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1. 发明专利

JP2000138138A SOLID-STATE ELECTROLYTIC CAPACITOR AND ITS MANUFACTURE 失效
公开(公告)号：JP2000138138A
公开(公告)日：2000-05-16
申请号：JP11764699
申请日：1999-04-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KURANUKI KENJI , KANEKO ISAO , KOJIMA TAKAAKI , YAMASHITA HIDEJI , KOBASHI MIKIO , UEMURA KATSUMI
IPC分类号： H01G9/048 , H01G4/38 , H01G9/00 , H01G9/004 , H01G9/02 , H01G9/025 , H01G9/04 , H01G9/15
摘要： PROBLEM TO BE SOLVED: To provide a large-capacity, low-ESR, solid-state electrolytic capacitor which is chip-shaped so as not to demand a large mounting area, and a method of manufacturing the capacitor. SOLUTION: An element section 3 comprises an anodic oxide film layer as a dielectric, a solid-state electrolytic layer containing a conducting macromolecule, and a cathodic conductor layer which are formed on a metallic electrode. A plurality of flat capacitor elements each having the element section 3 and an anode lead terminal 4 are laminated one upon another. The cathodic conductor layer and the anode lead terminal 4 of each capacitor element are connected to metallic terminal parts 9a and 9b, respectively, to thereby form a laminated capacitor element unit 10. At least two of these units 10, which are arranged side by side, are connected to a common terminal opposed thereto.

2. 发明专利

JP2008262950A Manufacturing method of solid-state electrolytic capacitor, and manufacturing apparatus used therefor 审中-公开
标题翻译：固态电解电容器的制造方法及其制造方法
公开(公告)号：JP2008262950A
公开(公告)日：2008-10-30
申请号：JP2007102434
申请日：2007-04-10
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KOBASHI MIKIO , MARUHASHI YOSHIRO
IPC分类号： H01G9/15 , H01G9/00 , H01G9/012 , H01G9/04 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method capable of obtaining a highly reliable solid-state electrolytic capacitor having a low ESR by reducing connection resistance between an anode terminal and an anode electrode portion of each of stacked capacitor elements.
SOLUTION: The manufacturing method is provided with: a first step of stacking a plurality of capacitor elements 14 each having an anode electrode portion 10 and a cathode electrode portion 11 on a lead frame 21 having an anode electrode 16 and a cathode electrode 15; a second step of connecting each of the anode electrode portions 11 to the cathode terminal 15; a third step of bending the anode terminal 16, covering both side surfaces of each of the stacked capacitor elements 14 and one part of the top surface thereof so as to enclose them, and irradiating a tip portion of the anode terminal 16 with laser, thereby connecting each of the anode terminal portions 10 to the anode terminal 16; and a fourth step of covering the capacitor elements 14, the anode terminal 16 and the cathode terminal 15 with an armoring resin 17 while exposing one parts of the anode terminal 16 and the cathode terminal 15.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种制造方法，其能够通过降低堆叠式电容器元件的阳极端子和阳极电极部分之间的连接电阻来获得具有低ESR的高可靠性固体电解电容器。解决方案：制造方法具有：将具有阳极电极部分10和阴极电极部分11的多个电容器元件14堆叠在具有阳极电极16和阴极电极16的引线框21上的第一步骤 15; 将阳极电极部分11连接到阴极端子15的第二步骤; 将阳极端子16弯曲的第三步骤，覆盖每个堆叠的电容器元件14的两个侧表面及其顶表面的一部分以包围它们，并且用激光照射阳极端子16的末端部分，由此将阳极端子部10中的每一个连接到阳极端子16; 以及第四步骤，在暴露阳极端子16和阴极端子15的一部分的同时用铠装树脂17覆盖电容器元件14，阳极端子16和阴极端子15.版权所有（C）2009， JPO＆INPIT

3. 发明专利

JP2005236171A Solid electrolytic capacitor and manufacturing method thereof 审中-公开
标题翻译：固体电解电容器及其制造方法
公开(公告)号：JP2005236171A
公开(公告)日：2005-09-02
申请号：JP2004045890
申请日：2004-02-23
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KOBASHI MIKIO
IPC分类号： H01G9/048 , H01G9/00 , H01G9/008 , H01G9/012
摘要： PROBLEM TO BE SOLVED: To provide a chip type solid electrolytic capacitor with a large capacity and with no increase in mounting area, and its manufacturing method.
SOLUTION: A flat capacitor element 1 comprises a positive electrode lead-out part 4 and an element 3 where a positive electrode oxide film layer which is a dielectric, a solid electrolyte layer containing a conductive polymer, and a negative electrode conductor layer are sequentially laminated on the surface of a metal electrode body. At least two of them are laminated on both front and rear surfaces of metal element terminal components 8a and 8b and positive electrode lead-out terminal components 9a and 9b abutted for connection with the electrodes. A negative electrode is connected using a conductive adhesive, and the positive electrode lead-out is held by the terminal component 9a and 9b and then electrically connected by laser welding.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有大容量且不增加安装面积的片式固体电解电容器及其制造方法。解决方案：扁平电容器元件1包括正极引出部分4和元件3，其中作为电介质的正极氧化物膜层，含有导电聚合物的固体电解质层和负极导体层依次层压在金属电极体的表面上。它们中的至少两个层压在金属元件端子部件8a和8b的前表面和后表面上，并且正电极引出端子部件9a和9b被抵接以与电极连接。使用导电性粘合剂将负极连接起来，正极引出部由端子部件9a，9b保持，然后通过激光焊接进行电连接。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2000233275A SOLDERING DEVICE 失效
公开(公告)号：JP2000233275A
公开(公告)日：2000-08-29
申请号：JP3240099
申请日：1999-02-10
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KOBASHI MIKIO , SUGIMOTO TAKAHISA , UEMURA KATSUMI , IKEDA KAZUTAKA
IPC分类号： B23K1/00 , B23K3/06 , B23K101/38
摘要： PROBLEM TO BE SOLVED: To provide a soldering device enabling that a soldering quantity is made sufficient and uniform. SOLUTION: The parts of a first and a second transfer rollers 1, 2, which are opposed from the first to the third bands 6, 7, 8 of a hoop material 3, become projecting shapes and the parts opposed to a first and a second parts 9, 10 become recessed shapes. The interval Y of the projecting parts of the first and the second transfer rollers 1, 2 of the parts opposed to the second band 7 of the hoop material 3, is made larger than the interval X of the projecting parts Y of parts opposed to the first and the third bands 6, 8 of the hoop material 3.

5. 发明专利

JP2000223378A AGING APPARATUS 失效
公开(公告)号：JP2000223378A
公开(公告)日：2000-08-11
申请号：JP2584699
申请日：1999-02-03
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KURATANI ETSUJI , KONDO KATSUHIRO , KOBASHI MIKIO
IPC分类号： H01G13/00
摘要： PROBLEM TO BE SOLVED: To correctly decide aging malfunction in the aging apparatus for a capacitor. SOLUTION: An aging apparatus is provided with an application means for applying an aging voltage to a chip-type capacitor 1 via a protective resistor 26 and an inspection means for inspecting an aging voltage applying path to the capacitor 1, the inspection means has an alternating current supplying means for supplying an alternating current via the resistor 26 and the aging voltage applying path to the capacitor 1, a direct current supplying means for supplying a direct current to the connection point of the resistor 26 with the capacitor 1 via a resistor 70, an alternating current detecting means for detecting an AC voltage in both ends of the resistor 26 and a direct current detecting means for detecting a DC voltage in both ends of the resistor 70, and the resistance value of the resistor 70 is set higher than that of the resistor 26.

6. 发明专利

JPH0442599A METHOD FOR ALIGNING SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JPH0442599A
公开(公告)日：1992-02-13
申请号：JP15092490
申请日：1990-06-08
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KOBASHI MIKIO , BESSHO YOSHIO , HARAZONO KOHEI , TAKEDA TORU , KAMIYA SUSUMU
IPC分类号： H05K13/04 , H01L21/50
摘要： PURPOSE:To improve the joining accuracy of a semiconductor element with a substrate and, at the same time, to simplify the facility by recognizing the alignment mark on the semiconductor element and two alignment marks on a substrate by means of one optical system. CONSTITUTION:the position of a substrate 1 is corrected so that the substrate 1 can be brought to a fixed position with an X-Y table 11 and theta table 10 by recognizing an alignment mark 21 on the substrate 1 and calculating the difference of the mark 21 with another alignment mark 20 on the substrate 1. The position of a semiconductor element 2 is corrected so that the element 2 can be brought to a fixed position with an X-Y table 8 and the theta-rotation of a vacuum adsorption nozzle 3. At the time of joining the semiconductor element 2 with the substrate 1, the vacuum adsorption nozzle 3 holding the element 2 by adsorption is lowered to the joining position and the joined state is confirmed with a recognizing camera 13.

7. 发明专利

JP2007214167A Chip type solid electrolytic capacitor 有权
标题翻译：芯片型固体电解电容器
公开(公告)号：JP2007214167A
公开(公告)日：2007-08-23
申请号：JP2006029366
申请日：2006-02-07
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KURANUKI KENJI , TASEI MASATOSHI , KONDO KATSUHIRO , KOBASHI MIKIO , YOSHINO TAKESHI
IPC分类号： H01G9/15 , H01G9/004 , H01G9/04 , H01G9/14
摘要： PROBLEM TO BE SOLVED: To provide a chip type solid electrolytic capacitor to be used for various electronic equipment, which can achieve low ESL (equivalent series resistance) by solving the problem that a long lead-out distance from a capacitor element to a terminal causes high ESL.
SOLUTION: The capacitor includes a capacitor element 1 in which a conductive polymer is used for a solid electrolyte, a positive terminal 9 and a negative terminal 10 each having a top surface connected to the capacitor element 1, and an insulative exterior resin 11 covering the capacitor element 1 while the bottom surfaces of the positive and negative terminals 9 and 10 are each exposed. The positive and negative terminals 9 and 10 are formed of a single sheet of base material, and connection portions of the capacitor element 1 where the positive and negative portions are joined are folded and bent so that the two sheets of material are superimposed. With this configuration, low ESL is achieved and the chip type solid electrolytic capacitor excellent in solderbility and airtightness can be provided.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于各种电子设备的芯片型固体电解电容器，其可以通过解决从电容器元件到长距离的电离元件到长时间的引出距离的问题而能够实现低ESL（等效串联电阻）终端导致高ESL。解决方案：电容器包括电容器元件1，其中导电聚合物用于固体电解质，正端子9和负极端子10，其各自具有连接到电容器元件1的顶表面，以及绝缘外部树脂覆盖电容器元件1，同时露出正极和负极端子9和10的底表面。正极端子9和负极端子10由单片基材形成，并且电容器元件1的正极和负极部分的接合部分的连接部分被折叠并弯曲，从而叠加两片材料。通过这样的结构，能够实现低的ESL，并且可以提供优异的焊接性和气密性的芯片型固体电解电容器。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2001246297A COATING MATERIAL APPLYING DEVICE 失效
公开(公告)号：JP2001246297A
公开(公告)日：2001-09-11
申请号：JP2000064901
申请日：2000-03-09
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KIMURA HIROSHI , KOBASHI MIKIO , KANEKO ISAO , YAMASHITA HIDEJI
IPC分类号： B05C1/02 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide a coating material applying device which improves the spray coating quality without the crowding-out of a coating material from the coating material-applied face of an object to which the material is applied and minimizes the product dimensional failure, and further, upgrades the maintenability of an installation. SOLUTION: This coating material applying device is structured of a coating material tank 1 which has fluted protrusions 2a, 2b, 2c, 4 formed on its inside face and stores the coating material 11, squeezees 6a, 6b, with both ends fabricated like a chevron shape, into which the protrusions 2a, 2b, 2c and the protrusion 4 formed at a coating material transfer block 3 are fitted and which forms the coating material 11 on the protrusions 2a-2c, 4 to a specified shape and an element supply part 18 which presses a capacitor element 12 to the coating material 11 on the protrusion 4. Either of the protrusions 2a, 2b, 2c, 4 moves and the coating material 11 of a specified shape is formed on either of the move protrusions or the protrusion adjacent to such a moved protrusion.

9. 发明专利

JP2000223377A AGING APPARATUS 失效
公开(公告)号：JP2000223377A
公开(公告)日：2000-08-11
申请号：JP2584599
申请日：1999-02-03
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KONDO KATSUHIRO , KURATANI ETSUJI , KOBASHI MIKIO
IPC分类号： H01G13/00
摘要： PROBLEM TO BE SOLVED: To readily confirm the quality of an aging operation related to an aging apparatus. SOLUTION: An aging apparatus is of a constitution, wherein the apparatus is provided with an aging power supply 12, first and second terminals 12a and 12b extracted from this aging power supply 12, capacitors 6a to 6d and 11a to 11d with their each one end side connected with this terminal 12a and a display device 16, and the terminal 12b is connected with the other end sides of the capacitors 6a to 6d, the other end sides of the capacitors 11a to 11d are connected with the other end sides of these capacitors 6a to 6d, and the other end side of the display device 16 is connected with the other end sides of these capacitors 11a to 11d.

10. 发明专利

JPH09205043A AGING SYSTEM FOR CAPACITOR WITH EXPLOSION-PROOF VALVE 失效
公开(公告)号：JPH09205043A
公开(公告)日：1997-08-05
申请号：JP1144796
申请日：1996-01-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KOBASHI MIKIO , YAMASHITA HIDEJI
IPC分类号： H01G9/04 , H01G9/12 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To provide an aging system for a capacitor with an explosion-proof valve in which reliability of connection and holding is enhanced at the time of power supply by suppressing rupture of the explosion-proof valve. SOLUTION: The aging system for a capacitor with an explosion-proof valve comprises a power supply terminal for feeding power to the terminal of the capacitor 106 with the explosion-proof valve being held by means of a plurality of carriers 1, fixed at a constant interval to move while rotating in a heating section 20 formed by a cover 21, such that the terminal of the capacitor 106 is set on the carrier 1 side, a holding jig 101 having an L-shaped stopper lever for pressing the side of the explosion-proof valve housed oppositely to the terminal while energizing from the outside, and a section 9 for feeding power to the power supply terminal. Since the explosion-proof valve is pressed while being energized from the outside, it is prevented from being ruptured thus ensuring reliable power supply and holding.

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