别装置，用于识别粘附到由喷嘴校正的喷嘴的电子部件，用于计算粘贴到由第二识别装置识别的喷嘴的电子部件的位置和基准位置之间的偏移量的第二计算装置和用于校正粘附到喷嘴的电子部件的位置的第二校正装置在由第二计算装置计算的偏移上。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2003218586A COMPONENT SUPPLY METHOD AND COMPONENT MOUNTING APPARATUS 审中-公开
公开(公告)号：JP2003218586A
公开(公告)日：2003-07-31
申请号：JP2002015111
申请日：2002-01-24
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YABUKI KOICHI , MORITA KEITA , OKUMURA KAZUMASA , FUJIWARA MUNEYOSHI
IPC分类号： H05K13/02
摘要： PROBLEM TO BE SOLVED: To provide a component supply method for accurately carrying out the production lot control of electronic components mounted onto a circuit board without deteriorating the operating efficiency in component mounting, and to provide a component mounting apparatus by embodying and applying the component supply method. SOLUTION: A component supplying apparatus 3 has a component accommodation section 4 where a plurality of electronic components are accommodated. When a plurality of component supplying apparatus 3 are arranged at a component supply section 2, and a desired electronic component is successively supplied from the component accommodation section 4 of each component supplying apparatus 3, component change timing when the component accommodation section 4 that is being used for supplying components is changed to another accommodation section 4 is detected and stored for each component supplying apparatus 3, and the component change timing is controlled for each component supply apparatus 3. COPYRIGHT: (C)2003,JPO

6. 发明专利

JPH11238644A TRIMMING METHOD AND DEVICE 失效
公开(公告)号：JPH11238644A
公开(公告)日：1999-08-31
申请号：JP3786398
申请日：1998-02-20
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MORITA KEITA , KAJIWARA SHOICHI , YAMAGUCHI KAZUYOSHI
IPC分类号： H01G4/255 , H01C17/22 , H01G13/00 , H01L21/822 , H01L27/04
摘要： PROBLEM TO BE SOLVED: To quickly and highly accurately trim a part to be trimmed, while measuring the characteristics of a trimming component or a circuit board packaging the trimming component. SOLUTION: This trimming method for trimming a part 1 to be trimmed by a laser beam trims the part 1 by the use of a laser beam set up to a beam diameter H1, when a difference between a measured value obtained during the execution of trimming and an objective value is large, and when the difference between the measured value and the objective value becomes small during the execution of trimming, changes the beam dimater of a laser beam to a beam diameter H2 which is smaller than the beam diameter H1 during the execution of trimming to trim the part 1.

7. 发明专利

JP2008198927A Apparatus and method for mounting component 有权
标题翻译：装置和方法安装组件
公开(公告)号：JP2008198927A
公开(公告)日：2008-08-28
申请号：JP2007034817
申请日：2007-02-15
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MORITA KEITA
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a component mounting apparatus and a component mounting method for improving an area productivity. SOLUTION: A first component 3 picked up from a first storage section 4 is conveyed to a transfer section 7 (an arrow (d)), is conveyed to a second storage section 6 after a solvent is transferred to the first component 3 (an arrow (e)), and is mounted onto a compact substrate 10 stored in a tray 6a. When mounting the first component 3 is completed to the entire compact substrates 10 stored in a tray 6a at the top stage of the second storage section 6, a tray 6b at a lower stage is conveyed to the top stage, and mounting the first component 3 is continued to the compact substrates 10 stored in the tray 6b. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于提高面积生产率的部件安装装置和部件安装方法。解决方案：从第一存储部分4拾取的第一部件3被传送到转印部分7（箭头（d）），在溶剂转移到第一部件3之后被传送到第二存储部分6 （箭头（e）），并且安装在存储在托盘6a中的紧凑基板10上。当将第一部件3安装到存储在第二存储部分6的顶部的托盘6a中的整个紧凑基板10时，下层的托盘6b被传送到顶部，并且安装第一部件3 继续到存储在托盘6b中的紧凑基板10。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2004295336A Parts library management system and its method 审中-公开
公开(公告)号：JP2004295336A
公开(公告)日：2004-10-21
申请号：JP2003085083
申请日：2003-03-26
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YOKOMORI TADASHI , MORITA NAOKI , KANEMATSU KOICHI , FURUYA YOSHIO , MORITA KEITA , FUJIWARA HIROAKI
IPC分类号： G05B19/418
CPC分类号： Y02P90/04 , Y02P90/12 , Y02P90/14 , Y02P90/18
摘要： PROBLEM TO BE SOLVED: To provide a parts library management system and method for shortening the lead time of trial production and mass production starting by providing a server for executing the unitary management of the parts information of each mounted unit. SOLUTION: This parts library managing system is constituted of a plurality of local computers and a database in which parts information connected to the local computers is stored wherein the local computers are connected to a host computer. Based on the parts information requested from one of the plurality of local computers, the host computer retrieves data associated with the parts information with respect to the other computers different from one computer, and notifies the retrieval result to one computer. COPYRIGHT: (C)2005,JPO&NCIPI

9. 发明专利

JP2004111424A Apparatus and method for mounting component 有权
公开(公告)号：JP2004111424A
公开(公告)日：2004-04-08
申请号：JP2002267984
申请日：2002-09-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MORITA KEITA , MAKINO YOICHI , MORIMOTO MASAHIRO , YAGI SHUZO , INABA YUZURU
IPC分类号： G01B11/00 , H05K3/34 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To inspect propriety of coating of solder on a substrate while tact balance between a solder coating unit and a component mounting unit is maintained in an apparatus for mounting the component. SOLUTION: The apparatus 5 for mounting the component includes a solder coating unit 13 for coating solder 2 at a plurality of positions on a flexible printed circuit board 1 positioned at a first predetermined position of a substrate conveying path 12, and a component mounting unit 14 for mounting a chip component 3. An inspecting unit 31A of the mounting unit 13 inspects the propriety of coating the board 1 with the solder 2 by the unit 13 based on an image of the solder 2 imaged by a substrate recognition camera 37 of the head 34. COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2000288753A METHOD AND DEVICE FOR LASER BEAM TRIMMING 失效
公开(公告)号：JP2000288753A
公开(公告)日：2000-10-17
申请号：JP9752199
申请日：1999-04-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAMAGUCHI KAZUYOSHI , MORITA KEITA
IPC分类号： B23K26/361 , B23K26/00 , B23K26/03 , B23K26/06 , B23K26/066 , B23K26/073 , B23K26/351 , B23K101/40 , G02B21/36 , H01S3/00 , B23K26/02
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for laser beam trimming capable of conducting laser beam trimming in a high precision and at a high speed. SOLUTION: A trimming laser beam, which passes an opening part 1031 and makes incident to an objective lens 104, is moved by moving a mask part 103 having the opening part 1031, a working spot is moved over a region to be trimmed. By this constitution, because a moving quantity of the working spot is reduced by a magnification rate of the objective lens, a moving quantity of the mask part 103 can be made larger as compared to the moving quantity of the working spot, positioning of the working spot can be done in a high precision as compared to a conventional way. Further, because a mask part is lighter than an optical system, high speed movement is made possible.

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